Patents by Inventor Yoshifumi Nishio
Yoshifumi Nishio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230392417Abstract: A vehicle disclosed in the present specification includes a vehicle body that has a front compartment, a radiator that is disposed in the front compartment, a radiator support upper crossmember that makes up part of the vehicle body and that also extends in a right-left direction along an upper edge of the radiator, a hood that is pivotably linked to the vehicle body and that is movable between an open position for opening the front compartment and a closed position for closing the front compartment, and a hood lock that is fixed to the radiator support upper crossmember and that also locks the hood in the closed position. The hood lock is positioned rearward of a center of the radiator support upper crossmember in a front-rear direction.Type: ApplicationFiled: May 18, 2023Publication date: December 7, 2023Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yoshifumi Nishio, Kodai Taneda
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Patent number: 10823042Abstract: An air blowing fan device includes an electric motor including a rotation shaft, and an air blowing fan including an attachment portion, a boss portion, and an outer circumferential side air blowing blades. The attachment portion is attached to the rotation shaft. The boss portion includes a tubular portion that is positioned radially outward of the attachment portion and of which the outer diameter dimension is larger than the outer diameter dimension of the electric motor, and a linkage portion. The electric motor is disposed in the tubular portion, the outer circumferential side air blowing blade extends radially outward from an outer circumferential surface of the tubular portion, the linkage portion includes a ventilation hole, and an area occupied by the electric motor and an area occupied by the outer circumferential side air blowing blade partially overlap each other in the direction in which the rotation shaft extends.Type: GrantFiled: November 15, 2018Date of Patent: November 3, 2020Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yoshifumi Nishio, Hiroaki Ota, Akifumi Fujimoto
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Publication number: 20190186335Abstract: An air blowing fan device includes an electric motor including a rotation shaft, and an air blowing fan including an attachment portion, a boss portion, and an outer circumferential side air blowing blades. The attachment portion is attached to the rotation shaft. The boss portion includes a tubular portion that is positioned radially outward of the attachment portion and of which the outer diameter dimension is larger than the outer diameter dimension of the electric motor, and a linkage portion. The electric motor is disposed in the tubular portion, the outer circumferential side air blowing blade extends radially outward from an outer circumferential surface of the tubular portion, the linkage portion includes a ventilation hole, and an area occupied by the electric motor and an area occupied by the outer circumferential side air blowing blade partially overlap each other in the direction in which the rotation shaft extends.Type: ApplicationFiled: November 15, 2018Publication date: June 20, 2019Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yoshifumi NISHIO, Hiroaki OTA, Akifumi FUJIMOTO
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Publication number: 20140202387Abstract: A diffusion furnace includes a boat which supports a semiconductor wafer thereon and is rotatable together with the semiconductor wafer. A heater is arranged on the periphery of a core tube which houses the boat therein. The core tube includes a reaction gas supply pipe through which a reaction gas containing a dopant is supplied; and a cooling gas supply pipe through which a cooling gas is supplied toward an outer peripheral portion of the semiconductor wafer.Type: ApplicationFiled: September 3, 2013Publication date: July 24, 2014Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Yoshifumi NISHIO, Takashi NAKAO, Takaharu ITANI, Akihiro TAKAMI
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Patent number: 8361877Abstract: A method of printing on a semiconductor wafer, a manufacturing method of a semiconductor device, and a semiconductor device which enable to easily perform positioning in the direction perpendicular to the top of the wafer and to easily identify the type of the wafer. The manufacturing method includes preparing a semiconductor wafer having a structure in which an element forming film is stacked on the top of an insulative transparent substrate, forming a light reflection film to reflect light for positioning on the bottom of the transparent substrate, irradiating a laser from the side at which the element forming film is disposed so as to form printed letters at the light reflection film, forming a semiconductor element at the element forming film, forming an interlayer dielectric film to cover the element forming film and the semiconductor element, forming a contact wire, and forming a metal wire on the interlayer dielectric film.Type: GrantFiled: December 6, 2010Date of Patent: January 29, 2013Assignee: Oki Semiconductor Co., Ltd.Inventor: Yoshifumi Nishio
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Publication number: 20120175001Abstract: A liquid chemical discharge valve which includes a diaphragm valve having a contact portion for varying that varies a flow condition between the liquid chemical supply port and the liquid chemical discharge port by manipulating a lift amount, which is a distance between the contact portion and one of the liquid chemical supply port and the liquid chemical discharge port, between a closed valve condition and a maximum lift amount. The liquid chemical discharge valve includes an actuator unit for driving the contact portion in accordance with a supply pressure of the operating gas supplied from the operating gas supply port, to thereby manipulate the lift amount. The actuator unit includes a lift amount limiting unit for limiting the maximum lift amount adjustably.Type: ApplicationFiled: January 5, 2012Publication date: July 12, 2012Applicant: CKD CORPORATIONInventors: Yoshifumi NISHIO, Shoji AZUMA, Toshiki MURATA, Nobuya SUZUKI
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Publication number: 20110163422Abstract: A method of printing on a semiconductor wafer, a manufacturing method of a semiconductor device, and a semiconductor device which enable to easily perform positioning in the direction perpendicular to the top of the wafer and to easily identify the type of the wafer. The manufacturing method includes preparing a semiconductor wafer having a structure in which an element forming film is stacked on the top of an insulative transparent substrate, forming a light reflection film to reflect light for positioning on the bottom of the transparent substrate, irradiating a laser from the side at which the element forming film is disposed so as to form printed letters at the light reflection film, forming a semiconductor element at the element forming film, forming an interlayer dielectric film to cover the element forming film and the semiconductor element, forming a contact wire, and forming a metal wire on the interlayer dielectric film.Type: ApplicationFiled: December 6, 2010Publication date: July 7, 2011Applicant: OKI SEMICONDUCTOR CO., LTD.Inventor: Yoshifumi NISHIO