Abstract: In order to suppress the occurrence of damage on a press-fit joining wiring board, a peak value of stress generated on the board in the case of a press-fitting a press-fit terminal into a through-hole is reduced so that it can not exceed the design standard value of the board. In the press-fit terminal in which a body part, retaining part, introducing part and forward end part are integrally formed, a cross-sectional area of the introducing part is reduced to be smaller than that of the retaining part, so that an intensity of the elastic force of the introducing part is decreased to be lower than that of the elastic force of the retaining part. Alternatively, on the wiring board, elastic material is filled into resin for combining sheet-like base material of the board so as to relieve an intensity of stress generated on the board itself.

Abstract: A connector fixing structure includes a substrate, a connector, and a housing. The substrate defines a first hole portion and a second hole portion. The connector includes a terminal of a pressfit shape that is inserted into the first holed portion to connect with the substrate electrically, and a housing having a leg portion of a press fit shape that is inserted into the second hole portion when the terminal is inserted into the first hole portion.

Abstract: A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.

Abstract: The present invention concerns a substrate for circuit wiring in which an electronic component is mounted, by soldering, to a wiring pattern formed on an insulated layer deposited over a metallic substrate. A silica-based filler and a rubber-based filler are added in the insulated layer to reduce the linear thermal expansion of the layer and increase its elastic modulus. The mounting portion of an electronic component is molded with a resin material to which a silica-based filler has been added, and which thus has a coefficient of linear thermal expansion smaller than the coefficient of linear thermal expansion of the insulated layer. This serves to alleviate the stress caused by the linear thermal expansion of the metallic substrate, and thereby to prevent separation from occurring between the insulated layer and the metallic substrate, as well as between the insulated layer and the wiring pattern, when subjected to a high-temperature environment.

Abstract: A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.

Abstract: A connector fixing structure includes a substrate, a connector, and a housing. The substrate defines a first hole portion and a second hole portion. The connector includes a terminal of a pressfit shape that is inserted into the first holed portion to connect with the substrate electrically, and a housing having a leg portion of a press fit shape that is inserted into the second hole portion when the terminal is inserted into the first hole portion.

Abstract: The present invention concerns a substrate for circuit wiring in which an electronic component is mounted, by soldering, to a wiring pattern formed on an insulated layer deposited over a metallic substrate. A silica-based filler and a rubber-based filler are added in the insulated layer to reduce the linear thermal expansion of the layer and increase its elastic modulus. The mounting portion of an electronic component is molded with a resin material to which a silica-based filler has been added, and which thus has a coefficient of linear thermal expansion smaller than the coefficient of linear thermal expansion of the insulated layer. This serves to alleviate the stress caused by the linear thermal expansion of the metallic substrate, and thereby to prevent separation from occurring between the insulated layer and the metallic substrate, as well as between the insulated layer and the wiring pattern, when subjected to a high-temperature environment.

Abstract: In order to suppress the occurrence of damage on a press-fit joining wiring board, a peak value of stress generated on the board in the case of a press-fitting a press-fit terminal into a through-hole is reduced so that it can not exceed the design standard value of the board. In the press-fit terminal in which a body part, retaining part, introducing part and forward end part are integrally formed, a cross-sectional area of the introducing part is reduced to be smaller than that of the retaining part, so that an intensity of the elastic force of the introducing part is decreased to be lower than that of the elastic force of the retaining part. Alternatively, on the wiring board, elastic material is filled into resin for combining sheet-like base material of the board so as to relieve an intensity of stress generated on the board itself.