Patents by Inventor Yoshiaki Fuse

Yoshiaki Fuse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PHOTOSENSITIVE FILM AND METHOD FOR FORMING PERMANENT MASK RESIST
    Publication number: 20210124267
    Abstract: A photosensitive film of the present invention includes a carrier film having a first surface whose surface roughness is 0.1 to 0.4 ?m, and a photosensitive layer formed on the first surface, in which a haze of the carrier film is 30 to 65%, and a spectral haze at a wavelength of 405 nm of the carrier film, as measured by providing a transparent resin layer in which a difference between a refractive index of the transparent resin layer and a refractive index of the photosensitive layer is within ±0.02 on the first surface, is 0.1 to 9.0%.
    Type: Application
    Filed: May 9, 2019
    Publication date: April 29, 2021
    Applicants: Showa Denko Materials Co., Ltd., KIMOTO CO., LTD.
    Inventors: Hideki ETORI, Keiko KITAMURA, Yoshiaki FUSE, Nobuhito KOMURO
  • Photosensitive resin composition for protective film of printed wiring board for semiconductor package
    Patent number: 9075307
    Abstract: The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: July 7, 2015
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazuhiko Kurafuchi, Toshizumi Yoshino, Hideyuki Katagi, Masaya Ookawa, Yoshiaki Fuse
  • PHOTOSENSITIVE RESIN COMPOSITION FOR PROTECTIVE FILM OF PRINTED WIRING BOARD FOR SEMICONDUCTOR PACKAGE
    Publication number: 20110223539
    Abstract: The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.
    Type: Application
    Filed: August 28, 2008
    Publication date: September 15, 2011
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazuhiko Kurafuchi, Toshizumi Yoshino, Hideyuki Katagi, Masaya Ookawa, Yoshiaki Fuse