Patents by Inventor Yoshifumi Fukushima

Yoshifumi Fukushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8632716
    Abstract: There is provided a method for manufacturing a metallic decorative member without a weld line at low cost including: starting injections of molten molding material into a cavity formed by a set of dies from a plurality of gates provided at the cavity; and stopping respectively the injections of the molten molding material from the plurality of gates at different times so as to make dynamic pressure of the molten molding material injected from one gate smaller than dynamic pressure of the molten molding material injected from the other gate at a position on which heads of flows of the molten molding material injected from the one and the other gates contact each other.
    Type: Grant
    Filed: April 5, 2011
    Date of Patent: January 21, 2014
    Assignee: Yazaki Corporation
    Inventor: Yoshifumi Fukushima
  • Patent number: 8446792
    Abstract: A temperature sensing circuit activates a sensing signal when sensing that a temperature inside a semiconductor integrated circuit is lower than a predetermined temperature. A heat generation control circuit activates a heat generation control signal when the sensing signal is activated. When the heat generation control signal is activated, a current is generated inside a memory circuit to raise the temperature inside the semiconductor integrated circuit.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: May 21, 2013
    Assignee: Panasonic Corporation
    Inventors: Yoshifumi Fukushima, Shoji Sakamoto, Hiroyuki Sadakata, Kiyoto Ohta
  • Publication number: 20110255353
    Abstract: A temperature sensing circuit activates a sensing signal when sensing that a temperature inside a semiconductor integrated circuit is lower than a predetermined temperature. A heat generation control circuit activates a heat generation control signal when the sensing signal is activated. When the heat generation control signal is activated, a current is generated inside a memory circuit to raise the temperature inside the semiconductor integrated circuit.
    Type: Application
    Filed: June 24, 2011
    Publication date: October 20, 2011
    Applicant: Panasonic Corporation
    Inventors: Yoshifumi FUKUSHIMA, Shoji Sakamoto, Hiroyuki Sadakata, Kiyoto Ohta
  • Publication number: 20110248426
    Abstract: There is provided a method for manufacturing a metallic decorative member without a weld line at low cost including: starting injections of molten molding material into a cavity formed by a set of dies from a plurality of gates provided at the cavity; and stopping respectively the injections of the molten molding material from the plurality of gates at different times so as to make dynamic pressure of the molten molding material injected from one gate smaller than dynamic pressure of the molten molding material injected from the other gate at a position on which heads of flows of the molten molding material injected from the one and the other gates contact each other.
    Type: Application
    Filed: April 5, 2011
    Publication date: October 13, 2011
    Applicant: Yazaki Corporation
    Inventor: Yoshifumi Fukushima
  • Patent number: 5534579
    Abstract: A highly weather-resistant, single package, cross-linkable emulsion using an emulsion polymer (X) obtained by emulsion polymerization, in an aqueous medium, of polymerizable monomer ingredients (II) comprising (a) from 0.1 to 10% by weight of a polymerizable UV-ray stable monomer, (b) from 5 to 99.4% by weight of cycloalkyl group-containing polymerizable monomer, (c) from 0.5 to 40% by weight of a polymerizable monomer which contains the groups having reactivity with carboxyl groups and (d) from 0 to 94.4% by weight of other polymerizable monomer, in which the amount of the polymerizable monomers (a), (b), (c) and (d) in total is 100% by weight, by using a water soluble or water dispersible polymer (I) having a terminal alkyl group with an acid value of 200 or greater obtained by polymerizing a polymerizable monomer ingredient (A) containing an unsaturated carboxylic acid as an essential ingredient under the presence of an alkyl mercaptan of 6 to 18 carbon atoms.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: July 9, 1996
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Toshiki Nikaya, Yoshifumi Fukushima, Teruo Kikuta