Abstract: An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

Abstract: An electronic component repair method for removing an electronic component soldered on a substrate, the method includes: mounting a heat transfer plate on the electronic component to be removed, the heat transfer plate being formed by bonding a plurality of heat transfer members via a heat insulating member, heating the heat transfer plate mounted on the electronic component by a heating unit, the heating unit heating individually each of the heat transfer members by different heat amount; and removing the electronic component from the substrate after the heating.

Abstract: Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.

Abstract: An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

Abstract: An electronic component repair method for removing an electronic component soldered on a substrate, the method includes: mounting a heat transfer plate on the electronic component to be removed, the heat transfer plate being formed by bonding a plurality of heat transfer members via a heat insulating member, heating the heat transfer plate mounted on the electronic component by a heating unit, the heating unit heating individually each of the heat transfer members by different heat amount; and removing the electronic component from the substrate after the heating.

Abstract: A laser processing method includes the steps of: preparing a long metal object to be irradiated; and irradiating the object with a laser beam at a certain portion in a longitudinal direction of the object. The irradiation is performed along a width direction of the object for both a first half path from one end to the other end of the object in the width direction and a return path from the other end to the one end so that the object can be bent.

Abstract: A method of processing a film substrate includes removing a portion of the film substrate; and fusing a part of the film substrate around the removed portion to seal scraps of the film substrate, which are generated when removing the portion of the film substrate, in the fused part of the film substrate.

Abstract: Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.

Abstract: Ultrasonic generating unit of a cleaning tank in a cleaning apparatus applies ultrasonic waves to cleaning fluid supplied into the cleaning tank from a supply port and fluid jetting unit having openings at locations corresponding to areas to be cleaned of an article to be cleaned jets the ultrasonic-applied cleaning fluid from the openings to the areas to be cleaned of the article to be cleaned.

Abstract: A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

Abstract: A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

Abstract: A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.

Abstract: A lap platen has a lapping surface contacting a surface of a work piece. A lap base has a support surface brought into contact with and supported by the lapping surface. An adapter has a first support part, a second support part and an arm part. The first support part is supported by the lap base. The work piece is attached to the second support part so that a surface of the work piece to be processed contacts the lapping surface. The arm part extends between the first and second support parts. A height adjusting mechanism adjusts a height from the lapping surface to the first support part. An inclination detector is provided to the adapter to detect an inclination of the adapter. The inclination of the adapter relative to the lapping surface is adjusted by adjusting the height of the first support part by the height adjusting mechanism.

Abstract: The cleaning apparatus for cleaning a cleaning target set in a cleaning tank filled with a washing fluid includes a flow-control unit for generating a predetermined flow of the washing fluid in the cleaning tank; and an ejection unit for ejecting the washing fluid disposed on a flow path of the predetermined flow of the washing fluid. The cleaning apparatus ejects the washing fluid to outside the cleaning tank by using the ejection unit in removing contaminants on a surface of the cleaning target by washing the cleaning target with the washing fluid. Also, a cleaning tank having substantially the same structure as that of the cleaning apparatus is provided. Moreover, a cleaning method implemented using the cleaning apparatus as described above or the like is provided.

Abstract: A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

Abstract: A bonding method includes a pasting process of pasting a face which is a face except the element formation surface of a rod, with a predetermined face of an adherend using a bonding material to be heat-cured, an absorption process of fixing angular relation between a direction of the adherend and a direction of the rod into predetermined angular relation by absorbing the adherend and rod on a surface of the stage on the surface of which the adherend and rod, which are pasted in the pasting process, are placed, and a heat cure process of heating and curing the bonding material in a state that the direction of the adherend and the direction of the rod are fixed to the predetermined angular relation by the absorption process.

Abstract: A lapping apparatus includes a lapping plate having a lapping surface thereon that moves relative to a work. The lapping apparatus can adjust an inclination of the work in a latitudinal direction, thereby obtained preferable parallelization of both a reading elements and writing element to the lapping surface. As a result, the lapping apparatus can provide magnetic heads suitable for the perpendicular recording.

Abstract: A laser processing method includes the steps of: preparing a long metal object to be irradiated; and irradiating the object with a laser beam at a certain portion in a longitudinal direction of the object. The irradiation is performed along a width direction of the object for both a first half path from one end to the other end of the object in the width direction and a return path from the other end to the one end so that the object can be bent.

Abstract: A cleaning apparatus is provided with a plurality of cleaning mechanisms such as a blast unit, a vibration brush unit and a pulse spraying unit. Cleaning of objects with the blast unit and vibration brush unit is conducted within cleaning liquid reserved in a cleaning vessel in order to prevent electrostatic discharge (ESD) breakdown. Cleaning the objects with the pulse spraying unit is conducted after taking out the objects from the cleaning liquid and thereby re-adhesion of contamination remaining in the cleaning liquid to the objects is prevented.

Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.