Patents by Inventor Yoshichika ISHIKAWA

Yoshichika ISHIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer printed circuit board and method of manufacturing the same
    Patent number: 9668362
    Abstract: When laminating two resin films so that sides where the conductive patterns are not formed face each other, and when laminating other resin films so that sides where the conductive patterns are formed and the sides where the conductive patterns are not formed to face each other, a plurality of resin films each of which has the same resin thickness are used for the other resin films, and two resin films having a sum of resin thickness that is the same as the resin thickness of the other single resin film are used for the two resin films. Accordingly, dielectric thicknesses between the conductive patterns formed in the adjoining resin films can be made even so that an impedance can be calculated easily, and it becomes possible to ease the circuit design.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: May 30, 2017
    Assignee: DENSO CORPORATION
    Inventors: Toshikazu Harada, Yoshichika Ishikawa
  • MULTILAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150060118
    Abstract: When laminating two resin films so that sides where the conductive patterns are not formed face each other, and when laminating other resin films so that sides where the conductive patterns are formed and the sides where the conductive patterns are not formed to face each other, a plurality of resin films each of which has the same resin thickness are used for the other resin films, and two resin films having a sum of resin thickness that is the same as the resin thickness of the other single resin film are used for the two resin films. Accordingly, dielectric thicknesses between the conductive patterns formed in the adjoining resin films can be made even so that an impedance can be calculated easily, and it becomes possible to ease the circuit design.
    Type: Application
    Filed: August 22, 2014
    Publication date: March 5, 2015
    Inventors: Toshikazu HARADA, Yoshichika ISHIKAWA