Patents by Inventor York Yuan Chang

York Yuan Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for making copper tungsten and copper molybdenum composite electronic packaging materials
    Patent number: 8048366
    Abstract: From tungsten or molybdenum powders, a tungsten or molybdenum compact is pressurized and molded into the same dimensions as or slightly larger than the end product and sintered into tungsten or molybdenum skeleton. After copper infiltration, chemical copper etching is applied to remove excess surface copper. A machining allowance with an absolute value >0-?0.1 mm may be applied for the machining of uneven surfaces resulting from the chemical process of copper removal.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: November 1, 2011
    Assignee: Torrey Hills Technologies, LLC
    Inventors: Dejun Zhu, Hong Wu, York Yuan Chang, Ken Kuang
  • Process For Making Copper Tungsten And Copper Molybdenum Composite Electronic Packaging Materials
    Publication number: 20100092327
    Abstract: From tungsten or molybdenum powders, a tungsten or molybdenum compact is pressurized and molded into the same dimensions as or slightly larger than the end product and sintered into tungsten or molybdenum skeleton. After copper infiltration, chemical copper etching is applied to remove excess surface copper. A machining allowance with an absolute value >0-?0.1 mm may be applied for the machining of uneven surfaces resulting from the chemical process of copper removal.
    Type: Application
    Filed: October 10, 2008
    Publication date: April 15, 2010
    Applicant: Torrey Hills Technologies, LLC
    Inventors: Dejun Zhu, Hong Wu, York Yuan Chang, Ken Kuang