Abstract: A solid-state imaging device includes: first electrode pads formed on a first substrate on which photoelectric conversion elements included in pixels are arranged; second electrode pads formed on a second substrate having a reading unit that reads signals of the pixels; and connecting portions, one end being bonded to the first electrode pads and the other being bonded to the second electrode pads to electrically connect the first electrode pads and the second electrode pads to each other. The pixels are partitioned into areas for each unit pixel cell or each cell including pixels, first to n-th of the first electrode pads and first to m-th of the second electrode pads are allocated to the partitioned areas, and the first to n-th first electrode pads and the first to m-th second electrode pads allocated to the same partitioned area are electrically connected to each other via the connecting portions.