Patents by Inventor Yoonsik YI

Yoonsik YI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Humidity sensor and button device including the same
    Patent number: 11828718
    Abstract: Provided is a button device including a humidity sensor. The button device includes a substrate having a plurality of sensing regions, a housing on the substrate, the housing separating a first sensing region of the plurality of sensing regions from other sensing regions, a porous structure within the housing, the porous structure having through-holes, a first electrode on the porous structure, a second electrode on the porous structure, the second electrode being electrically connected to the first electrode through the porous structure, and a temperature sensor disposed adjacent to the first sensing region to sense a temperature of the first sensing region, The porous structure includes a body having an outer surface defining the through-holes, the body having an air gap therein.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: November 28, 2023
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Choon Gi Choi, Mondal Shuvra, Bok Ki Min, Yoonsik Yi
  • Anti-radiation structure, temperature-pressure complex sensor including the same and having anti-radiation property, and manufacturing method thereof
    Patent number: 11382244
    Abstract: Provided is a temperature-pressure complex sensor with an anti-radiation property including a first sensing material which is a porous conductive film, and second sensing materials which are dispersedly disposed on a surface of the first sensing material. The second sensing materials may include a conductive structure having a two-dimensional crystal structure, and nanoparticles having a radiation shielding property which are disposed between crystal layers of the conductive structure.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: July 5, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seong Jun Kim, Choon Gi Choi, Tam Van Nguyen, Bok Ki Min, Shuvra Mondal, Yoonsik Yi
  • HUMIDITY SENSOR AND BUTTON DEVICE INCLUDING THE SAME
    Publication number: 20210349045
    Abstract: Provided is a button device including a humidity sensor. The button device includes a substrate having a plurality of sensing regions, a housing on the substrate, the housing separating a first sensing region of the plurality of sensing regions from other sensing regions, a porous structure within the housing, the porous structure having through-holes, a first electrode on the porous structure, a second electrode on the porous structure, the second electrode being electrically connected to the first electrode through the porous structure, and a temperature sensor disposed adjacent to the first sensing region to sense a temperature of the first sensing region, The porous structure includes a body having an outer surface defining the through-holes, the body having an air gap therein.
    Type: Application
    Filed: May 6, 2021
    Publication date: November 11, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Choon Gi CHOI, Mondal SHUVRA, Bok Ki MIN, Yoonsik YI
  • ANTI-RADIATION STRUCTURE, TEMPERATURE-PRESSURE COMPLEX SENSOR INCLUDING THE SAME AND HAVING ANTI-RADIATION PROPERTY, AND MANUFACTURING METHOD THEREOF
    Publication number: 20200170149
    Abstract: Provided is a temperature-pressure complex sensor with an anti-radiation property including a first sensing material which is a porous conductive film, and second sensing materials which are dispersedly disposed on a surface of the first sensing material. The second sensing materials may include a conductive structure having a two-dimensional crystal structure, and nanoparticles having a radiation shielding property which are disposed between crystal layers of the conductive structure.
    Type: Application
    Filed: September 10, 2019
    Publication date: May 28, 2020
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Seong Jun KIM, Choon Gi CHOI, Tam Van Nguyen, Bok Ki MIN, Shuvra MONDAL, Yoonsik YI