Patents by Inventor Yoshiaki Ichikawa

Yoshiaki Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11349233
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of connection portions is larger than a second fillet width of another solder among the solder fillets located in an outside region of one of the pair of connection portions, which is on a side opposite to the inside region across the one of the pair of connection portions.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: May 31, 2022
    Assignee: Yazaki Corporation
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Patent number: 11211727
    Abstract: A connector-attached circuit body include a circuit body including a flexible substrate having a wiring pattern, and a connector attached to the circuit body and including a terminal and a housing that accommodates the terminal. The terminal is electrically connected to the wiring pattern and extends in a thickness direction of the circuit body.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: December 28, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Yoshiaki Ichikawa, Kimitoshi Makino, Makoto Kobayashi, Tomoji Yasuda
  • Publication number: 20210399539
    Abstract: A conductive structure includes: a single-layer busbar that is formed in a plate shape and constitutes a conductive path; and a multi-layer busbar that is configured by laminating a plurality of busbars which are formed as plates thinner than the single-layer busbar and that is joined to an end of the single-layer busbar and constitutes the conductive path. The multi-layer busbar includes a main body portion in which at least some of the laminated plurality of busbars are capable of mutual displacement relative to the busbars adjacent thereto, and a joining end located at a end of the main body portion on the single-layer busbar side and in which the laminated plurality of busbars are incapable of mutual displacement relative to each other, the joining end being joined to the end of the single-layer busbar.
    Type: Application
    Filed: June 15, 2021
    Publication date: December 23, 2021
    Applicant: Yazaki Corporation
    Inventors: Koji KOIZUMI, Yoshiaki ICHIKAWA
  • Patent number: 11166382
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: November 2, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Patent number: 11139646
    Abstract: A conduction system includes a laminated busbar including a plurality of busbars forming a conduction path in a vehicle and are stacked each other; and a distribution mechanism configured to distribute an electric power or electric signal by bending a part of the busbars forming the laminated busbar with respect to other busbars and by branching off the part of the busbars and the other busbars branch off from each other. As a result, the conduction system can provide an effect that the conduction path can be properly provided by combining the laminated busbar and the distribution mechanism.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: October 5, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Koji Koizumi, Masahiro Takamatsu, Yoshiaki Ichikawa
  • Patent number: 11114720
    Abstract: A cylindrical battery housing case has a plurality of cylindrical battery housing chambers each housing one cylindrical battery, and a plurality of elongated resilient members each having a protrusion for holding a cylindrical portion of the cylindrical battery is formed in a cantilevered manner inside notches in a side wall of each of the cylindrical battery housing chambers.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: September 7, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Tomohiro Ikeda, Yoshiaki Ichikawa, Hirotaka Mukasa, Taishi Sakai
  • Patent number: 11088422
    Abstract: A method for manufacturing a laminated bus bar includes a first base member forming process of forming a plurality of first through-holes in a conductive flat plate-shaped first base member, a second base member forming process of forming a conductive flat plate-shaped second base member, a laminating process of forming a laminated body configured by laminating and fixing flat surfaces of the first base member and the second base member on and to each other, and a punching process of forming, in the second base member of the laminated body, second through-holes forming pairs with the first through-holes, the second through-holes being smaller than the first through-holes in portions overlapping with the first through-holes in a lamination direction of the first base member and the second base member.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: August 10, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Tatsuya Oga, Yoshiaki Ichikawa, Mariko Nakagawa
  • Patent number: 11056753
    Abstract: A bus bar module is attached to a battery assembly having a plurality of single cells which are assembled to each other along a first direction. The bus bar module includes a circuit body, a bus bar, and a holder. The circuit body includes a main line that extends in the first direction, a branch line that extends from the main line so as to branch from the main line, and a connection portion provided in a position close to a distal end of the branch line rather than a folded portion of the branch line and configured to be connected to the bus bar.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: July 6, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Masahiro Takamatsu, Yoshiaki Ichikawa, Kimitoshi Makino, Makoto Kobayashi, Tomoji Yasuda
  • Patent number: 11031658
    Abstract: A bus bar module includes a plurality of bus bars and a bus bar holder. The bus bar holder is constituted by coupling a plurality of holding portions in a chain manner via deformable coupling portions, respectively, the plurality of holding portions each holding the bus bar in a movable manner in predetermined ranges determined by restriction of movement of the bus bar by interferences with movement restricting members. Openings allowing two contact portions of the bus bar held by the holding portion to be exposed to an outside, the two contact portions being respectively connected to the electrodes of the two adjacent battery cells, are provided in either the holding portion or the coupling portion.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: June 8, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Katsunori Sato, Yoshiaki Ichikawa, Takao Shoji
  • Publication number: 20210151915
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of the connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of the connection portions is larger than a second fillet width of another one solder among the solder fillets located in an outside region on an opposite side to the inside region across the connection portions.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 20, 2021
    Applicant: Yazaki Corporation
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Publication number: 20210136925
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.
    Type: Application
    Filed: November 5, 2020
    Publication date: May 6, 2021
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Patent number: 10964929
    Abstract: A structure of connection among a circuit body, a bus bar and an electronic element includes a circuit body configured by a flexible board on which a wiring pattern is provided, a bus bar attached to a mounting surface of the circuit body, and an electronic element attached to the mounting surface so as to connect the bus bar and the wiring pattern. The bus bar has a fixed portion extending along the mounting surface. The fixed portion is fixed to the mounting surface so that a restricted area which restricts deformation of the mounting surface is formed in a periphery of the fixed portion. The electronic element is arranged in the restricted area and is fixed to the mounting surface.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: March 30, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Yoshiaki Ichikawa, Kimitoshi Makino, Makoto Kobayashi, Tomoji Yasuda, Masahiro Takamatsu
  • Patent number: 10959324
    Abstract: A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: a band-shaped main strip to be located to extend in a stacking direction of cells; a band-shaped first branch strip branched from the main strip and extending toward a corresponding busbar; and a second branch strip branched from the main strip and extending toward an external device. The first branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a busbar connection portion disposed closer to an end of the first branch strip than the bent portion and connected to the corresponding busbar. The second branch strip has a device connection portion to be connected to the external device.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: March 23, 2021
    Assignee: Yazaki Corporation
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
  • Publication number: 20210043909
    Abstract: A method for manufacturing a laminated bus bar includes a first base member forming process of forming a plurality of first through-holes in a conductive flat plate-shaped first base member, a second base member forming process of forming a conductive flat plate-shaped second base member, a laminating process of forming a laminated body configured by laminating and fixing flat surfaces of the first base member and the second base member on and to each other, and a punching process of forming, in the second base member of the laminated body, second through-holes forming pairs with the first through-holes, the second through-holes being smaller than the first through-holes in portions overlapping with the first through-holes in a lamination direction of the first base member and the second base member.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 11, 2021
    Inventors: Tatsuya Oga, Yoshiaki Ichikawa, Mariko Nakagawa
  • Patent number: 10886519
    Abstract: A conductor module for terminal includes a bus bar, a state detector including a detection conductor, and a fixing member fixing the state detector to the bus bar. The bus bar includes a connection surface to which the detection conductor is electrically connected, and two fixing holes formed with the placed state detector interposed therebetween. The fixing member includes a main body that the state detector is made contact with, and plastically deformable fixing legs. Each of the fixing legs is inserted in the fixing hole from the connection surface side and projects from the fixed surface. In a fixed state, when the fixing leg is seen from an axis direction of the fixing hole, a tip of the fixing leg is disposed on the outside in a radial direction than the fixing holes.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: January 5, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Katsunori Sato, Takuto Goto, Shinichi Yanagihara, Yoshiaki Ichikawa, Takao Shoji
  • Publication number: 20200396830
    Abstract: A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: a band-shaped main strip to be located to extend in a stacking direction of cells; a band-shaped first branch strip branched from the main strip and extending toward a corresponding busbar; and a second branch strip branched from the main strip and extending toward an external device. The first branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a busbar connection portion disposed closer to an end of the first branch strip than the bent portion and connected to the corresponding busbar. The second branch strip has a device connection portion to be connected to the external device.
    Type: Application
    Filed: May 13, 2020
    Publication date: December 17, 2020
    Applicant: Yazaki Corporation
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
  • Publication number: 20200395590
    Abstract: A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: conductor layers and protective layers to form a multiple-layered structure of wiring patterns; a band-shaped main strip to be located to extend in a stacking direction of cells; and a band-shaped branch strip branched from the main strip. The branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a connection portion disposed closer to an end of the branch strip than the bent portion and connected to the corresponding busbar. The bent portion has a thin-layer portion having a shape formed by removing, from the flexible circuit board, a part of the protective layers corresponding to a part of the conductor layers without being used as the wiring pattern in the branch strip.
    Type: Application
    Filed: May 13, 2020
    Publication date: December 17, 2020
    Applicant: Yazaki Corporation
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
  • Publication number: 20200395589
    Abstract: A circuit body includes a flexible circuit board including: a conductor wiring pattern for electrical connection; and a pair of protective layers sandwiching the wiring pattern to isolate the wiring pattern from outside. The wiring pattern has a conduction portion exposed to the outside through an opening located on at least one of the pair of the protective layers and to be electrically connected to an external terminal. The conduction portion has at least two overlap portions located around the opening and sandwiched between the pair of the protective layers in a thickness direction of the flexible circuit board.
    Type: Application
    Filed: May 13, 2020
    Publication date: December 17, 2020
    Applicant: Yazaki Corporation
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
  • Publication number: 20200389005
    Abstract: A conduction system includes a laminated busbar including a plurality of busbars forming a conduction path in a vehicle and are stacked each other; and a distribution mechanism configured to distribute an electric power or electric signal by bending a part of the busbars forming the laminated busbar with respect to other busbars and by branching off the part of the busbars and the other busbars branch off from each other. As a result, the conduction system can provide an effect that the conduction path can be properly provided by combining the laminated busbar and the distribution mechanism.
    Type: Application
    Filed: May 15, 2020
    Publication date: December 10, 2020
    Inventors: Koji Koizumi, Masahiro Takamatsu, Yoshiaki Ichikawa
  • Publication number: 20200373541
    Abstract: A conductive module includes a plurality of conductive terminal connection components for electrical connection with an electrode terminal; a conductive component that electrically connects a battery cell and an electrical connection target; and an electrical connection structure for each terminal connection component that electrically connects the terminal connection component and the conductive component. The conductive component includes a conductor for each terminal connection component formed using a dissimilar metal material which is a different type from the terminal connection component. The electrical connection structure is formed using a similar metal material which is the same type as the conductor.
    Type: Application
    Filed: April 17, 2020
    Publication date: November 26, 2020
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga