Patents by Inventor Yorito NAGASAKA

Yorito NAGASAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10292312
    Abstract: An electronic apparatus includes: a fan which flows cooling air in a flow passage; a plurality of modules which are arranged in the flow passage, the modules including first and second modules, the first and second modules being aligned with a flow direction of the cooling air; and a support member that supports the first module, and makes a portion of the first module protrude further than the second module in a direction approximately orthogonal to the flow direction.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: May 14, 2019
    Assignee: NEC CORPORATION
    Inventor: Yorito Nagasaka
  • Publication number: 20170273220
    Abstract: An electronic apparatus includes: a fan which flows cooling air in a flow passage; a plurality of modules which are arranged in the flow passage, the modules including first and second modules, the first and second modules being aligned with a flow direction of the cooling air; and a support member that supports the first module, and makes a portion of the first module protrude further than the second module in a direction approximately orthogonal to the flow direction.
    Type: Application
    Filed: March 2, 2017
    Publication date: September 21, 2017
    Applicant: NEC Corporation
    Inventor: Yorito NAGASAKA
  • Patent number: 9629265
    Abstract: A cooling structure is designed for an electronic device including a plurality of fans causing cooling air, a plurality of electronic parts serving as heat sources, and a plurality of power source units, all of which are arranged inside the housing. The electronic parts are positioned in the downstream side of cooling air produced by the fans, while the power source units are positioned in the further downstream side of cooling air compared to the electronic parts. The power source units are spaced out from each other in the perpendicular direction to the cooling airflow direction of cooling air such that the power source units do not overlap with the electronic parts in the cooling airflow direction in plan view. The cooling structure prevents cooling air, which is temporarily warmed by the electronic parts, from directly flowing into the power source units, thus improving a cooling effect.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: April 18, 2017
    Assignee: NEC CORPORATION
    Inventor: Yorito Nagasaka
  • Publication number: 20130231039
    Abstract: A cooling structure is designed for an electronic device including a plurality of fans causing cooling air, a plurality of electronic parts serving as heat sources, and a plurality of power source units, all of which are arranged inside the housing. The electronic parts are positioned in the downstream side of cooling air produced by the fans, while the power source units are positioned in the further downstream side of cooling air compared to the electronic parts. The power source units are spaced out from each other in the perpendicular direction to the cooling airflow direction of cooling air such that the power source units do not overlap with the electronic parts in the cooling airflow direction in plan view. The cooling structure prevents cooling air, which is temporarily warmed by the electronic parts, from directly flowing into the power source units, thus improving a cooling effect.
    Type: Application
    Filed: February 28, 2013
    Publication date: September 5, 2013
    Applicant: NEC CORPORATION
    Inventor: Yorito NAGASAKA