Patents by Inventor Yoshiaki Urahama

Yoshiaki Urahama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7713606
    Abstract: An adhesive product which has excellent glue cutting performance and provides an excellent finish to the pasted portion while effectively maintaining security is provided. An adhesive layer 10 is formed through pattern application, where an adhesive 100 is intermittently placed on the surface of a film 12, so that a broken paper phenomenon, such that the surface layer portion of a flap F1 or the vicinity of opening F2 adheres to the surface of the adhesive layer 10, and a white envelope F is ripped in the direction of the thickness, can be caused when a peeling movement for peeling the flap F1 from a state where the white envelope F is sealed via the adhesive layer 10.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: May 11, 2010
    Assignee: Kokuyo S&T Co., Ltd.
    Inventors: Hiroyuki Kasahara, Kazushige Kawashita, Yoshiaki Urahama
  • Publication number: 20100092773
    Abstract: A pressure-sensitive adhesive is constituted at least by one or two kinds or more of a polymer and a tackifier, the polymer is selected from the polymer obtained by polymerizing olefin unsaturated-group containing polymerizable monomer by an ordinary method, a copolymer obtained by copolymerizing a monomer mixture containing two or more types of olefin unsaturated-group containing polymerizable monomer by an ordinary method, and natural rubber, wherein the pressure-sensitive adhesive for available affixation has substantially no initial tack value and exerts adhesion by pressurization processing.
    Type: Application
    Filed: September 28, 2006
    Publication date: April 15, 2010
    Inventors: Hiroyuki Kasahara, Kazushige Kawashita, Koji Kishimoto, Yoshiaki Urahama
  • Publication number: 20060165936
    Abstract: An adhesive product which has excellent glue cutting performance and provides an excellent finish to the pasted portion while effectively maintaining security is provided. An adhesive layer 10 is formed through pattern application, where an adhesive 100 is intermittently placed on the surface of a film 12, so that a broken paper phenomenon, such that the surface layer portion of a flap F1 or the vicinity of opening F2 adheres to the surface of the adhesive layer 10, and a white envelope F is ripped in the direction of the thickness, can be caused when a peeling movement for peeling the flap F1 from a state where the white envelope F is sealed via the adhesive layer 10.
    Type: Application
    Filed: December 20, 2005
    Publication date: July 27, 2006
    Applicant: Kokuyo S&T Co., Ltd.
    Inventors: Hiroyuki Kasahara, Kazushige Kawashita, Yoshiaki Urahama
  • Patent number: 4279213
    Abstract: In a resin molded controlled-release product which comprises a volatile or elutable active agent dispersed in a substantially transparent and inert resin molded material, the improvement which comprises a colored material located inside or on the back surface of the molded product which is not visible through the product at the initial concentrations of the active agent, but is visible through the resin product at concentrations of the active agent at which the activity of the product is substantially extinct.
    Type: Grant
    Filed: March 20, 1980
    Date of Patent: July 21, 1981
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Yoshiaki Urahama, Tetuo Numoto