Abstract: An electronic device includes the electronic element, the interposer substrate, on one surface of which the electronic element is mounted, and the interconnection substrate, on one surface of which the interposer substrate is mounted. One portion of the connection parts is an electrical connection part that electrically interconnects the interposer substrate and the interconnection substrate. The remaining portion is a dummy connection part that produces no functional deficiency even when the dummy connection part does not electrically interconnect the interposer substrate with the interconnection substrate. The dummy connection part includes at least one of the connection parts that at least partially overlap with the electronic element in a plan projection and are preferably arranged along an outer rim of the plan projection of the electronic element.

Abstract: An electronic device includes the electronic element, the interposer substrate, on one surface of which the electronic element is mounted, and the interconnection substrate, on one surface of which the interposer substrate is mounted. One portion of the connection parts is an electrical connection part that electrically interconnects the interposer substrate and the interconnection substrate. The remaining portion is a dummy connection part that produces no functional deficiency even when the dummy connection part does not electrically interconnect the interposer substrate with the interconnection substrate. The dummy connection part includes at least one of the connection parts that at least partially overlap with the electronic element in a plan projection and are preferably arranged along an outer rim of the plan projection of the electronic element.

Abstract: A circuit board includes a plurality of through holes into which a plurality of leads of one electronic devices are inserted and soldered with lead free solder. Among these through holes, the volume of through hole into which the outermost end lead of leads of the electronic device is inserted, is set greater than the volume of through hole, into which the lead at the position nearest to the center of the electronic device is inserted.

Abstract: A circuit board includes a plurality of through holes (14, 44) into which a plurality of leads (18) of one electronic devices are inserted and soldered. Among these through holes (14, 44), the volume of through hole (14b, 24b, 34b, 44b, 54, 64b) into which the outermost end lead of leads (18) of the electronic device is inserted, is set greater than the volume of through hole (14a, 44a), into which the lead at the position nearest to the center of the electronic device is inserted.