Patents by Inventor Yosei Hara
Yosei Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10122313Abstract: It is an object of the present invention to enhance connection reliability of terminals while enhancing assembling performance.Type: GrantFiled: January 12, 2016Date of Patent: November 6, 2018Assignee: Hitachi Automotive Systems, Ltd.Inventors: Yosei Hara, Morio Kuwano
-
Patent number: 10091903Abstract: To suppress reduction in resistance against vibrations, while reducing the number of components, a power conversion device including a power semiconductor module that converts a DC current into an AC current, a plate conductor that transfers the DC current or the AC current, a resin sealing material that seals the plate conductor, and an electric component that is used to control the power semiconductor module has the resin sealing material include a supporting member. The supporting member supports the electric component, and the plate conductor is buried in a portion of the resin sealing material that is disposed to face the electric component.Type: GrantFiled: January 29, 2016Date of Patent: October 2, 2018Assignee: Hitachi Automotive Systems, Ltd.Inventors: Yosei Hara, Morio Kuwano, Akira Ishii
-
Patent number: 9948210Abstract: An electric power conversion device includes a capacitor package. The capacitor package includes a first positive electrode bus bar that is connected to a positive electrode of the inverter circuit unit and connected to a smoothing capacitor. The capacitor package also includes a second positive electrode bus bar that is connected to a positive electrode on a battery side of the converter circuit unit and connected to the another smoothing capacitor. On a first side thereof the negative electrode bus bar directly overlaps the entire first positive electrode.Type: GrantFiled: January 27, 2014Date of Patent: April 17, 2018Assignee: Hitachi Automotive Systems, Ltd.Inventors: Keisuke Fukumasu, Yosei Hara, Masayoshi Takahashi
-
Publication number: 20170353118Abstract: An object of the invention is to suppress that resistance against vibrations is reduced, while reducing the number of components. A power conversion device according to the present invention includes: a power semiconductor module that converts a DC current into an AC current; a plate conductor that transfers the DC current or the AC current; a resin sealing material that seals the plate conductor; and an electric component that is used to control the power semiconductor module, wherein the resin sealing material includes a supporting member that supports the electric component, and wherein the plate conductor is buried in a portion of the resin sealing material that is disposed to face the electric component.Type: ApplicationFiled: January 29, 2016Publication date: December 7, 2017Inventors: Yosei HARA, Morio KUWANO, Akira ISHII
-
Publication number: 20170331406Abstract: It is an object of the present invention to enhance connection reliability of terminals while enhancing assembling performance.Type: ApplicationFiled: January 12, 2016Publication date: November 16, 2017Applicant: Hitachi Automotive Systems, Ltd.Inventors: Yosei HARA, Morio KUWANO
-
Patent number: 9585292Abstract: A power converter includes a power semiconductor module, a first flow path forming body and a second flow path forming body that forms a housing space for storing the power semiconductor module and the first flow path forming body, in which the first flow path forming body is configured of a first side wall section, a second side wall section, and a bottom surface section, the first side wall section forms a first flow path space between one surface of the power semiconductor module and the first side wall section, the second side wall section forms a second flow path space between the other surface of the power semiconductor module and the second side wall section, and cooling refrigerant flows through the housing space, the first flow path space, and the second flow path space.Type: GrantFiled: January 31, 2014Date of Patent: February 28, 2017Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Keisuke Horiuchi, Yosei Hara, Morio Kuwano, Atsuo Nishihara, Kinya Nakatsu
-
Patent number: 9510487Abstract: A power conversion apparatus includes: a power semiconductor module (150a); a flow channel forming body (20) for housing the power semiconductor module (150a); and a cover (5) for fixing the power semiconductor module (150a) to the flow channel forming body (20), and the power semiconductor module (150a) includes a power semiconductor element, main terminals (157b, 158b) electrically connected to the power semiconductor element, and a case for housing the power semiconductor element, the cover (5) has a recessed portion (5c) and an opening (5a) provided in a bottom surface portion of the recessed portion (5c), the power semiconductor module (150a) is placed to be fitted into the recessed portion (5c), the power semiconductor module (150a) is fixed to the cover (5) so that the main terminals (157b, 158b) pass through the opening (5a), the case and an inner wall of the recessed portion (5c) have an airtight structure, and therefore prevents intrusion of a coolant into the power semiconductor module having a douType: GrantFiled: July 24, 2013Date of Patent: November 29, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Keisuke Horiuchi, Atsuo Nishihara, Kinya Nakatsu, Morio Kuwano, Yosei Hara
-
Patent number: 9301434Abstract: Provided is a power conversion apparatus that includes a power semiconductor module, a smoothing capacitor module, an alternating-current bus bar, a control circuit unit to control the power semiconductor element, and a flow channel formation body to form a flow channel through which a cooling medium flows. The power semiconductor module has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion. A flow channel formation body external portion of the flow channel formation body has a first surface wall that faces the first heat dissipation portion with the flow channel therebetween, a second surface wall that faces the second heat dissipation portion with the flow channel therebetween, and a sidewall to connect the first surface wall and the second surface wall. The sidewall has an opening to insert the power semiconductor module into the flow channel.Type: GrantFiled: July 25, 2012Date of Patent: March 29, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Morio Kuwano, Yosei Hara, Haruki Hamada
-
Publication number: 20160020707Abstract: Provided is an installation structure for an electric power conversion device whereby the size of the device is reduced, and noise conducted to an external battery due to a switching operation is reduced. The electric power conversion device according to the present invention is therefore provided with an inverter circuit unit, a converter circuit unit for stepping up a voltage from an external battery and outputting to the inverter circuit unit or stepping down a power source voltage of the inverter circuit unit and outputting to a battery, and a capacitor package for storing a smoothing capacitor connected to an inverter circuit unit power source voltage and a converter circuit unit battery-side power source voltage.Type: ApplicationFiled: January 27, 2014Publication date: January 21, 2016Inventors: Keisuke FUKUMASU, Yosei HARA, Masayoshi TAKAHASHI
-
Publication number: 20150382501Abstract: A power converter includes a power semiconductor module, a first flow path forming body and a second flow path forming body that forms a housing space for storing the power semiconductor module and the first flow path forming body, in which the first flow path forming body is configured of a first side wall section, a second side wall section, and a bottom surface section, the first side wall section forms a first flow path space between one surface of the power semiconductor module and the first side wall section, the second side wall section forms a second flow path space between the other surface of the power semiconductor module and the second side wall section, and cooling refrigerant flows through the housing space, the first flow path space, and the second flow path space.Type: ApplicationFiled: January 31, 2014Publication date: December 31, 2015Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Keisuke HORIUCHI, Yosei HARA, Morio KUWANO, Atsuo NISHIHARA, Kinya NAKATSU
-
Publication number: 20150223366Abstract: A power conversion apparatus includes: a power semiconductor module (150a); a flow channel forming body (20) for housing the power semiconductor module (150a); and a cover (5) for fixing the power semiconductor module (150a) to the flow channel forming body (20), and the power semiconductor module (150a) includes a power semiconductor element, main terminals (157b, 158b) electrically connected to the power semiconductor element, and a case for housing the power semiconductor element, the cover (5) has a recessed portion (5c) and an opening (5a) provided in a bottom surface portion of the recessed portion (5c), the power semiconductor module (150a) is placed to be fitted into the recessed portion (5c), the power semiconductor module (150a) is fixed to the cover (5) so that the main terminals (157b, 158b) pass through the opening (5a), the case and an inner wall of the recessed portion (5c) have an airtight structure, and therefore prevents intrusion of a coolant into the power semiconductor module having a douType: ApplicationFiled: July 24, 2013Publication date: August 6, 2015Inventors: Keisuke Horiuchi, Atsuo Nishihara, Kinya Nakatsu, Morio Kuwano, Yosei Hara
-
Publication number: 20150163961Abstract: A power conversion apparatus includes power semiconductor modules (300U, 300V, 300W), a first flow path forming body (110) that forms a first flow path, a second flow path forming body (401) that forms a second flow bath, a first base plate (400) for mounting the second flow path forming body thereon, a drive circuit board (200), and a case (101). The drive circuit board (200) is provided so that a mounting surface of the drive circuit faces a side wall of the second flow bath forming body (401). The second flow path forming body (401) forms a housing space for housing the power semiconductor modules (300U, 300V, 300W). Further, the second flow path forming body (401) forms an insertion opening that leads to the housing space, on a side wall facing the mounting surface of the drive circuit. The power semiconductor modules (300U, 300V, 300W) have a control terminal that is connected to the &rive circuit board (200) by passing through the insertion opening.Type: ApplicationFiled: July 24, 2013Publication date: June 11, 2015Applicant: Hitachi Automotive Systems, Ltd.Inventors: Yosei Hara, Morio Kuwano
-
Publication number: 20140160822Abstract: Provided is a power conversion apparatus that includes a power semiconductor module, a smoothing capacitor module, an alternating-current bus bar, a control circuit unit to control the power semiconductor element, and a flow channel formation body to form a flow channel through which a cooling medium flows. The power semiconductor module has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion. A flow channel formation body external portion of the flow channel formation body has a first surface wall that faces the first heat dissipation portion with the flow channel therebetween, a second surface wall that faces the second heat dissipation portion with the flow channel therebetween, and a sidewall to connect the first surface wall and the second surface wall. The sidewall has an opening to insert the power semiconductor module into the flow channel.Type: ApplicationFiled: July 25, 2012Publication date: June 12, 2014Applicant: Hitachi Automotive Systems, Ltd.Inventors: Morio Kuwano, Yosei Hara, Haruki Hamada
-
Patent number: D759589Type: GrantFiled: March 18, 2015Date of Patent: June 21, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takahiro Shimura, Yusuke Takagi, Akira Matsushita, Yosei Hara
-
Patent number: D769189Type: GrantFiled: June 29, 2015Date of Patent: October 18, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takahiro Shimura, Yusuke Takagi, Akira Matsushita, Yosei Hara