Abstract: A method includes a step of applying an aqueous 2-package type first colored paint to form an uncured first colored coating film; a step of applying an aqueous 1-package type second colored paint to form an uncured second colored coating film; a step of applying a solvent-based 2-package type clear paint to form an uncured clear coating film; and a step of heating the uncured first colored coating film, the uncured second colored coating film and the uncured clear coating film to 75 to 100° C. to simultaneously cure these films. The solvent-based 2-package type clear paint contains a hydroxyl group-containing acrylic resin and a polyisocyanate compound in a ratio of 1.5 to 2.0 equivalents of isocyanate groups in the polyisocyanate compound relative to 1 equivalent of hydroxyl groups in the hydroxyl group-containing acrylic resin.

Abstract: An increase in the overall resistance value of a transistor is prevented by having different contact resistances for connections between conductors in different wiring layers. The transistor has a first conductive layer having a first resistivity formed over impurity diffusion regions, a first contact group connecting the first conductive layer and the impurity diffusion regions through holes, a second conductive layer having a second resistivity formed over the first conductive layer, and a second contact group connecting the first conductive layer and the second conductive layer through holes. The first contact group and the second contact group have a different total number of contacts.

Abstract: A clock signal supplying apparatus of the present invention permits each of sync detectors 11i to extract a clock signal CKi and a sync signal SYNi from a cell input data CIi and delivers in synchronism with the sync signal SYNi an input data DIi derived from the cell input data CIi. The clock signal CKi is transferred to a master clock generator 12 for generating a master clock MC. The input data DIi is delivered along with the sync signal SYNi to a clock signal supplying circuit 20i where it is judged from the first bit of the input data DIi whether the input data DIi is eligible or not.

Abstract: In a semiconductor package comprising a heat spreader, a heat sink, a wiring board, and a connector, a heat spreader mounted on a remaining region of the upper surface of a substrate. The heat sink is thermally connected to a primary integrated circuit chip through the heat spreader and to a secondary integrated circuit chip. The heat sink has electrical conductivity. The heat sink comprises a base plate and at least one connecting member which perpendicularly extends from the base plate. A wiring board has a plurality of contact holes and a plurality of contact slits. A connector is mounted on the wiring board. The connector has a plurality of contacts. The contacts comprises a plurality of socket portions and a plurality of terminal portions. The contacts are connected to an input/output pins with the input/output pins inserted into the respective socket portions. The terminal portions are inserted into the respective contact holes. The connector has at least one ground contact.