Patents by Inventor Yoon Man LEE

Yoon Man LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for maintaining security of video data
    Patent number: 11943490
    Abstract: The method comprises registering at least one of an internet protocol (IP) address and a media access control (MAC) address of the security devices, generating a plurality of public key and private key pairs, encrypting and storing private keys comprised in the plurality of public key and private key pairs using a master key provided from a master key management unit, selecting any one of a plurality of public key and private key pairs when the access of the security device is approved and providing a certificate comprising the selected public key to the security device, receiving a symmetric key encrypted with the public key of the certificate from the security device, and decrypting the private key using the master key provided from the master key management unit.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: March 26, 2024
    Assignee: DUDU Information Technologies, Inc.
    Inventors: Young Sun Park, Su Man Nam, Jin Woo Lee, Jun Geol Kim, Yun Seong Kim, Yoon Jeong Kim
  • Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same
    Patent number: 10793711
    Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Yoon Man Lee, Jae Hyun Kim, Tae Shin Eom, Eun Jung Lee, Su Mi Im
  • EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED USING SAME
    Publication number: 20190292363
    Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.
    Type: Application
    Filed: February 15, 2017
    Publication date: September 26, 2019
    Applicant: Samsung SDI Co., Ltd.
    Inventors: Yoon Man LEE, Jae Hyun KIM, Tae Shin EOM, Eun Jung LEE, Su Mi IM
  • Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same
    Patent number: 9896465
    Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: February 20, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Dong Hwan Lee, Min Gyum Kim, So Yoon Kim, Woo Chul Na, Yoon Man Lee, Ji Yoon Cho, Ki Hyeok Kwon, KyoungChul Bae, Eun Jung Lee, Joo Young Chung, Jin Min Cheon, Jin Woo Choi, Seung Han
  • Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by the same
    Patent number: 9735076
    Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated by the epoxy resin composition, the composition including a base resin; a filler; a colorant; and a thermochromic pigment, wherein a color of the thermochromic pigment is irreversibly changed when a temperature thereof exceeds a predetermined temperature.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: August 15, 2017
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Yoon Man Lee, So Yoon Kim
  • PHOSPHONIUM COMPOUND, PREPARATION METHOD THEREOF, EPOXY RESIN COMPOSITION INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE PREPARED BY USING THE SAME
    Publication number: 20160368937
    Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
    Type: Application
    Filed: June 22, 2016
    Publication date: December 22, 2016
    Inventors: Dong Hwan LEE, Min Gyum KIM, So Yoon KIM, Woo Chul NA, Yoon Man LEE, Ji Yoon CHO, Ki Hyeok KWON, KyoungChul BAE, Eun Jung LEE, Joo Young CHUNG, Jin Min CHEON, Jin Woo CHOI, Seung HAN
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED BY THE SAME
    Publication number: 20160351461
    Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated by the epoxy resin composition, the composition including a base resin; a filler; a colorant; and a thermochromic pigment, wherein a color of the thermochromic pigment is irreversibly changed when a temperature thereof exceeds a predetermined temperature.
    Type: Application
    Filed: May 24, 2016
    Publication date: December 1, 2016
    Inventors: Yoon Man LEE, So Yoon KIM