Abstract: A cassette which receives a substrate, and a substrate receiving system including a chamber which receives a cassette in which a substrate is loaded are provided. The cassette which receives a substrate includes: a plurality of slot supports stacked in a first direction; and a frame connected to the plurality of slot supports and extending in the first direction, wherein the plurality of slot supports and the frame are opened in an outward direction to receive the substrate, and are closed in an inward direction after the substrate is received.

Abstract: A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.

Abstract: An electronic device included in at least one area inside a vehicle includes a display that has at least one area including a flexible characteristic, a memory that stores at least one application program, an actuator module that supports shape deformation of the at least one area of the display, and a processor that is electrically connected to the display, the memory, and the actuator module. The processor determines a position of at least one user in the vehicle and performs control to deform the at least one area of the display in a direction corresponding to the position of the user, when a specified requirement is satisfied with regard to the shape deformation of the at least one area of the display. Besides, it may be permissible to prepare various other embodiments speculated through the specification.

Abstract: A cassette which receives a substrate, and a substrate receiving system including a chamber which receives a cassette in which a substrate is loaded are provided. The cassette which receives a substrate includes: a plurality of slot supports stacked in a first direction; and a frame connected to the plurality of slot supports and extending in the first direction, wherein the plurality of slot supports and the frame are opened in an outward direction to receive the substrate, and are closed in an inward direction after the substrate is received.

Abstract: A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.

Abstract: According to an embodiment, a smart control device includes an input device; a communication circuit; a connection circuit configured to be electrically connected to another control device; a processor; and a memory. Wherein the memory stores one or more instructions that, when executed, cause the processor to when the control device is not connected with the another control device through the connection circuit, transmit a message associated with a request for execution of a first function to the external device through the communication circuit when receiving an input signal based on the input device; and in when control device is connected with the another control device through the connection circuit, transmit a message associated with a request for execution of a second function corresponding to the second state to the external device through the communication circuit when receiving a user input associated with execution of a specified function.

Abstract: According to an embodiment, a smart control device includes an input device; a communication circuit; a connection circuit configured to be electrically connected to another control device; a processor; and a memory. Wherein the memory stores one or more instructions that, when executed, cause the processor to when the control device is not connected with the another control device through the connection circuit, transmit a message associated with a request for execution of a first function to the external device through the communication circuit when receiving an input signal based on the input device; and in when control device is connected with the another control device through the connection circuit, transmit a message associated with a request for execution of a second function corresponding to the second state to the external device through the communication circuit when receiving a user input associated with execution of a specified function.

Abstract: A fan-out semiconductor package includes a semiconductor chip including a body and an electrode pad disposed on the body, a metal layer disposed on the electrode pad of the semiconductor chip, and a interconnection member including an insulating layer disposed on one side of the semiconductor chip, a via hole penetrating through the insulating layer and exposing at least a portion of a surface of the metal layer, a seed layer disposed on the surface of the metal layer exposed by the via hole and a wall of the via hole, and a conductor layer disposed on the seed layer.

Abstract: A fan-out semiconductor package includes a semiconductor chip including a body and an electrode pad disposed on the body, a metal layer disposed on the electrode pad of the semiconductor chip, and a interconnection member including an insulating layer disposed on one side of the semiconductor chip, a via hole penetrating through the insulating layer and exposing at least a portion of a surface of the metal layer, a seed layer disposed on the surface of the metal layer exposed by the via hole and a wall of the via hole, and a conductor layer disposed on the seed layer.

Abstract: A printed circuit board includes an insulating layer; and a circuit pattern formed on the insulating layer. The circuit pattern includes a seed layer and a metal layer formed on the seed layer, and both sides of the seed layer are formed with an etched groove. Also, a method of manufacturing a printed circuit board includes: forming a seed layer on the insulating layer; forming a plating resist formed with an opening on the seed layer; forming a circuit pattern by performing plating processing on the opening; removing the plating resist; forming a passivation layer on the circuit pattern; performing dry etching on a remaining portion other than a side wall of the passivation layer; and performing wet etching the seed layer exposed on a surface by the dry etching.

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Abstract: The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material.

Abstract: Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the copper-clad laminate plate according to one implementation embodiment of the present invention includes: carrier; a peel layer formed on the carrier; a copper-clad layer formed on the peel layer; and a surface-treated layer formed on the copper-clad layer, in which the surface-treated layer includes a thiol-based compound. Therefore, the present invention provides a printed circuit board capable of improving an adhesive force between a base and a copper-clad layer without treating a roughed surface by forming the surface-treated layer on the copper-clad layer.

Abstract: A system and a method for controlling an electrically-powered steering apparatus of a vehicle may include a selection switch adapted to select any of a plurality of steering modes, a control switch adapted to change a current for controlling the steering force, a control portion adapted to determine the current according to a signal received from at least one of the selection switch and the control switch and to transmit a control signal according to the determined current, and a drive portion adapted to control the steering force according to the control signal received from the control portion.