Abstract: Methods of manufacturing a semiconductor chip are provided. The methods may include providing a semiconductor substrate including integrated circuit regions and a cut region. The cut region may be between the integrated circuit regions. The methods may also include forming a modified layer by emitting a laser beam into the semiconductor substrate along the cut region, polishing an inactive surface of the semiconductor substrate to propagate a crack from the modified layer, and separating the integrated circuit regions along the crack. The cut region may include a plurality of multilayer metal patterns on an active surface of the semiconductor substrate, which is opposite to the inactive surface of the semiconductor substrate. The plurality of multilayer metal patterns may form a pyramid structure when viewed in cross section.

Abstract: A sealing device for a pouch-type battery includes an upper sealing block and a lower sealing block. The upper sealing block has a two-stage upper sealing groove, including a first upper step and a second upper step, and the lower sealing block has a two-stage lower sealing groove, including a first lower step and a second lower step. The upper sealing block contacts a first surface of an electrode lead sealing part of the pouch-type battery, and the lower sealing block contacts a second surface of the electrode lead sealing part of the pouch-type battery in a process of performing sealing through heat fusion. A pouch-type battery having an electrode lead sealing part formed by the sealing device is also provided.

Abstract: An organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the organic layer includes a layer having at least one of the compounds having at least one carbazole group, and a flat panel display device including the organic light emitting device. The organic light emitting device has low driving voltage, excellent current density, high brightness, excellent color purity, high efficiency, and long lifetime.

Abstract: The present disclosure relates to a method for preparing a Gynostemma pentaphyllum leaf extract, a Gynostemma pentaphyllum leaf extract prepared by the method, and a composition for improving exercise performance capacity containing the same as an active ingredient. The Gynostemma pentaphyllum leaf extract according to the present disclosure exhibits superior effect of improving exercise performance capacity and enhancing muscle strength, endurance and physical strength. In addition, the Gynostemma pentaphyllum leaf extract according to the present disclosure has the efficacy of increasing AMPK activity, facilitating beta oxidation and facilitating glucose uptake and, thus, has superior effect of reducing body weight and body fat and preventing, alleviating or treating diabetes. Because the composition of the present disclosure is derived from a natural product, it can be used usefully and safely for drugs, foods, etc. without side effects.

Abstract: The present invention relates to a method for producing an enzymatically treated catechin product with increased contents of gallic acid, epicatechin (EC), and epigallocatechin (EGC), an enzymatically treated catechin product produced by way of the method, and use thereof.

Abstract: An inductor includes a body having a first magnetic portion above and below a coil, and a second magnetic portion above and below the first magnetic portion. The magnetic flux density of the magnetic substance in the first magnetic portion is higher than that of the magnetic substance in the second magnetic portion.

Abstract: A preparation method of Gynostemma Pentaphyllus leaves extracts with increased amount of small molecular effective saponin and decreased benzopyrene includes the steps of drying fresh Gynostemma Pentaphyllus leaves after heating, treating the dried Gynostemma Pentaphyllus leaves with steam, adding water of 1 to 100-fold volume to the above Gynostemma Pentaphyllus leaves and then preparing a hot water extract by carrying out a hot water extraction at 100-180 V, 0.5-10 atm for 1-120 hours, adding C1-C4 lower alcohol of 1 to 100-fold volume to the residual remained after the hot water extraction and then preparing an alcohol extract of the residual from the hot water extract by carrying out an alcohol extraction at 50-100° C. for 1-4 hours, and mixing the hot water extract and the alcohol extract, and then filtering and concentrating the mixture.

Abstract: A preparation method of Gynostemma Pentaphyllus leaves extracts with increased amount of small molecular effective saponin and decreased benzopyrene includes the steps of drying fresh Gynostemma Pentaphyllus leaves after heating, treating the dried Gynostemma Pentaphyllus leaves with steam, adding water of 1 to 100-fold volume to the above Gynostemma Pentaphyllus leaves and then preparing a hot water extract by carrying out a hot water extraction at 100-180 V, 0.5-10 atm for 1-120 hours, adding C1-C4 lower alcohol of 1 to 100-fold volume to the residual remained after the hot water extraction and then preparing an alcohol extract of the residual from the hot water extract by carrying out an alcohol extraction at 50-100° C. for 1-4 hours, and mixing the hot water extract and the alcohol extract, and then filtering and concentrating the mixture.

Abstract: An inductor includes a body having a first magnetic portion above and below a coil, and a second magnetic portion above and below the first magnetic portion. The magnetic flux density of the magnetic substance in the first magnetic portion is higher than that of the magnetic substance in the second magnetic portion.

Abstract: A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.

Abstract: A nonvolatile memory device has select gates on a semiconductor substrate and cell gates on the semiconductor substrate between the select gates. Each of the cell gates includes a floating gate pattern on the semiconductor substrate, a tunnel insulating pattern interposed between the floating gate pattern and the semiconductor substrate, a blocking insulating pattern on the floating gate pattern, and a control gate pattern on the blocking insulating pattern. The control gate pattern includes a first control gate pattern, a second control gate pattern on the first control gate pattern, a cell conductive pattern on the second control gate pattern, and a barrier pattern interposed between the first control gate pattern and the second control gate pattern. Each of the select gates may have patterns similar to those of the cell gates.

Abstract: A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.

Abstract: A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.

Abstract: In some aspects of the present disclosure a device is disclosed that includes a processor; a storage unit; a user interface; a transceiver; a device identifying unit arranged to store device identifying data; a memory unit arranged to store machine-executable instructions that when executed by the processor causes a password to be generated, based on the device identifying data, that is arranged to allow the device to access a public wireless local area network (PWLAN).

Abstract: In some aspects of the present disclosure a device is disclosed that includes a processor; a storage unit; a user interface; a transceiver; a device identifying unit arranged to store device identifying data; a memory unit arranged to store machine-executable instructions that when executed by the processor causes a password to be generated, based on the device identifying data, that is arranged to allow the device to access a public wireless local area network (PWLAN).

Abstract: A package on package substrate is disclosed. The package on package substrate in accordance with an embodiment of the present invention can include a bottom package substrate, on which and an electronic element is mounted and of which an upper surface is formed with a bottom pad part and a solder resist part corresponding to the bottom pad part, and a top package substrate, which is stacked on an upper side of the bottom package substrate by interposing a solder between the top package substrate and the bottom package substrate and of which a lower surface is formed with a top pad part corresponding to the bottom pad part. The solder resist part can include a first solder resist layer, which is formed on the upper surface of the bottom package substrate, corresponding to the bottom pad part, and a second solder resist layer, which is formed on the first solder resist layer such that the bottom pad part is exposed.

Abstract: An LED package is disclosed herein. The disclosed LED package comprises a base having an LED chip mounted thereon, an encapsulation member formed by a light-transmittable resin to encapsulate the LED chip, and a housing formed to expose a top portion of the encapsulation member and to encompass a side surface of the encapsulation member, wherein the encapsulation member is formed by a transfer molding process using a mold to have a predetermined shape. Further, the housing may be light-transmittable.

Abstract: The present disclosure relates generally to the field of communications systems, and more particularly, to a system and method for extending secure authentication using unique session keys derived from entropy generated by authentication method. In one example, a method for utilizing a public wireless local area network for a client with a smart card includes: creating an one-time password for a client upon a successful authentication; storing the password and identification information of the client; and utilizing the password and the client identity information to authenticate the client in the public wireless local area network.

Abstract: A package on package substrate is disclosed. The package on package substrate in accordance with an embodiment of the present invention can include a bottom package substrate, on which and an electronic element is mounted and of which an upper surface is formed with a bottom pad part and a solder resist part corresponding to the bottom pad part, and a top package substrate, which is stacked on an upper side of the bottom package substrate by interposing a solder between the top package substrate and the bottom package substrate and of which a lower surface is formed with a top pad part corresponding to the bottom pad part. The solder resist part can include a first solder resist layer, which is formed on the upper surface of the bottom package substrate, corresponding to the bottom pad part, and a second solder resist layer, which is formed on the first solder resist layer such that the bottom pad part is exposed.

Abstract: A printed circuit board is disclosed. The printed circuit board, which may include an insulation layer, a first metal pad formed on the insulation layer, a second metal pad electrically coupled with the first metal pad and having an ionization tendency lower than that of the first metal pad, and a sacrificial electrode electrically coupled with the second metal pad to prevent corrosion in the first metal pad, can be utilized to prevent excessive etching that may otherwise occur due to galvanic corrosion between metal pads of different ionization tendencies.