Abstract: Since a structure of a cooling fan of an alternative current generator for a vehicle is formed with a resin molding product having an insert metal fitting, a freedom degree on said fan design shape configuration and said installation performance of said fan to a core can be compatible. A cooling fan structure having a high shape configuration design freedom degree and having an installation strength similar to that of said fan according to said prior art can be obtained.

Abstract: An infrared sensor is formed with a first infrared detecting element for infrared detection disposed in a container through a supporting substrate, and a second infrared detecting element for temperature compensation also disposed in the container to be shielded by the supporting substrate of the first infrared detecting element from incident infrared within the container, while a temperature sensing section of the first infrared detecting element is born in non-contacting state with respect to a supporting part of the substrate for the element, whereby the sensitivity can be remarkably improved with a simpler arrangement while keeping a high precision and inexpensiveness.

Abstract: A rotor 2 comprises of a pair of claw shape magnetic poles 3N and 3S and plural permanent magnets 5. The permanent magnet 5 is arranged between claw portions of the claw shape magnetic poles 3N and 3S. A permanent magnet fly-out prevention member 61 is arranged at an outer periphery of the claw shape magnetic poles 3N and 3S and prevents the fly-out of the permanent magnet 5 when the rotor 2 rotates. A permanent magnet holding member 62 holds the permanent magnet 5 from an inner periphery side. In a construction in which the permanent magnet fly-out prevention member 61 is arranged between the claw portions of the claw shape magnetic poles 3N and 3S, the working operation for arranging the permanent magnet 5 between the claw portions of the claw shape magnetic poles 3N and 3S can be improved, thereby a vehicle use AC generator having an improved electric power generation efficiency can be provided.

Abstract: An alternator for a vehicle, including a rotating yoke composed of a pair of hook-shaped magnetic poles arranged in facing relation to each other and being concentrically attached to a shaft, a magnetic-field winding for generating a magnetizing force in the hook-shaped magnetic poles, stator magnetic poles arranged in the periphery of the rotating yoke, magnets for decreasing leakage magnetic flux arranged between the hook portions of the hook-shaped magnetic poles, and protection covers arranged in the positions of the outer surface of the magnets fixed to the side surfaces of the hook portions between the hook portions such that the outer surface does not become higher than the outer periphery of the hook portion.

Abstract: A highly reliable connection structure of a bundle of more than two coil leading-out wires and a wire bundling terminal is provided by contacting and fixing at least a part of a circumferential surface of each of the coil leading-out wires to an inside wall of the wire bundling terminal. Further, a small size motor and an alternator for a vehicle utilize the connection structure.

Abstract: A power source system for a vehecle is disclosed. The system has a generator driven by an internal combustion engine, a control equipment for controlling the generator, a battery, a heater which is heated by the generated output of the temperature detecting means for detecting generator, and a temperature of the heater. The system has a switch between the heater and between the generator and the generator and the battery. The heater and the battery are connected in parallel to each other.

Abstract: A method for washing a photomask substrate or a semiconductor wafer. The mixing heat generated on mixing H.sub.2 SO.sub.4 and H.sub.2 O.sub.2 is effectively utilized for promoting the reaction. H.sub.2 SO.sub.4 and H.sub.2 O.sub.2 are discharged from separate nozzles and mixed at a mixing point directly below and proximate to the nozzles to give a H.sub.2 SO.sub.4 --H.sub.2 O.sub.2 liquid mixture. The liquid mixture is caused to descend onto near the center of the photomask kept in rotation so that the liquid mixture is spread over the substrate surface under a centrifugal force. The H.sub.2 SO.sub.4 --H.sub.2 O.sub.2 flow ratios, the height of the mixing point and the number of revolutions of the substrate are controlled for providing the uniform temperature distribution of the liquid mixture on the substrate surface and for achieving uniform washing.

Abstract: Plural thin plate projecting portions are integrally and projectingly provided on an outer peripheral portion of a side plate member of a bobbin. Each of the thin plate projecting portions comprises a circumferential rib, a slit portion and a reinforcement rib. The circumferential rib is provided on an outer peripheral face of the thin plate projecting portion of the bobbin and then a gap is formed between a claw-shaped magnetic pole of a rotor core and the thin plate projecting portion. A varnish material etc. is caused to adhere to and harden in this gap. By filling a root portion of the claw-shape magnetic pole of the rotor core with varnish material, the resonance vibration in the rotor core can be restrained. As a result, an alternating current generator for use in a vehicle having the small magnetic noise can be obtained.

Abstract: In a semiconductor device of a tape carrier package type, the gap width between inner leads connected with a first edge side of a semiconductor chip set within a device mounting hole provided in the tape carrier is larger than the gap width between leads connected with a second edge side opposite to the first edge side of the semiconductor chip, and the gap length of device mounting hole between the first edge of the semiconductor chip and the first edge of the device mounting hole corresponding to the first edge of the semiconductor chip is smaller than the gap length between the second edge of the semiconductor chip and the second edge of the device mounting hole corresponding to the second edge of the semiconductor chip. Such structure enables an encapsulation resin to fill uniformly the device mounting hole, and the encapsulation resin after encapsulation has a shape of a designed dimension.

Abstract: Object of the present invention is to provide an induction alternating current generator on vehicle and a method for generating alternating current in a generator on vehicle, which improve the efficiency of the generator by increasing magnetic flux permeating a stator core.Second electromagnetic exciting means for generating magnetic field in the direction of repelling the leak magnetic flux between neighboring claw poles, are provided in the spaces formed by the neighboring claw poles engaging each other at a gap and first electromagnetic exciting means provided inside a pair of the rotor cores of the induction alternating current generator on vehicle.

Abstract: A vehicle alternator output rectifier instrument in which mesa structure Zener diodes, formed by diffusion of impurity on a P-type silicon substrate, are used as rectifier elements which are used in rectifier circuits for rectifying an alternate current output of a vehicle alternator. Since the vehicle alternator output rectifier instrument employs the above Zener diodes, this rectifier instrument can endure high temperature circumstances, considerably reduce a reverse leakage current to thereby prevent a battery voltage from being discharged and reduce a radio noise to thereby reduce a bad influence exerted upon an electronic device serving as a load.

Abstract: A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

Abstract: A tape carrier semiconductor device has a resin sealed area not much larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.