Patents by Inventor Yoshiaki Shia

Yoshiaki Shia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9022093
    Abstract: A method of casting a semi-liquid or semi-solid iron-based alloy, the method including: applying, to a part or to the whole of an uppermost surface of an inner surface of a die, a lubricating die-release agent in which particles including at least one selected from molybdenum disulfide, graphite, tungsten disulfide, boron nitride, chrome oxide and boric oxide are dispersed in a solvent; and thereafter casting by using the die.
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: May 5, 2015
    Assignee: Nippon Steel & Sumitomo Corporation
    Inventor: Yoshiaki Shia
  • Patent number: 8555691
    Abstract: A metal plate material hot molding apparatus is provided for press molding a heated metal plate material. The apparatus may include supply piping for a cooling medium in a mold, and ejection holes penetrating from a molding surface of the mold to the supply piping. The exemplary apparatus may also include discharge piping for the cooling medium situated in the mold, and discharge holes penetrating from the molding surface of the mold to the discharge piping, and cooling piping. Molding procedure can be performed while the cooling medium is ejected from the ejection holes to a gap between the metal plate material and the mold.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: October 15, 2013
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Yasushi Kurisu, Yoshiaki Shia, Kazuto Yamamura, Yuuichi Ishimori, Hiroyuki Mitake, Tetsuo Shima, Hiroshi Fukuchi, Norimasa Yamasaki
  • Patent number: 8327680
    Abstract: A metal plate material hot molding apparatus is provided for press molding a heated metal plate material. The apparatus may include supply piping for a cooling medium in a mold, and ejection holes penetrating from a molding surface of the mold to the supply piping. The exemplary apparatus may also include discharge piping for the cooling medium situated in the mold, and discharge holes penetrating from the molding surface of the mold to the discharge piping, and cooling piping. Molding procedure can be performed while the cooling medium is ejected from the ejection holes to a gap between the metal plate material and the mold.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: December 11, 2012
    Assignee: Nippon Steel Corporation
    Inventors: Yasushi Kurisu, Yoshiaki Shia, Kazuto Yamamura, Yuuichi Ishimori, Hiroyuki Mitake, Tetsuo Shima, Hiroshi Fukuchi, Norimasa Yamasaki
  • Patent number: 8307687
    Abstract: A metal plate material hot molding apparatus is provided for press molding a heated metal plate material. The apparatus may include supply piping for a cooling medium in a mold, and ejection holes penetrating from a molding surface of the mold to the supply piping. The exemplary apparatus may also include discharge piping for the cooling medium situated in the mold, and discharge holes penetrating from the molding surface of the mold to the discharge piping, and cooling piping. Molding procedure can be performed while the cooling medium is ejected from the ejection holes to a gap between the metal plate material and the mold.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: November 13, 2012
    Assignee: Nippon Steel Corporation
    Inventors: Yasushi Kurisu, Yoshiaki Shia, Kazuto Yamamura, Yuuichi Ishimori, Hiroyuki Mitake, Tetsuo Shima, Hiroshi Fukuchi, Norimasa Yamasaki
  • Patent number: 8069697
    Abstract: A metal plate material hot molding apparatus is provided for press molding a heated metal plate material. The apparatus may include supply piping for a cooling medium in a mold, and ejection holes penetrating from a molding surface of the mold to the supply piping. The exemplary apparatus may also include discharge piping for the cooling medium situated in the mold, and discharge holes penetrating from the molding surface of the mold to the discharge piping, and cooling piping. Molding procedure can be performed while the cooling medium is ejected from the ejection holes to a gap between the metal plate material and the mold.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: December 6, 2011
    Assignee: Nippon Steel Corporation
    Inventors: Yasushi Kurisu, Yoshiaki Shia, Kazuto Yamamura, Yuuichi Ishimori, Hiroyuki Mitake, Tetsuo Shima, Hiroshi Fukuchi, Norimasa Yamasaki
  • Publication number: 20110219843
    Abstract: A metal plate material hot molding apparatus is provided for press molding a heated metal plate material. The apparatus may include supply piping for a cooling medium in a mold, and ejection holes penetrating from a molding surface of the mold to the supply piping. The exemplary apparatus may also include discharge piping for the cooling medium situated in the mold, and discharge holes penetrating from the molding surface of the mold to the discharge piping, and cooling piping. Molding procedure can be performed while the cooling medium is ejected from the ejection holes to a gap between the metal plate material and the mold.
    Type: Application
    Filed: May 24, 2011
    Publication date: September 15, 2011
    Applicant: Nippon Steel Corporation
    Inventors: Yasushi Kurisu, Yoshiaki Shia, Kazuto Yamamura, Yuuichi Ishimori, Hiroyuki Mitake, Tetsuo Shima, Hiroshi Fukuchi, Norimasa Yamasaki
  • Publication number: 20110219849
    Abstract: A metal plate material hot molding apparatus is provided for press molding a heated metal plate material. The apparatus may include supply piping for a cooling medium in a mold, and ejection holes penetrating from a molding surface of the mold to the supply piping. The exemplary apparatus may also include discharge piping for the cooling medium situated in the mold, and discharge holes penetrating from the molding surface of the mold to the discharge piping, and cooling piping. Molding procedure can be performed while the cooling medium is ejected from the ejection holes to a gap between the metal plate material and the mold.
    Type: Application
    Filed: May 24, 2011
    Publication date: September 15, 2011
    Applicant: Nippon Steel Corporation
    Inventors: Yasushi Kuriso, Yoshiaki Shia, Kazuto Yamamura, Yuuichi Ishimori, Hiroyuki Mitake, Tetsuo Shima, Hiroshi Fukuchi, Norimasa Yamasaki
  • Publication number: 20110219848
    Abstract: A metal plate material hot molding apparatus is provided for press molding a heated metal plate material. The apparatus may include supply piping for a cooling medium in a mold, and ejection holes penetrating from a molding surface of the mold to the supply piping. The exemplary apparatus may also include discharge piping for the cooling medium situated in the mold, and discharge holes penetrating from the molding surface of the mold to the discharge piping, and cooling piping. Molding procedure can be performed while the cooling medium is ejected from the ejection holes to a gap between the metal plate material and the mold.
    Type: Application
    Filed: May 24, 2011
    Publication date: September 15, 2011
    Applicant: Nippon Steel Corporation
    Inventors: Yasushi Kurisu, Yoshiaki Shia, Kazuto Yamamura, Yuuichi Ishimori, Hiroyuki Mitake, Tetsuo Shima, Hiroshi Fukuchi, Norimasa Yamasaki
  • Publication number: 20110088864
    Abstract: A method of casting a semi-liquid or semi-solid iron-based alloy, the method including: applying, to a part or to the whole of an uppermost surface of an inner surface of a die, a lubricating die-release agent in which particles including at least one selected from molybdenum disulfide, graphite, tungsten disulfide, boron nitride, chrome oxide and boric oxide are dispersed in a solvent; and thereafter casting by using the die.
    Type: Application
    Filed: June 15, 2009
    Publication date: April 21, 2011
    Inventor: Yoshiaki Shia
  • Publication number: 20070017272
    Abstract: A metal plate material hot molding apparatus is provided for press molding a heated metal plate material. The apparatus may include supply piping for a cooling medium in a mold, and ejection holes penetrating from a molding surface of the mold to the supply piping. The exemplary apparatus may also include discharge piping for the cooling medium situated in the mold, and discharge holes penetrating from the molding surface of the mold to the discharge piping, and cooling piping. Molding procedure can be performed while the cooling medium is ejected from the ejection holes to a gap between the metal plate material and the mold.
    Type: Application
    Filed: September 28, 2004
    Publication date: January 25, 2007
    Inventors: Yasushi Kurisu, Yoshiaki Shia, Kazuto Yamamura, Yuuichi Ishimori, Hiroyuki Mitake, Tetsuo Shima, Hiroshi Fukuchi, Norimasa Yamasaki
  • Patent number: 5181779
    Abstract: A thermocouple temperature sensor employs a protecting tube made of metal-boride-based ceramics, and a platinum -rhodium-based thermocouple. To prevent a deterioration of the thermocouple due to a reducing gas generated in the protecting when used at a high service temperature, the thermocouple is placed in an insulation tube, which is placed inside the protecting tube. In addition, a front end portion of the insulation tube is covered with a noble-metal cap mainly composed of platinum group metal, to prevent the reducing gas generated in the protecting tube from reaching a connection point of the thermocouple. The top end of the protecting tube is open, and a terminal box with a ventilation means to smoothly discharge the reducing gas in provided. This arrangement remarkably prolongs the service life of the thermocouple, and thus it is able to continuously measure the temperature of molten pig iron and molten steel for a long interval.
    Type: Grant
    Filed: July 22, 1991
    Date of Patent: January 26, 1993
    Assignees: Nippon Steel Corporation, Asahi Glass Co., Ltd.
    Inventors: Yoshiaki Shia, Hideaki Mori, Otojiro Kida, Hiroshi Taketsugu