Patents by Inventor Yoshie Noguchi

Yoshie Noguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170360737
    Abstract: The present invention addresses the problem of providing a versatile, flavorful long-chain polyunsaturated fatty-acid-containing fat having exceptional oxidation stability, and a food that utilizes the fat. The problem can be solved by a long-chain polyunsaturated fatty-acid-containing fat having a specific linoleic acid content and a specific tocopherol-tocotrienol content, the fat containing a fatty acid having five or more double bonds.
    Type: Application
    Filed: September 29, 2015
    Publication date: December 21, 2017
    Applicant: FUJI OIL HOLDINGS INC.
    Inventors: Masaharu KATO, Miwako MORIKAWA, Yoshie NOGUCHI
  • Patent number: 6500693
    Abstract: A semiconductor device is mounted on a heating stage, and the temperature of the semiconductor device is set to be at least 60° C. and lower than the melting point of a solder. With the use of an ejecting head, molten solder is ejected from a nozzle towards an electrode part. The molten solder ejected from the ejecting head impinges upon the surface of the electrode part. Upon impingement, the molten solder spreads over the surface of the electrode part by wetting, thereby to form a bump electrode on the electrod part. Sufficient joining strength between the bump electrode and the underlying conductive region is ensured.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: December 31, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Yoshie Noguchi
  • Publication number: 20020055255
    Abstract: A semiconductor device is mounted on a heating stage, and the temperature of the semiconductor device is set to be at least 60° C. and lower than the melting point of the solder. With the use of an ejecting head, the molten solder is ejected from a nozzle towards an electrode part. The molten solder ejected from the ejecting head impinges upon the surface of the electrode part. By impingement, the molten solder spreads over the surface of the electrode part by wetting, thereby to form a bump electrode on the electrode part. This ensures a joining strength between the bump electrode and the underlying conductive region.
    Type: Application
    Filed: April 12, 2001
    Publication date: May 9, 2002
    Inventor: Yoshie Noguchi
  • Patent number: 5253040
    Abstract: A projection aligner includes a light source, a condenser lens system for directing light from the light source onto a mask on which a circuit pattern is formed, a projecting lens system for collecting on the surface of a wafer the light transmitted through the mask, and an aperture member disposed between the light source and the condenser lens system. The aperture member includes a transmitting zone for transmitting light from the light source and a phase shift member for producing a predetermined phase difference between light transmitted through the transmitting zone and light transmitted through a region surrounding the transmitting zone.
    Type: Grant
    Filed: November 5, 1991
    Date of Patent: October 12, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kazuya Kamon, Yasuhito Myoi, Teruo Miyamoto, Yoshie Noguchi, Masaaki Tanaka
  • Patent number: 5144362
    Abstract: A projection aligner includes a light source, a condenser lens system for directing light from the light source onto a mask on which a circuit pattern is formed, a projecting lens system for collecting on the surface of a wafer the light transmitted through the mask, and a pupillary member disposed on a pupillary surface of the projecting lens system. The pupillary member includes at least one transmitting zone for transmitting the light transmitted through the mask including a phase shift member for producing a predetermined phase shift in light transmitted through part of the transmitting zone.
    Type: Grant
    Filed: November 12, 1991
    Date of Patent: September 1, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kazuya Kamon, Yasuhito Myoi, Teruo Miyamoto, Yoshie Noguchi, Masaaki Tanaka