Abstract: A light emitter includes a substrate including a first surface, a cladding on the first surface of the substrate, a core inside the cladding, a lid on the cladding, a first light-emitting element inside an element sealing area on the first surface, a second light-emitting element inside the element sealing area, a first light-receiving element inside the element sealing area, and a second light-receiving element inside the element sealing area. A first light-receiving surface of the first light-receiving element faces the lid, and a second light-receiving surface of the second light-receiving element faces the lid.

Abstract: A light emitter includes a substrate including a first surface, a cladding on the first surface of the substrate, a core inside the cladding, a lid on the cladding, a first light-emitting element inside an element sealing area on the first surface, a second light-emitting element inside the element sealing area, and a light-receiving element inside the element sealing area.

Abstract: An electronic component mounting package includes: a substrate with ceramic as a base material, the substrate including a cavity having a bottom surface where an electronic component mounting part is located and an inner periphery that has a corner part and a straight part; and an inner peripheral surface where a first metal film is located, the first metal film having a thickness larger at the straight part than at the corner part on the inner periphery having a single distance from the bottom surface or the first metal film having a surface roughness larger at the straight part than at the corner part on the inner periphery having a single distance from the bottom surface.

Abstract: An optical waveguide package includes a substrate including a first surface and a second surface opposite to the first surface, a cladding located on the second surface and including a third surface facing the second surface, a fourth surface opposite to the third surface, and an element-receiving portion with an opening in the fourth surface, a core located in the cladding and extending from the element-receiving portion, and a first metal member located in the element-receiving portion in a plan view as viewed in a direction toward the fourth surface and including an element mount. The first metal member is connected to a second metal member with a first via conductor extending through the substrate from the first surface to the second surface.

Abstract: The present disclosure reduces the possibility that a protrusion and a conductor layer will be damaged during the bonding of a lid to an optical waveguide module. An optical waveguide module includes a substrate, a core, a cladding layer, and a conductor layer. The substrate has a first surface. The core extends in a first direction. The cladding layer is disposed on the first surface 1a and extends over and around the core. The conductor layer is disposed on the cladding layer. The cladding layer includes a protrusion, which extends over the core. The protrusion has a second surface, which is covered with the conductor layer. The protrusion includes a portion where the second surface extends along the first surface and is wider than the core.

Abstract: An electronic component mounting package includes: an insulating base body including a principal face and a recess which opens in the principal face; and a metallic pattern including a plurality of metallic layers lying across a side face of the recess and the principal face. The metallic pattern includes, as an inner layer, at least one metallic layer selected from a tungsten layer, a nickel layer, and a gold layer, and an aluminum layer as an outermost layer. The metallic pattern includes an exposed portion corresponding to a part of the metallic layer constituting the inner layer which part is exposed at the principal face.

Abstract: An optical waveguide package includes a substrate, a cladding on a first surface of the substrate, and a core in the cladding. The cladding has a recess surrounding an element mount. The recess has an inner wall surface including a plurality of wall surfaces and a corner support surface between adjacent wall surfaces of the plurality of wall surfaces.

Abstract: An optical waveguide package includes a substrate having a first surface, and an optical waveguide layer including a cladding located on the first surface and a core located in the cladding. The substrate includes a first portion and a second portion being in contact with the cladding. The second portion bonds to the cladding with a higher bonding strength than the first portion.

Abstract: An optical waveguide package includes a substrate, an optical waveguide layer located on an upper surface of the substrate and including a cladding and a core in the cladding, a lid, and a metal member. The cladding includes a first surface facing the substrate, a second surface opposite to the first surface, and an element-receiving area being open in the second surface. The lid covers the element-receiving area. The metal member surrounds the element-receiving area between the cladding and the lid.

Abstract: An optical waveguide package includes a substrate, and an optical waveguide layer on an upper surface of the substrate. The optical waveguide layer includes a cladding and a core in the cladding. The cladding has at least one first recess having a bottom surface and a first inner wall surface surrounding the bottom surface. The first inner wall surface of the at least one first recess is inclined and has an upper side outward from a lower side.

Abstract: A control system of an unmanned vehicle includes: a switching unit that can switch the unmanned vehicle, which has blinkers, between a manual mode and an automatic mode; a determination unit that determines whether the blinkers are operated; and a traveling control unit that controls traveling of the unmanned vehicle on the basis of determination data of the determination unit.

Abstract: A wiring board includes a substrate for mounting a light emitting element; and a reflective film positioned on a surface of the substrate and reflecting light rays that are emitted from the light emitting element. The reflective film is formed of a plurality of adjacent columnar crystals extending in a perpendicular direction with respect to the surface of the substrate. A surface of the plurality of adjacent columnar crystals is in continuous at a surface of the reflective film.

Abstract: An optical sensor device includes a substrate, a light-receiving element, a light-emitting element, a first transparent substrate, and a second transparent substrate. The substrate includes a first opening, and a second opening at a distance from the first opening. The light-receiving element is in the first opening. The light-emitting element is in the second opening, and at a distance from the light-receiving element. The first transparent substrate is placed on an upper surface of the substrate and bonded to the substrate to close the first opening and the second opening. The second transparent substrate is placed on an upper surface of the first transparent substrate.

Abstract: An electronic component mounting package includes: a substrate with ceramic as a base material, the substrate including a cavity having a bottom surface where an electronic component mounting part is located and an inner periphery that has a corner part and a straight part; and an inner peripheral surface where a first metal film is located, the first metal film having a thickness larger at the straight part than at the corner part on the inner periphery having a single distance from the bottom surface or the first metal film having a surface roughness larger at the straight part than at the corner part on the inner periphery having a single distance from the bottom surface.

Abstract: An electronic component mounting package includes: an insulating base body including a principal face and a recess which opens in the principal face; and a metallic pattern including a plurality of metallic layers lying across a side face of the recess and the principal face. The metallic pattern includes, as an inner layer, at least one metallic layer selected from a tungsten layer, a nickel layer, and a gold layer, and an aluminum layer as an outermost layer. The metallic pattern includes an exposed portion corresponding to a part of the metallic layer constituting the inner layer which part is exposed at the principal face.

Abstract: A wiring board includes a substrate for mounting a light emitting element; and a reflective film positioned on a surface of the substrate and reflecting light rays that are emitted from the light emitting element. The reflective film is formed of a plurality of adjacent columnar crystals extending in a perpendicular direction with respect to the surface of the substrate. A surface of the plurality of adjacent columnar crystals is in continuous at a surface of the reflective film.

Abstract: An electrode pattern (13) formed on a ceramics layer (2) in a substrate for a light emitting device (circuit board (320)) of the present invention includes a first metal layer (5), a second metal layer (7), and an electrode terminal unit (10), and the thickness of a part at which the electrode terminal unit (10) is not formed in the electrode pattern (13) is at least equal to or greater than 35 ?m. Accordingly, it is possible to suppress heat resistance to be low.

Abstract: A substrate includes a base made of a metal material, a thermally conductive, light-reflective ceramic insulating layer, and a buffer layer formed between the base and the ceramic insulating layer and having a smaller linear expansion coefficient than the base.

Abstract: In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate (5) includes an intermediate layer (11) containing ceramic which is formed on the surface of the aluminum base (10) by using an aerosol deposition method.

Abstract: An electrode pattern (13) formed on a ceramics layer (2) in a substrate for a light emitting device (circuit board (320)) of the present invention includes a first metal layer (5), a second metal layer (7), and an electrode terminal unit (10), and the thickness of a part at which the electrode terminal unit (10) is not formed in the electrode pattern (13) is at least equal to or greater than 35 ?m. Accordingly, it is possible to suppress heat resistance to be low.