Patents by Inventor Yoshie TACHIBANA
Yoshie TACHIBANA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11911854Abstract: Provided is a solder alloy, a solder paste, a solder preform, and a solder joint which suppress chip cracking during cooling, improve the heat dissipation characteristics of the solder joint, and exhibit high joint strength at high temperatures. The solder alloy has an alloy composition of, by mass: Sb: 9.0 to 33.0%; Ag: more than 4.0% and less than 11.0%; and Cu: more than 2.0% and less than 6.0%, with the balance of Sn. Moreover, the solder paste, the solder preform, and the solder joint all contain said solder alloy.Type: GrantFiled: December 14, 2019Date of Patent: February 27, 2024Assignee: Senju Metal Industry Co., Ltd.Inventors: Yoshie Tachibana, Takeshi Sakamoto
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Patent number: 11904416Abstract: Provided are a solder alloy, a solder powder, a solder paste, and a solder joint having a low liquidus temperature and not too low solidus temperature. The solder alloy has an alloy composition of, by mass: Ag: 2.0 to 4.0%; Cu: 0.51 to 0.79%; and Bi: more than 4.0% and 8.0% or less, with the balance being Sn. The solder alloy has a liquidus temperature of less than 217° C.Type: GrantFiled: March 9, 2022Date of Patent: February 20, 2024Assignee: Senju Metal Industry Co., Ltd.Inventors: Yoshie Tachibana, Tomoki Sasaki, Norikazu Sakai, Yoshihiro Yamaguchi
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Patent number: 11858071Abstract: Provided are a solder alloy, a solder paste, a solder ball, a solder preform, and a solder joint, which have a melting temperature within a predetermined range, and high tensile strength and shear strength, suppress generation of voids, and have excellent mountability due to their thin oxide films. The solder alloy has an alloy composition consisting of, by mass %, Ag: 2.5 to 3.7%, Cu: 0.25 to 0.95%, Bi: 3.0 to 3.9%, and In: 0.5 to 2.3%, with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 8.1?Ag+2Cu+Bi+In ?11.5 (1), and 1.00?(Bi+In)/Ag?1.66 (2). Ag, Cu, Bi and In in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.Type: GrantFiled: October 21, 2022Date of Patent: January 2, 2024Assignee: Senju Metal Industry Co., Ltd.Inventors: Yoshie Tachibana, Ryuki Horie
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Publication number: 20230364721Abstract: A brazing paste contain a brazing material in an amount of 80% by mass or more and 95% by mass or less; and a binder in an amount of 5% by mass or more and 20% by mass or less. The brazing material contains a flux in an amount of 2% by mass or more and 5% by mass or less. The binder contains a solid solvent containing two or more hydroxyl groups and having 8 to 10 carbon atoms, and a liquid solvent. When the binder does not contain a thixotropic agent, the liquid solvent is contained in an amount of 68% by mass or more with respect to a total of the binder, and when the binder contains a thixotropic agent, the thixotropic agent is contained in an amount of 11% by mass or less with respect to a total of the binder.Type: ApplicationFiled: April 24, 2023Publication date: November 16, 2023Inventors: Yoshie TACHIBANA, Hiroshi KAWANAGO, Takashi AKAGAWA, Satoshi MASUDA, Masaki SUGIYAMA, Yosuke KAZUMOTO, Hisaya SUGIMOTO, Hiroaki HATSUYAMA
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Publication number: 20230364720Abstract: A brazing paste contain 80% by mass or more and 95% by mass or less of a brazing material; and 5% by mass or more and 20% by mass or less of a binder. The binder contains a solid solvent containing two or more hydroxyl groups and having 5 to 7 carbon atoms, and a liquid solvent.Type: ApplicationFiled: May 3, 2023Publication date: November 16, 2023Applicants: SENJU METAL INDUSTRY CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yoshie TACHIBANA, Hiroshi KAWANAGO, Takashi AKAGAWA, Satoshi MASUDA, Masaki SUGIYAMA, Yosuke KAZUMOTO, Hisaya SUGIMOTO, Hiroaki HATSUYAMA
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Patent number: 11772204Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).Type: GrantFiled: March 6, 2023Date of Patent: October 3, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Shunsuke Koga, Tomoki Sasaki, Yoshie Tachibana, Shunsaku Yoshikawa
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Publication number: 20230201976Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).Type: ApplicationFiled: March 6, 2023Publication date: June 29, 2023Inventors: Shunsuke KOGA, Tomoki SASAKI, Yoshie TACHIBANA, Shunsaku YOSHIKAWA
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Publication number: 20230127584Abstract: Provided are a solder alloy, a solder paste, a solder ball, a solder preform, and a solder joint, which have a melting temperature within a predetermined range, and high tensile strength and shear strength, suppress generation of voids, and have excellent mountability due to their thin oxide films. The solder alloy has an alloy composition consisting of, by mass %, Ag: 2.5 to 3.7%, Cu: 0.25 to 0.95%, Bi: 3.0 to 3.9%, and In: 0.5 to 2.3%, with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 8.1?Ag+2Cu+Bi+In ?11.5 (1), and 1.00?(Bi+In)/Ag?1.66 (2). Ag, Cu, Bi and In in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.Type: ApplicationFiled: October 21, 2022Publication date: April 27, 2023Inventors: Yoshie Tachibana, Ryuki Horie
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Patent number: 11628520Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).Type: GrantFiled: March 29, 2022Date of Patent: April 18, 2023Assignee: Senju Metal Industry Co., Ltd.Inventors: Shunsuke Koga, Tomoki Sasaki, Yoshie Tachibana, Shunsaku Yoshikawa
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Publication number: 20220324062Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).Type: ApplicationFiled: March 29, 2022Publication date: October 13, 2022Inventors: Shunsuke KOGA, Tomoki SASAKI, Yoshie TACHIBANA, Shunsaku YOSHIKAWA
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Publication number: 20220288725Abstract: Provided are a solder alloy, a solder powder, a solder paste, and a solder joint having a low liquidus temperature and not too low solidus temperature. The solder alloy has an alloy composition of, by mass: Ag: 2.0 to 4.0%; Cu: 0.51 to 0.79%; and Bi: more than 4.0% and 8.0% or less, with the balance being Sn. The solder alloy has a liquidus temperature of less than 217° C.Type: ApplicationFiled: March 9, 2022Publication date: September 15, 2022Inventors: Yoshie Tachibana, Tomoki Sasaki, Norikazu Sakai, Yoshihiro Yamaguchi
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Patent number: 11278955Abstract: An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor. An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 ?m or more and 15 ?m or less and having a median diameter D50 of 2 ?m or more and 5 ?m or less; a silver powder B having a particle size in the range of 25 ?m or more and 100 ?m or less and having a median diameter D50 of 30 ?m or more and 40 ?m or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.Type: GrantFiled: September 30, 2020Date of Patent: March 22, 2022Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Jinting Jiu, Yoshie Tachibana
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Publication number: 20220040758Abstract: An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor. An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 ?m or more and 15 ?m or less and having a median diameter D50 of 2 ?m or more and 5 ?m or less; a silver powder B having a particle size in the range of 25 ?m or more and 100 ?m or less and having a median diameter D50 of 30 ?m or more and 40 ?m or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.Type: ApplicationFiled: September 30, 2020Publication date: February 10, 2022Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Jinting JIU, Yoshie TACHIBANA
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Publication number: 20220040801Abstract: Provided is a solder alloy, a solder paste, a solder preform, and a solder joint which suppress chip cracking during cooling, improve the heat dissipation characteristics of the solder joint, and exhibit high joint strength at high temperatures. The solder alloy has an alloy composition of, by mass: Sb: 9.0 to 33.0%; Ag: more than 4.0% and less than 11.0%; and Cu: more than 2.0% and less than 6.0%, with the balance of Sn. Moreover, the solder paste, the solder preform, and the solder joint all contain said solder alloy.Type: ApplicationFiled: December 14, 2019Publication date: February 10, 2022Inventors: Yoshie Tachibana, Takeshi Sakamoto
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Patent number: 10968932Abstract: A solder joint in which an electronic component with a back metal is bonded to a substrate by a solder alloy. The solder alloy includes: a solder alloy layer having an alloy composition consisting of, in mass %: Ag: 2 to 4%, Cu: 0.6 to 2%, Sb: 9.0 to 12%, Ni: 0.005 to 1%, optionally Co: 0.2% or less and Fe: 0.1% or less, with the balance being Sn; an Sn—Sb intermetallic compound phase; a back metal-side intermetallic compound layer formed at an interface between the back metal and the solder alloy; and a substrate-side intermetallic compound layer formed at an interface between the substrate and the solder alloy. The solder alloy layer exists at least one of between the Sn—Sb intermetallic compound phase and the back metal-side intermetallic compound layer, and between the Sn—Sb intermetallic compound phase and the substrate-side intermetallic compound layer.Type: GrantFiled: October 30, 2018Date of Patent: April 6, 2021Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Minoru Ueshima, Yoshie Tachibana
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Patent number: 10967464Abstract: A solder alloy having an alloy composition consisting of, in mass %, Ag: 1% to 4%, Cu: 0.5% to 0.8%, Bi: more than 4.8% and 5.5% or less. Sb: more than 1.5% and 5.5% or less, Ni: 0.01% or more and less than 0.1%, Co: more than 0.001% and 0.1% or less, the balance being Sn. The alloy composition satisfies the following three relationships: 0.020%?Ni+Co?0.105%; 9.1%?Sb+Bi?10.4%; and 4.05×10?3?(Ni+Co)/(Bi+Sb)?1.00×10?2, where Ni, Co, Bi, and Sb each represent a content (mass %) thereof in the solder alloy.Type: GrantFiled: March 30, 2018Date of Patent: April 6, 2021Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Naoko Izumita, Shunsaku Yoshikawa, Yoshie Tachibana
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Publication number: 20200398382Abstract: The present invention provides a solder paste that suppresses generation of voids and has excellent reliability. A solder paste contains Sn-based powder, SnSb-based alloy powder with Sn and 10 mass % or more of Sb, and flux, wherein a liquidus temperature of the SnSb-based alloy powder is higher than a liquidus temperature of the Sn-based powder, and a content ratio of the Sn-based powder and the SnSb-based alloy powder is 75:25 to 95:5. Preferably, the content ratio of the Sn-based powder to the SnSb-based alloy powder is 80:20 to 90:10.Type: ApplicationFiled: April 9, 2019Publication date: December 24, 2020Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Takeshi SAKAMOTO, Yoshie TACHIBANA, Shunsuke KOGA
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Publication number: 20200284282Abstract: A solder joint in which an electronic component with a back metal is bonded to a substrate by a solder alloy. The solder alloy includes: a solder alloy layer having an alloy composition consisting of, in mass %: Ag: 2 to 4%, Cu: 0.6 to 2%, Sb: 9.0 to 12%, Ni: 0.005 to 1%, optionally Co: 0.2% or less and Fe: 0.1% or less, with the balance being Sn; an Sn—Sb intermetallic compound phase; a back metal-side intermetallic compound layer formed at an interface between the back metal and the solder alloy; and a substrate-side intermetallic compound layer formed at an interface between the substrate and the solder alloy. The solder alloy layer exists at least one of between the Sn—Sb intermetallic compound phase and the back metal-side intermetallic compound layer, and between the Sn—Sb intermetallic compound phase and the substrate-side intermetallic compound layer.Type: ApplicationFiled: October 30, 2018Publication date: September 10, 2020Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Minoru UESHIMA, Yoshie TACHIBANA
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Patent number: 10658107Abstract: In a method of manufacturing a permanent magnet having a curved surface, a permeating material including metal particles and a flux is applied to the curved surface of a magnet. The magnet to which the permeating material is applied is then positioned within a furnace and the furnace is placed in a vacuum or filled with inert gas to volatilize a solvent and the like of the flux contained in the permeating material. The furnace is set to be a temperature within a range of 300 through 500 degrees C. to heat the permeating material. This enables the flux to be carbonized to form reticulated carbon. The furnace is then set to be a temperature within a range of 500 through 800 degrees C. to melt the metal particles in the permeating material, thereby permeating the melted metal particles into the magnet through the reticulated carbon uniformly.Type: GrantFiled: October 11, 2017Date of Patent: May 19, 2020Assignee: Senju Metal Industry Co., Ltd.Inventors: Daisuke Sakuma, Kazuaki Haga, Takaaki Takahashi, Minoru Ueshima, Takashi Akagawa, Yoshie Tachibana
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Publication number: 20200114475Abstract: A solder alloy having an alloy composition consisting of, in mass %, Ag: 1% to 4%, Cu: 0.5% to 0.8%, Bi: more than 4.8% and 5.5% or less. Sb: more than 1.5% and 5.5% or less, Ni: 0.01% or more and less than 0.1%, Co: more than 0.001% and 0.1% or less, the balance being Sn. The alloy composition satisfies the following three relationships: 0.020%?Ni+Co?0.105%; 9.1%?Sb+Bi?10.4%; and 4.05×10?3?(Ni+Co)/(Bi+Sb)?1.00×10?2, where Ni, Co, Bi, and Sb each represent a content (mass %) thereof in the solder alloy.Type: ApplicationFiled: March 30, 2018Publication date: April 16, 2020Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Naoko IZUMITA, Shunsaku YOSHIKAWA, Yoshie TACHIBANA