Patents by Inventor Yoshiaki Furukawa

Yoshiaki Furukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-aqueous electrolyte secondary battery
    Patent number: 6358645
    Abstract: A coin type non-aqueous electrolyte secondary battery having a structure that a pellet for forming a negative electrode accommodated in a can of the negative electrode and a pellet for forming a positive electrode accommodated in a can of the positive electrode are stacked to face each other through a separator and the cans of the two electrodes are caulked through a gasket so that the battery is sealed. The gasket has an outer annular portion held between the two cans and an inner annular portion facing the inside portion of the battery. A projection for supporting the pellet for forming the positive electrode is formed at a position of the inner surface of the inner annular portion opposite to the pellet for forming the positive electrode.
    Type: Grant
    Filed: September 30, 1998
    Date of Patent: March 19, 2002
    Assignee: Sony Corporation
    Inventors: Yoshiaki Furukawa, Masayuki Endo
  • Composition for treating copper and copper alloy surfaces and method for the surface treatment
    Patent number: 5496590
    Abstract: A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.
    Type: Grant
    Filed: August 11, 1994
    Date of Patent: March 5, 1996
    Assignee: MEC Co., Ltd.
    Inventors: Yoshiro Maki, Toshiko Nakagawa, Yoshiaki Furukawa, Minoru Outani, Takashi Haruta, Maki Yamanami, Sachiko Nakamura
  • Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same
    Patent number: 5476947
    Abstract: A novel benzimidazole derivative is disclosed. The benzimidazole derivative is represented by the following formula (I), ##STR1## wherein R.sup.1 is a hydrogen atom, a lower alkyl group, or a halogen atom; R.sup.2 is a hydrogen atom or a lower alkyl group; R.sup.3 is an alkylene group with 1 to 18 carbon atoms; and n and m are integers from 0 to 3. The compound has an excellent rust preventing effect and can be used as a component of a composition for the treatment of surfaces of copper and copper alloys comprising the benzimidazole derivative which is particularly useful in preventing rust in printed-wiring boards.
    Type: Grant
    Filed: May 26, 1994
    Date of Patent: December 19, 1995
    Assignee: MEC Co., Ltd.
    Inventors: Yoshiro Maki, Yoshiaki Furukawa, Maki Yamanami
  • Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same
    Patent number: 5435860
    Abstract: A novel benzimidazole derivative is disclosed. The benzimidazole derivative is represented by the following formula (I), ##STR1## wherein R.sup.1 is a hydrogen atom, a lower alkyl group, or a halogen atom; R.sup.2 is a hydrogen atom or a lower alkyl group; R.sup.3 is an alkylene group with 1 to 18 carbon atoms; and n and m are integers from 0 to 3. The compound has an excellent rust preventing effect and can be used as a component of a composition for the treatment of surfaces of copper and copper alloys comprising the benzimidazole derivative which is particularly useful in preventing rust in printed-wiring boards.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: July 25, 1995
    Assignee: Mec Co., Ltd.
    Inventors: Yoshiro Maki, Yoshiaki Furukawa, Maki Yamanami