Patents by Inventor Yoshiaki Ichikawa
Yoshiaki Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11646458Abstract: A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: conductor layers and protective layers to form a multiple-layered structure of wiring patterns; a band-shaped main strip to be located to extend in a stacking direction of cells; and a band-shaped branch strip branched from the main strip. The branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a connection portion disposed closer to an end of the branch strip than the bent portion and connected to the corresponding busbar. The bent portion has a thin-layer portion having a shape formed by removing, from the flexible circuit board, a part of the protective layers corresponding to a part of the conductor layers without being used as the wiring pattern in the branch strip.Type: GrantFiled: May 13, 2020Date of Patent: May 9, 2023Assignee: Yazaki CorporationInventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
-
Publication number: 20230039725Abstract: A bus bar module includes a circuit body, a bus bar, a holder, and a cover configured to be assembled to the holder to protect the circuit body and the holder. The circuit body includes a belt-like main line that extends in a first direction, a belt-like branch line that extends from the main line so as to branch from the main line, and a connection portion provided in a position closer to a distal end of the branch line than a folded portion the branch line. The cover is structured so as to be stretchable and shrinkable in the first direction in accordance with a stretching and a shrinking of the holder in the first direction.Type: ApplicationFiled: October 25, 2022Publication date: February 9, 2023Inventors: Yoshiaki Ichikawa, Kimitoshi Makino, Makoto Kobayashi, Tomoji Yasuda, Masahiro Takamatsu
-
Patent number: 11515604Abstract: A bus bar module includes a circuit body, a bus bar, a holder, and a cover configured to be assembled to the holder to protect the circuit body and the holder. The circuit body includes a belt-like main line that extends in a first direction, a belt-like branch line that extends from the main line so as to branch from the main line, and a connection portion provided in a position closer to a distal end of the branch line than a folded portion the branch line. The cover is structured so as to be stretchable and shrinkable in the first direction in accordance with a stretching and a shrinking of the holder in the first direction.Type: GrantFiled: July 9, 2019Date of Patent: November 29, 2022Assignee: YAZAKI CORPORATIONInventors: Yoshiaki Ichikawa, Kimitoshi Makino, Makoto Kobayashi, Tomoji Yasuda, Masahiro Takamatsu
-
Publication number: 20220344730Abstract: A conductive module includes a conductive part is provided with a flat laminated body formed of a plurality of conductors and an insulator having flexibility. The conductive part includes a first conductor that is configured to electrically connect the battery cells to a battery monitoring unit, and a second conductor that is configured to electrically connect the battery monitoring unit to electrical equipment, as the conductors, and includes a first connector that is configured to be fitted and connected to a counterpart connector of the battery monitoring unit and is configured to electrically connect the first conductor and the second conductor to the battery monitoring unit, and a second connector that is configured to be fitted and connected to a counterpart connector disposed on the electrical connection box side and is configured to electrically connect the second conductor to the electrical equipment.Type: ApplicationFiled: April 14, 2022Publication date: October 27, 2022Inventors: Tatsuya Oga, Hirotaka Mukasa, Yuta Fukuchi, Yoshiaki Ichikawa
-
Patent number: 11476654Abstract: A conductive structure includes: a single-layer busbar that is formed in a plate shape and constitutes a conductive path; and a multi-layer busbar that is configured by laminating a plurality of busbars which are formed as plates thinner than the single-layer busbar and that is joined to an end of the single-layer busbar and constitutes the conductive path. The multi-layer busbar includes a main body portion in which at least some of the laminated plurality of busbars are capable of mutual displacement relative to the busbars adjacent thereto, and a joining end located at a end of the main body portion on the single-layer busbar side and in which the laminated plurality of busbars are incapable of mutual displacement relative to each other, the joining end being joined to the end of the single-layer busbar.Type: GrantFiled: June 15, 2021Date of Patent: October 18, 2022Assignee: YAZAKI CORPORATIONInventors: Koji Koizumi, Yoshiaki Ichikawa
-
Patent number: 11444353Abstract: A battery pack has bus bars, a battery stack which is an assembly of plural battery cells, a bus bar casing which supports a bus bar casing, and a cover member. Electrode terminals of battery cells adjacently arranged in the battery stack are connected together through the bus bars. An upstream side passage and a downstream side passage are formed between the bus bars and the cover member. Upstream side wall surfaces forming an inlet part of the upstream side passage or downstream side wall surfaces forming an outlet part of the downstream side passage is arranged at a location closer to the battery cell side than a location of a surface of the bus bar side.Type: GrantFiled: July 20, 2017Date of Patent: September 13, 2022Assignees: DENSO CORPORATION, YAZAKI CORPORATIONInventors: Hiroyoshi Yamamoto, Shota Iguchi, Koji Yamashita, Hisato Inoue, Yoshiaki Ichikawa, Katsunori Sato, Hidehiro Takasugi
-
Publication number: 20220215982Abstract: There is provided a flexible wiring member capable of electrically connecting desired points separated in a length direction. The flexible wiring member includes conductor holding layers that are formed in a state of being stacked in a thickness direction and being electrically insulated from one another; power supply line conductors that have a wide width and are respectively disposed in both of a first conductor holding layer and a second conductor holding layer adjacent to each other in the thickness direction; and communication line conductors that have a width smaller than that of the power supply line conductors and are disposed in one of the first conductor holding layer and the second conductor holding layer, in which the conductor holding layers are formed by an insulating resin, and directly cover the power supply line conductors and the communication line conductors.Type: ApplicationFiled: January 5, 2022Publication date: July 7, 2022Applicant: Yazaki CorporationInventors: Masahiro TAKAMATSU, Yoshiaki ICHIKAWA
-
Patent number: 11349233Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of connection portions is larger than a second fillet width of another solder among the solder fillets located in an outside region of one of the pair of connection portions, which is on a side opposite to the inside region across the one of the pair of connection portions.Type: GrantFiled: November 13, 2020Date of Patent: May 31, 2022Assignee: Yazaki CorporationInventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
-
Patent number: 11211727Abstract: A connector-attached circuit body include a circuit body including a flexible substrate having a wiring pattern, and a connector attached to the circuit body and including a terminal and a housing that accommodates the terminal. The terminal is electrically connected to the wiring pattern and extends in a thickness direction of the circuit body.Type: GrantFiled: July 29, 2019Date of Patent: December 28, 2021Assignee: YAZAKI CORPORATIONInventors: Yoshiaki Ichikawa, Kimitoshi Makino, Makoto Kobayashi, Tomoji Yasuda
-
Publication number: 20210399539Abstract: A conductive structure includes: a single-layer busbar that is formed in a plate shape and constitutes a conductive path; and a multi-layer busbar that is configured by laminating a plurality of busbars which are formed as plates thinner than the single-layer busbar and that is joined to an end of the single-layer busbar and constitutes the conductive path. The multi-layer busbar includes a main body portion in which at least some of the laminated plurality of busbars are capable of mutual displacement relative to the busbars adjacent thereto, and a joining end located at a end of the main body portion on the single-layer busbar side and in which the laminated plurality of busbars are incapable of mutual displacement relative to each other, the joining end being joined to the end of the single-layer busbar.Type: ApplicationFiled: June 15, 2021Publication date: December 23, 2021Applicant: Yazaki CorporationInventors: Koji KOIZUMI, Yoshiaki ICHIKAWA
-
Patent number: 11166382Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.Type: GrantFiled: November 5, 2020Date of Patent: November 2, 2021Assignee: YAZAKI CORPORATIONInventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
-
Patent number: 11139646Abstract: A conduction system includes a laminated busbar including a plurality of busbars forming a conduction path in a vehicle and are stacked each other; and a distribution mechanism configured to distribute an electric power or electric signal by bending a part of the busbars forming the laminated busbar with respect to other busbars and by branching off the part of the busbars and the other busbars branch off from each other. As a result, the conduction system can provide an effect that the conduction path can be properly provided by combining the laminated busbar and the distribution mechanism.Type: GrantFiled: May 15, 2020Date of Patent: October 5, 2021Assignee: YAZAKI CORPORATIONInventors: Koji Koizumi, Masahiro Takamatsu, Yoshiaki Ichikawa
-
Patent number: 11114720Abstract: A cylindrical battery housing case has a plurality of cylindrical battery housing chambers each housing one cylindrical battery, and a plurality of elongated resilient members each having a protrusion for holding a cylindrical portion of the cylindrical battery is formed in a cantilevered manner inside notches in a side wall of each of the cylindrical battery housing chambers.Type: GrantFiled: December 11, 2015Date of Patent: September 7, 2021Assignee: YAZAKI CORPORATIONInventors: Tomohiro Ikeda, Yoshiaki Ichikawa, Hirotaka Mukasa, Taishi Sakai
-
Patent number: 11088422Abstract: A method for manufacturing a laminated bus bar includes a first base member forming process of forming a plurality of first through-holes in a conductive flat plate-shaped first base member, a second base member forming process of forming a conductive flat plate-shaped second base member, a laminating process of forming a laminated body configured by laminating and fixing flat surfaces of the first base member and the second base member on and to each other, and a punching process of forming, in the second base member of the laminated body, second through-holes forming pairs with the first through-holes, the second through-holes being smaller than the first through-holes in portions overlapping with the first through-holes in a lamination direction of the first base member and the second base member.Type: GrantFiled: August 4, 2020Date of Patent: August 10, 2021Assignee: YAZAKI CORPORATIONInventors: Tatsuya Oga, Yoshiaki Ichikawa, Mariko Nakagawa
-
Patent number: 11056753Abstract: A bus bar module is attached to a battery assembly having a plurality of single cells which are assembled to each other along a first direction. The bus bar module includes a circuit body, a bus bar, and a holder. The circuit body includes a main line that extends in the first direction, a branch line that extends from the main line so as to branch from the main line, and a connection portion provided in a position close to a distal end of the branch line rather than a folded portion of the branch line and configured to be connected to the bus bar.Type: GrantFiled: July 9, 2019Date of Patent: July 6, 2021Assignee: YAZAKI CORPORATIONInventors: Masahiro Takamatsu, Yoshiaki Ichikawa, Kimitoshi Makino, Makoto Kobayashi, Tomoji Yasuda
-
Patent number: 11031658Abstract: A bus bar module includes a plurality of bus bars and a bus bar holder. The bus bar holder is constituted by coupling a plurality of holding portions in a chain manner via deformable coupling portions, respectively, the plurality of holding portions each holding the bus bar in a movable manner in predetermined ranges determined by restriction of movement of the bus bar by interferences with movement restricting members. Openings allowing two contact portions of the bus bar held by the holding portion to be exposed to an outside, the two contact portions being respectively connected to the electrodes of the two adjacent battery cells, are provided in either the holding portion or the coupling portion.Type: GrantFiled: March 13, 2019Date of Patent: June 8, 2021Assignee: YAZAKI CORPORATIONInventors: Katsunori Sato, Yoshiaki Ichikawa, Takao Shoji
-
Publication number: 20210151915Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of the connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of the connection portions is larger than a second fillet width of another one solder among the solder fillets located in an outside region on an opposite side to the inside region across the connection portions.Type: ApplicationFiled: November 13, 2020Publication date: May 20, 2021Applicant: Yazaki CorporationInventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
-
Publication number: 20210136925Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.Type: ApplicationFiled: November 5, 2020Publication date: May 6, 2021Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
-
Patent number: 10964929Abstract: A structure of connection among a circuit body, a bus bar and an electronic element includes a circuit body configured by a flexible board on which a wiring pattern is provided, a bus bar attached to a mounting surface of the circuit body, and an electronic element attached to the mounting surface so as to connect the bus bar and the wiring pattern. The bus bar has a fixed portion extending along the mounting surface. The fixed portion is fixed to the mounting surface so that a restricted area which restricts deformation of the mounting surface is formed in a periphery of the fixed portion. The electronic element is arranged in the restricted area and is fixed to the mounting surface.Type: GrantFiled: July 9, 2019Date of Patent: March 30, 2021Assignee: YAZAKI CORPORATIONInventors: Yoshiaki Ichikawa, Kimitoshi Makino, Makoto Kobayashi, Tomoji Yasuda, Masahiro Takamatsu
-
Patent number: 10959324Abstract: A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: a band-shaped main strip to be located to extend in a stacking direction of cells; a band-shaped first branch strip branched from the main strip and extending toward a corresponding busbar; and a second branch strip branched from the main strip and extending toward an external device. The first branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a busbar connection portion disposed closer to an end of the first branch strip than the bent portion and connected to the corresponding busbar. The second branch strip has a device connection portion to be connected to the external device.Type: GrantFiled: May 13, 2020Date of Patent: March 23, 2021Assignee: Yazaki CorporationInventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga