Abstract: An antenna device includes an input/output portion for a high frequency signal to be input or output, a distributing portion for distributing the high frequency signal input to the input/output portion into a plurality of high frequency signals, a phase shifting portion for imparting the plurality of high frequency signals with a predetermined amount of phase shift, and a feeding portion for feeding a plurality of antenna elements with the plurality of high frequency signals imparted with the predetermined amount of phase shift to cause the plurality of antenna elements to radiate the plurality of high frequency signals. The feeding portion is configured as a triplate line with a center conductor placed between one pair of parallel plate shaped outer conductors.

Abstract: A ferrule fixing member includes a fixing member configured to fix a ferrule to hold an optical fiber to a retaining member including a retaining hole to insert the ferrule, a locked portion configured to be locked to a locking portion formed on the retaining member and to be restricted from moving, with respect to the retaining member, in an insertion direction of the ferrule and in a direction orthogonal to the insertion direction, and a main body configured to elastically press the ferrule toward the bottom of the retaining hole by elastic deformation thereof.

Abstract: Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.

Abstract: A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.

Abstract: An optical communication module includes: an optical element array; a supporting member on which the optical element array is placed; an optical member for optically coupling the optical element array and a plurality of optical fibers together; a plurality of grooves provided in the supporting member or the optical member; and a plurality of protrusions provided on the optical member or the supporting member in correspondence with the grooves respectively. The grooves and the protrusions are mated together. The grooves are provided as being widened toward their openings. The grooves and the protrusions are each provided so that a location in a width direction at which no relative locational misalignment occurs therebetween lies on a line through the center of the optical element array. The grooves and the protrusions are each provided on at least two or more different lines through the center of the optical element array.

Abstract: A semiconductor device includes a plate shaped semiconductor package substrate, a semiconductor chip mounted on the semiconductor package substrate, a plurality of electrodes formed on a lower surface of the semiconductor package substrate, the plurality of electrodes being electrically connected to a mother board; and a connector formed at an end of the semiconductor package substrate. The connector includes a plurality of terminals to be electrically connected to a plurality of spring terminals of a mating connector which is mated in a parallel direction to the semiconductor package substrate.

Abstract: A photoelectric conversion module includes a transmission side photoelectric conversion part for converting an electrical signal into an optical signal, a transmission side circuit board on which the transmission side photoelectric conversion part is mounted on a top surface side of the transmission side circuit board, a reception side photoelectric conversion part for converting an optical signal into an electrical signal, a reception side circuit board on which the reception side photoelectric conversion part is mounted on a top surface side of the reception side circuit board, and a housing. The transmission side circuit board and the reception side circuit board are placed such that a back surface of the transmission side circuit board is opposite to the housing and a back surface of the reception side circuit board is opposite to the housing.

Abstract: A communication module-cooling structure includes a main body section to be cooled by a cooling mechanism, and a heat sink including a cooling receiving section including partition walls and slit-shaped receiving spaces defined by the partition walls. The receiving spaces of the cooling receiving section receive communication modules, and each of the communication modules includes a substrate mounted with a communication circuit component thereon and first and second sidewalls which sandwich the substrate therebetween in a thickness direction of the substrate. At least one of the first and second sidewalls of each of the communication modules is in surface contact with an inner surface of each of the receiving spaces.

Abstract: An optical transceiver includes a transmitting side photoelectric converter, a transmitting side circuit board, a receiving side photoelectric converter, a receiving side circuit board, a surface of the transmitting side circuit board being arranged to face a surface of the receiving side circuit board, a lens block disposed between the transmitting side circuit board and the receiving side circuit board, and optically connected to a transmitting side optical fiber and a receiving side optical fiber, and a frame body holding the lens block such that the lens block aligns with the transmitting side photoelectric converter and the receiving side photoelectric converter, and to fix the transmitting side circuit board and the receiving side circuit board at a predetermined distance from each other.

Abstract: A photoelectric conversion module includes a housing including a first wall and a second wall parallel to each other, a first circuit board and a second circuit board arranged between the first wall and the second wall, a spacer disposed between the first circuit board and the second circuit board, a first dust proofing member for sealing a gap between the first wall and the first circuit board and a gap between the spacer and the first circuit board, and a second dust proofing member for sealing a gap between the second wall and the second circuit board and a gap between the spacer and the second circuit board. The first circuit board includes a first holding portion for holding the first dust proofing member. The second circuit board includes a second holding portion for holding the second dust proofing member.

Abstract: An optical component of an optical module has a junction surface facing an optical connector and a pair of side surfaces apart from each other in a direction perpendicular to a connection direction of the optical connector. A support member has a pair of sidewalls facing the side surfaces of the optical component respectively and concave/convex portions provided in the sidewalls and concave or convex toward the side surfaces of the optical component. The side surfaces of the optical component are fixed to the sidewalls of the support member via an adhesive, and the adhesive is also applied on surfaces of the concave/convex portions of the sidewalls.

Abstract: A photoelectric conversion module includes a transmission side photoelectric conversion part for converting an electrical signal into an optical signal, a transmission side circuit board on which the transmission side photoelectric conversion part is mounted off-center to one side of the transmission side circuit board at one end of the transmission side circuit board, a reception side photoelectric conversion part for converting an optical signal into an electrical signal, and a reception side circuit board on which the reception side photoelectric conversion part is mounted off-center to one side of the reception side circuit board at one end of the reception side circuit board. A surface of the transmission side circuit board on which the transmission side photoelectric conversion part is mounted is opposite to a surface of the reception side circuit board on which the reception side photoelectric conversion part is mounted.

Abstract: An optical connector and lens block connecting structure includes a substrate, an optical element, a lens frame including two side ribs, and a fore rib, a lens block for bending the optical path of the optical element to convert into an optical path parallel to the substrate, an optical connector provided at a fore end of an optical fiber cable, an optical connector frame including two side ribs and a rear rib, and an elastic member interposed between the rear rib of the optical connector frame and the optical connector. The optical connector frame is fixed to the substrate such that the optical connector is mounted to the lens block while the rear rib of the optical connector frame allows the elastic member to press the optical connector toward the lens block.

Abstract: An optical component of an optical module has a junction surface facing an optical connector and a pair of side surfaces apart from each other in a direction perpendicular to a connection direction of the optical connector. A support member has a pair of sidewalls facing the side surfaces of the optical component respectively and concave/convex portions provided in the sidewalls and concave or convex toward the side surfaces of the optical component. The side surfaces of the optical component are fixed to the sidewalls of the support member via an adhesive, and the adhesive is also applied on surfaces of the concave/convex portions of the sidewalls.

Abstract: An optical communication module includes an optical package including at least one semiconductor optical device, an optical filter for reflecting light of a specific wavelength and transmitting light of an other wavelength, an optical block including a transparent material and the optical filter, a housing that houses the optical package and the optical block, an in-housing circuit board housed in the housing and mounting a peripheral electrical circuit for the optical package thereon, and an electrical connector electrically connected to the in-housing circuit board and exposed at a bottom surface of the housing. The optical block further includes a front lens portion at a front side face of the housing, a rear lens portion at a rear side face of the housing, a light inputting port, and a light outputting port. The optical filter is arranged to obliquely intersect with an optical axis passing through the front lens portion and the rear lens portion at a predetermined angle.

Abstract: A high-speed transmission circuit board connection structure includes a first high-speed transmission circuit board including a laminated substrate including a first signal transmission wiring formed on a surface thereof and a ground plane formed inside thereof, a second high-speed transmission circuit board including a circuit substrate and a second signal transmission wiring formed on a surface of the circuit substrate, a conductive board connecting member for fixing the first and second high-speed transmission circuit boards to a surface thereof, and a bonding wire for electrically connecting the first signal transmission wiring and the second signal transmission wiring. The ground plane is exposed on a side end face of the laminated substrate, and a conductive film is formed on the side end face such that the ground plane of the first high-speed transmission circuit board is electrically connected to the board connecting member with the conductive film.

Abstract: A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.

Abstract: An optical module according to the present invention comprises an optical element; and a multilayer insulating substrate which is a lamination of a plurality of single-layer insulating substrates and has a light transmission hole for passing light emitted from the optical element. The optical element is flip-chip mounted on the first outermost one of the single-layer insulating substrates. Each single-layer insulating substrate has a through-hole that constitutes a different part of the light transmission hole, the diameters of the through-holes of the single-layer insulating substrates increasing with drawing away the single-layer insulating substrates from the optical element.

Abstract: An optical component of an optical module has a junction surface facing an optical connector and a pair of side surfaces apart from each other in a direction perpendicular to a connection direction of the optical connector. A support member has a pair of sidewalls facing the side surfaces of the optical component respectively and concave/convex portions provided in the sidewalls and concave or convex toward the side surfaces of the optical component. The side surfaces of the optical component are fixed to the sidewalls of the support member via an adhesive, and the adhesive is also applied on surfaces of the concave/convex portions of the sidewalls.