Abstract: According to one embodiment, a semiconductor device includes a circuit pattern including a plurality of unit patterns that are disposed in a repeating manner in at least one direction. The semiconductor device includes a discrimination pattern provided in the circuit pattern and configured to discriminate the unit patterns from each other.

Abstract: An assembly line includes a printing device for printing solder on a land of a circuit board, a mounting device for mounting an electric component at a predetermined position of the solder, and a soldering device for soldering the land to a terminal of the component. A monitored items detecting device detects predetermined to be monitored items of the board and equipment used in the printing, mounting, or soldering devices, and a control device analyzes a condition of the equipment and quality of the board with reference to warning criterion which do not exceed failure criterion, and then dynamically controls the various devices accordingly.

Abstract: A parts supply device includes a mounting device for mounting a unit accommodating electronic parts on a parts mounting machine, a parts feeding device for sequentially feeding the parts held by the unit to a predetermined removing position according to an operation of the machine for removing the parts from the parts supply device, a storing device for storing data as to the number of parts held by the unit, and a calculating device for rewriting the parts number data stored in the storing device according to the operation of the machine for removing the parts from the supply device.