Patents by Inventor Yoshifumi IIMURO

Yoshifumi IIMURO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-dissipating sheet
    Patent number: 11085712
    Abstract: To provide a heat-dissipating sheet having good close-contact properties with an adherend such as a heat-generating body and being easy to handle. A heat-dissipating sheet includes a heat-dissipating member including a graphite sheet, a first thermally conductive layer, and a second thermally conductive layer stacked in this order. The first thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix and has an outer shape larger than the graphite sheet when viewed in plan. The second thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix, is more flexible than the first thermally conductive layer, and has an outer shape identical to or smaller than the first thermally conductive layer when viewed in plan.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: August 10, 2021
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventors: Shigeru Koyano, Yoshifumi Iimuro, Yoshiya Sakaguchi
  • HEAT-DISSIPATING SHEET
    Publication number: 20190390926
    Abstract: To provide a heat-dissipating sheet having good close-contact properties with an adherend such as a heat-generating body and being easy to handle. A heat-dissipating sheet includes a heat-dissipating member including a graphite sheet, a first thermally conductive layer, and a second thermally conductive layer stacked in this order. The first thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix and has an outer shape larger than the graphite sheet when viewed in plan. The second thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix, is more flexible than the first thermally conductive layer, and has an outer shape identical to or smaller than the first thermally conductive layer when viewed in plan.
    Type: Application
    Filed: January 19, 2018
    Publication date: December 26, 2019
    Applicants: SEKISUI POLYMATECH CO., LTD., Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Shigeru KOYANO, Yoshifumi IIMURO, Yoshiya SAKAGUCHI
  • Aqueous dispersion resin composition, resin composition for a thermal recording layer, resin composition for a protection layer, and thermal recording material
    Patent number: 10226956
    Abstract: An aqueous dispersion resin composition contains a first polymer produced by polymerizing a first monomer component containing (meth)acrylamide and a second polymer produced by polymerizing a second monomer component containing a carboxy group-containing vinyl monomer, wherein at least a portion of the carboxy group in the second polymer is neutralized.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: March 12, 2019
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yoshifumi Iimuro, Toshihiro Yoshimura, Syouta Mizutani
  • AQUEOUS DISPERSION RESIN COMPOSITION, RESIN COMPOSITION FOR A THERMAL RECORDING LAYER, RESIN COMPOSITION FOR A PROTECTION LAYER, AND THERMAL RECORDING MATERIAL
    Publication number: 20170151821
    Abstract: An aqueous dispersion resin composition contains a first polymer produced by polymerizing a first monomer component containing (meth)acrylamide and a second polymer produced by polymerizing a second monomer component containing a carboxy group-containing vinyl monomer, wherein at least a portion of the carboxy group in the second polymer is neutralized.
    Type: Application
    Filed: May 18, 2015
    Publication date: June 1, 2017
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yoshifumi IIMURO, Toshihiro YOSHIMURA, Syouta MIZUTANI
  • Composition for protection layer and thermal recording material
    Patent number: 9597912
    Abstract: A composition for a protection layer of a thermal recording material includes emulsion (A) and non-crosslinkable urea compound (B), and emulsion (A) has a pH of 6 or more, and contains copolymer resin (a) produced by copolymerizing reactive monomer component (a?) containing at least a vinyl monomer component having a carboxyl group and a vinyl monomer component that is copolymerizable with the vinyl monomer component having a carboxyl group.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: March 21, 2017
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yoshifumi Iimuro, Toshihiro Yoshimura, Akinori Etoh
  • COMPOSITION FOR PROTECTION LAYER AND THERMAL RECORDING MATERIAL
    Publication number: 20160082762
    Abstract: A composition for a protection layer of a thermal recording material includes emulsion (A) and non-crosslinkable urea compound (B), and emulsion (A) has a pH of 6 or more, and contains copolymer resin (a) produced by copolymerizing reactive monomer component (a?) containing at least a vinyl monomer component having a carboxyl group and a vinyl monomer component that is copolymerizable with the vinyl monomer component having a carboxyl group.
    Type: Application
    Filed: March 27, 2014
    Publication date: March 24, 2016
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yoshifumi IIMURO, Toshihiro YOSHIMURA, Akinori ETOH