Patents by Inventor Yoonyoung BAE

Yoonyoung BAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical interconnection device and integrated optical device using bulk-silicon substrate
    Patent number: 9915782
    Abstract: An optical interconnection device including: a first element layer formed on a substrate; a second element layer disposed on the first element layer and receiving an optical signal; and a mode converter interposed between the first element layer and the second element layer, and eliminating a difference between an effective refractive index of the first element layer and an effective refractive index of the second element layer and match a mode profile, wherein the first element layer, the mode converter, and the second element layer are sequentially disposed on respective planes spaced apart from each other on the substrate, and one end of the mode converter overlaps a part of the second element layer, and the other end of the mode converter overlaps a part of the first element layer.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: March 13, 2018
    Assignee: KOOKMIN UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Donghwan Ahn, Yoonyoung Bae
  • OPTICAL INTERCONNECTION DEVICE AND INTEGRATED OPTICAL DEVICE USING BULK-SILICON SUBSTRATE
    Publication number: 20180039022
    Abstract: An optical interconnection device including: a first element layer formed on a substrate; a second element layer disposed on the first element layer and receiving an optical signal; and a mode converter interposed between the first element layer and the second element layer, and eliminating a difference between an effective refractive index of the first element layer and an effective refractive index of the second element layer and match a mode profile, wherein the first element layer, the mode converter, and the second element layer are sequentially disposed on respective planes spaced apart from each other on the substrate, and one end of the mode converter overlaps a part of the second element layer, and the other end of the mode converter overlaps a part of the first element layer.
    Type: Application
    Filed: November 18, 2016
    Publication date: February 8, 2018
    Applicant: KOOKMIN UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Donghwan AHN, Yoonyoung BAE