Abstract: A wafer loading/unloading device and a method for producing wafers in which positioning and mounting can be effected in a stable manner when attaching the wafer to the polishing head and which make it possible to receive or transfer the polished wafer in a stable manner. The wafer loading/unloading device includes a main body portion for supporting a wafer W, a swinging shaft supporting a swinging arm connected to the main body portion, and an arm ascending/descending mechanism supporting the swinging arm such that it can ascend and descend. The main body portion is equipped with a wafer support portion and an action force absorbing mechanism for absorbing vertical force acting on the wafer support portion, so that the impact when attaching or detaching the wafer to or from the polishing head is mitigated. Thus, damage to the wafer and the polishing head is prevented and the wafer is transferred in a stable manner.