Abstract: A medical light source device includes: a first light source configured to emit laser light; a second light source configured to emit measurement light for measuring a connection state between a light guide configured to guide the laser light and an emission optical system configured to irradiate a subject with the laser light through the light guide to the light guide; and a control unit configured to control output of the laser light in the first light source based on return light of the measurement light emitted from the second light source.

Abstract: A medical detection attachment includes: an attachment body attached to a connection portion between a light guide configured to guide a laser beam and a rigid endoscope configured to irradiate a subject with the laser beam via the light guide; a first detector provided in the attachment body and configured to detect connection between the attachment body and the rigid endoscope; and a second detector provided in the attachment body and configured to detect connection between the attachment body and the light guide.

Abstract: A light stabilizer used for an electronic device including a plurality of electronic parts including a light source, a main power source for supplying a drive current to the electronic parts, and a start button for the light source, wherein the light stabilizer comprises, a heating power source that supplies a heating current to the light source to make the light source self-heat in a non-light emitting state, and a control section that executes control so that after the main power source is turned on, the heating current is supplied to the light source firstly out of the plurality of electronic parts to increase temperature of the light source to the degree higher than dew point temperature, and when the start button is pressed down, the drive current is supplied to make the light source emit light.

Abstract: A heat sink enabled to prevent structural deterioration of an inner wall of a flow channel caused by corrosion a semiconductor laser device are provided. The heat sink includes a main body, a flow channel which is provided in the main body, and inside which a cooling medium passes through, and a passivation film covering an inner-wall surface of the flow channel.

Abstract: A light stabilizer used for an electronic device including a plurality of electronic parts including a light source, a main power source for supplying a drive current to the electronic parts, and a start button for the light source, wherein the light stabilizer comprises, a heating power source that supplies a heating current to the light source to make the light source self-heat in a non-light emitting state, and a control section that executes control so that after the main power source is turned on, the heating current is supplied to the light source firstly out of the plurality of electronic parts to increase temperature of the light source to the degree higher than dew point temperature, and when the start button is pressed down, the drive current is supplied to make the light source emit light.

Abstract: A bending machine has an upper table and a lower table. An input part is provided for inputting product information. A bending order determiner is provided for determining a bending order of the workpiece. A mold determiner is provided for determining the mold necessary for bending the workpiece. A layout determiner is provided for determining layout of the mold. A positioning information calculator is provided for calculating a position of the workpiece with respect to the mold determined by the layout determiner as work position information. A navigation member is provided for navigating a position of the workpiece to the operator by movement in the horizontal direction on the basis of the work position information calculated by the positioning information calculator.

Abstract: A transmission line with a bending portion is provided, which line comprises any one of a coplanar line, another coplanar waveguide line formed on the dielectric substrate under which a ground layer is provided and a coplanar strip line. A chamfered portion is provided on the outer angular portion of the bending portion of the signal wiring conductor and a triangular conductor is disposed to an inner angular portion thereof. Given that length of the chamfered portion is defined as a, and length of the wiring edge side of the triangular conductor is defined as b and width of the signal wiring conductor is defined as c, it is arranged such that a is greater than b+c×square root of 2. Thereby, a transmission line or an optical module of smaller reflection loss at the bending portion thereof and of improved high-frequency characteristics is provided.

Abstract: A bending machine has an upper table and a lower table. An input part is provided for inputting product information. A bending order determiner is provided for determining a bending order of the workpiece. A mold determiner is provided for determining the mold necessary for bending the workpiece. A layout determiner is provided for determining layout of the mold. A positioning information calculator is provided for calculating a position of the workpiece with respect to the mold determined by the layout determiner as work position information. A navigation member is provided for navigating a position of the workpiece to the operator by movement in the horizontal direction on the basis of the work position information calculated by the positioning information calculator.

Abstract: The present invention provides an optical module, and an optical transmission line comprising the optical module. The optical module has a structure in which an optical-modulator-mounted carrier is formed of a semiconductor substrate; a transmission line on the carrier is formed of a coplanar waveguide; a transmission line for inputting a signal into the transmission line is formed on a dielectric substrate; the transmission line on the input side which is a grounded coplanar waveguide is coupled by a conversion line to the transmission line on the output side which is a coplanar waveguide; and an electrical connection between the transmission lines is made by use of a conductor wire.

Abstract: An optical coupling apparatus having a temperature control element on which a semiconductor light emitting element, a substrate and a lens are mounted, the semiconductor light emitting element being mounted on the substrate, and rays of light from the semiconductor light emitting element being introduced into the lens. A base on which the temperature control element is disposed, a through-hole portion formed in a housing wall portion installed on the base, penetrating through the housing wall portion and having a wall surface portion longer than a thickness of the housing wall portion and an optical fiber communicated with the through-hole portion and receiving converted light from the lens introduced thereto. A length of the substrate in a direction connecting the light emitting element to the optical fiber is within a range from 0.1 to 0.25 with respect to a length of the base sandwiched by the housing walls of the substrate.

Abstract: In a semiconductor laser module, in order to sufficiently reduce the thermal stress arising in a due to the bonding of elements when they are packaged and to improve the yield of production, the semiconductor laser module is provided with a semiconductor laser element, a submount bonded to the semiconductor laser element with a solder layer in-between and thereby mounted with it, and a base mounted with this submount with another solder layer in-between. Herein, T/W?0.15 holds, where W is the width of the submount in the direction orthogonal to the optical axis of the semiconductor laser element and T is the thickness of the submount.

Abstract: The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.

Abstract: An optical coupling apparatus having a temperature control element on which a semiconductor light emitting element, a substrate and a lens are mounted, the semiconductor light emitting element being mounted on the substrate, and rays of light from the semiconductor light emitting element being introduced into the lens. A base on which the temperature control element is disposed, a through-hole portion formed in a housing wall portion installed on the base, penetrating through the housing wall portion and having a wall surface portion longer than a thickness of the housing wall portion and an optical fiber communicated with the through-hole portion and receiving converted light from the lens introduced thereto. A length of the substrate in a direction connecting the light emitting element to the optical fiber is within a range from 0.1 to 0.25 with respect to a length of the base sandwiched by the housing walls of the substrate.

Abstract: According to the present invention there are provided a transmission line and an optical module having the transmission line, the transmission line having on a dielectric substrate a first signal wiring conductor, a second signal wiring conductor insulated from the first signal wiring conductor, a first electrode disposed near the first and second signal wiring conductors, a second electrode disposed near the second signal wiring conductor, and a ground wiring conductor disposed in adjacency to the second electrode, wherein a passing frequency band can be changed by changing the connection of conductor wires.

Abstract: The present invention provides an optical module, and an optical transmission line comprising the optical module. The optical module has a structure in which an optical-modulator-mounted carrier is formed of a semiconductor substrate; a transmission line on the carrier is formed of a coplanar waveguide; a transmission line for inputting a signal into the transmission line is formed on a dielectric substrate; the transmission line on the input side which is a grounded coplanar waveguide is coupled by a conversion line to the transmission line on the output side which is a coplanar waveguide; and an electrical connection between the transmission lines is made by use of a conductor wire.

Abstract: The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.

Abstract: In a semiconductor laser module, in order to sufficiently reduce the thermal stress arising in a due to the bonding of elements when they are packaged and to improve the yield of production, the semiconductor laser module is provided with a semiconductor laser element, a submount bonded to the semiconductor laser element with a solder layer in-between and thereby mounted with it, and a base mounted with this submount with another solder layer in-between. Herein, T/W≧0.15 holds, where W is the width of the submount in the direction orthogonal to the optical axis of the semiconductor laser element and T is the thickness of the submount.

Abstract: In an optical coupling apparatus, an optical isolator and an optical fiber are arranged inside a pipe of a side surface of a package. A distal end of the optical fiber is arranged within a range of 3.0 mm from an inner/outer surface of the side surface of the package and a distance from a laser diode to the distal end is within a range from 3.5 to 7.5 mm. Distance from the inner side surface of the package to a Peltier device is within a range of 6.0 mm. A metallize pattern film applied to a terminal substrate of the package and the Peltier device are connected through wiring bonding and a connection position is closer to the optical fiber than a lead terminal provided to the terminal substrate of the package that corresponds to the Peltier device.

Abstract: According to the present invention there are provided a transmission line and an optical module having the transmission line, the transmission line having on a dielectric substrate a first signal wiring conductor, a second signal wiring conductor insulated from the first signal wiring conductor, a first electrode disposed near the first and second signal wiring conductors, a second electrode disposed near the second signal wiring conductor, and a ground wiring conductor disposed in adjacency to the second electrode, wherein a passing frequency band can be changed by changing the connection of conductor wires.

Abstract: A transmission line with a bending portion is provided, which line comprises any one of a coplanar line, another coplanar waveguide line formed on the dielectric substrate under which a ground layer is provided and a coplanar strip line. A chamfered portion is provided on the outer angular portion of the bending portion of the signal wiring conductor and a triangular conductor is disposed to an inner angular portion thereof. Given that length of the chamfered portion is defined as a, and length of the wiring edge side of the triangular conductor is defined as b and width of the signal wiring conductor is defined as c, it is arranged such that a is greater than b+c×square root of 2. Thereby, a transmission line or an optical module of smaller reflection loss at the bending portion thereof and of improved high-frequency characteristics is provided.