Patents by Inventor Yoshifumi Nishio

Yoshifumi Nishio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230392417
    Abstract: A vehicle disclosed in the present specification includes a vehicle body that has a front compartment, a radiator that is disposed in the front compartment, a radiator support upper crossmember that makes up part of the vehicle body and that also extends in a right-left direction along an upper edge of the radiator, a hood that is pivotably linked to the vehicle body and that is movable between an open position for opening the front compartment and a closed position for closing the front compartment, and a hood lock that is fixed to the radiator support upper crossmember and that also locks the hood in the closed position. The hood lock is positioned rearward of a center of the radiator support upper crossmember in a front-rear direction.
    Type: Application
    Filed: May 18, 2023
    Publication date: December 7, 2023
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yoshifumi Nishio, Kodai Taneda
  • Patent number: 10823042
    Abstract: An air blowing fan device includes an electric motor including a rotation shaft, and an air blowing fan including an attachment portion, a boss portion, and an outer circumferential side air blowing blades. The attachment portion is attached to the rotation shaft. The boss portion includes a tubular portion that is positioned radially outward of the attachment portion and of which the outer diameter dimension is larger than the outer diameter dimension of the electric motor, and a linkage portion. The electric motor is disposed in the tubular portion, the outer circumferential side air blowing blade extends radially outward from an outer circumferential surface of the tubular portion, the linkage portion includes a ventilation hole, and an area occupied by the electric motor and an area occupied by the outer circumferential side air blowing blade partially overlap each other in the direction in which the rotation shaft extends.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: November 3, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yoshifumi Nishio, Hiroaki Ota, Akifumi Fujimoto
  • Publication number: 20190186335
    Abstract: An air blowing fan device includes an electric motor including a rotation shaft, and an air blowing fan including an attachment portion, a boss portion, and an outer circumferential side air blowing blades. The attachment portion is attached to the rotation shaft. The boss portion includes a tubular portion that is positioned radially outward of the attachment portion and of which the outer diameter dimension is larger than the outer diameter dimension of the electric motor, and a linkage portion. The electric motor is disposed in the tubular portion, the outer circumferential side air blowing blade extends radially outward from an outer circumferential surface of the tubular portion, the linkage portion includes a ventilation hole, and an area occupied by the electric motor and an area occupied by the outer circumferential side air blowing blade partially overlap each other in the direction in which the rotation shaft extends.
    Type: Application
    Filed: November 15, 2018
    Publication date: June 20, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yoshifumi NISHIO, Hiroaki OTA, Akifumi FUJIMOTO
  • Publication number: 20140202387
    Abstract: A diffusion furnace includes a boat which supports a semiconductor wafer thereon and is rotatable together with the semiconductor wafer. A heater is arranged on the periphery of a core tube which houses the boat therein. The core tube includes a reaction gas supply pipe through which a reaction gas containing a dopant is supplied; and a cooling gas supply pipe through which a cooling gas is supplied toward an outer peripheral portion of the semiconductor wafer.
    Type: Application
    Filed: September 3, 2013
    Publication date: July 24, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshifumi NISHIO, Takashi NAKAO, Takaharu ITANI, Akihiro TAKAMI
  • Patent number: 8361877
    Abstract: A method of printing on a semiconductor wafer, a manufacturing method of a semiconductor device, and a semiconductor device which enable to easily perform positioning in the direction perpendicular to the top of the wafer and to easily identify the type of the wafer. The manufacturing method includes preparing a semiconductor wafer having a structure in which an element forming film is stacked on the top of an insulative transparent substrate, forming a light reflection film to reflect light for positioning on the bottom of the transparent substrate, irradiating a laser from the side at which the element forming film is disposed so as to form printed letters at the light reflection film, forming a semiconductor element at the element forming film, forming an interlayer dielectric film to cover the element forming film and the semiconductor element, forming a contact wire, and forming a metal wire on the interlayer dielectric film.
    Type: Grant
    Filed: December 6, 2010
    Date of Patent: January 29, 2013
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Yoshifumi Nishio
  • Publication number: 20120175001
    Abstract: A liquid chemical discharge valve which includes a diaphragm valve having a contact portion for varying that varies a flow condition between the liquid chemical supply port and the liquid chemical discharge port by manipulating a lift amount, which is a distance between the contact portion and one of the liquid chemical supply port and the liquid chemical discharge port, between a closed valve condition and a maximum lift amount. The liquid chemical discharge valve includes an actuator unit for driving the contact portion in accordance with a supply pressure of the operating gas supplied from the operating gas supply port, to thereby manipulate the lift amount. The actuator unit includes a lift amount limiting unit for limiting the maximum lift amount adjustably.
    Type: Application
    Filed: January 5, 2012
    Publication date: July 12, 2012
    Applicant: CKD CORPORATION
    Inventors: Yoshifumi NISHIO, Shoji AZUMA, Toshiki MURATA, Nobuya SUZUKI
  • Publication number: 20110163422
    Abstract: A method of printing on a semiconductor wafer, a manufacturing method of a semiconductor device, and a semiconductor device which enable to easily perform positioning in the direction perpendicular to the top of the wafer and to easily identify the type of the wafer. The manufacturing method includes preparing a semiconductor wafer having a structure in which an element forming film is stacked on the top of an insulative transparent substrate, forming a light reflection film to reflect light for positioning on the bottom of the transparent substrate, irradiating a laser from the side at which the element forming film is disposed so as to form printed letters at the light reflection film, forming a semiconductor element at the element forming film, forming an interlayer dielectric film to cover the element forming film and the semiconductor element, forming a contact wire, and forming a metal wire on the interlayer dielectric film.
    Type: Application
    Filed: December 6, 2010
    Publication date: July 7, 2011
    Applicant: OKI SEMICONDUCTOR CO., LTD.
    Inventor: Yoshifumi NISHIO