Abstract: Disclosed is a ferroelectric ceramic composition that does not contain harmful lead and that have satisfactory sinterability, as well as a nonlinear optical element including the ferroelectric ceramic composition. The ferroelectric ceramic composition includes a main component represented by a general formula (Ba1-x-ySrxCay)Ag1-dNb5O15-d/2 and having a tungsten bronze structure; and auxiliary components represented by a general formula aMnO2+bSiO2 (wherein a and b each represent parts by weight with respect to 100 parts by weight of the main component), wherein x, y, a, b, and d meet expressions 0.1?x+y?0.8, a+b?5, and 0?d?0.6.

Abstract: Disclosed is a ferroelectric ceramic composition that does not contain harmful lead and that have satisfactory sinterability, as well as a nonlinear optical element including the ferroelectric ceramic composition. The ferroelectric ceramic composition includes a main component represented by a general formula (Ba1-x-ySrxCay)Ag1-dNb5O15-d/2 and having a tungsten bronze structure; and auxiliary components represented by a general formula aMnO2+bSiO2 (wherein a and b each represent parts by weight with respect to 100 parts by weight of the main component), wherein x, y, a, b, and d meet expressions 0.1?x+y?0.8, a+b?5, and 0?d?0.6.

Abstract: A method of manufacturing chip type electronic parts, comprises the steps of: applying a photo-active catalyst liquid to chip substrates to form a photo-sensitive film consisting of the photo-active catalyst liquid on the chip substrates; arranging the chip substrates with respect to a light source in a manner such that portions of the chip substrates on which electrodes are to be formed will become light irradiation portions; irradiating the chip substrates with a light so as to activate irradiated portions of the photo-sensitive film; dipping the chip substrates in an electroless plating bath and precipitating a plating metal on said activated portions.

Abstract: A method of manufacturing chip type electronic parts, comprises the steps of: applying a photo-active catalyst liquid to chip substrates to form a photo-sensitive film consisting of the photo-active catalyst liquid on the chip substrates; arranging the chip substrates with respect to a light source in a manner such that portions of the chip substrates on which electrodes are to be formed will become light irradiation portions; irradiating the chip substrates with a light so as to activate irradiated portions of the photo-sensitive film; dipping the chip substrates in an electroless plating bath and precipitating a plating metal on said activated portions.

Abstract: A method of manufacturing chip type electronic parts, comprises the steps of: applying a photo-active catalyst liquid to chip substrates to form a photo-sensitive film consisting of the photo-active catalyst liquid on the chip substrates; arranging the chip substrates with respect to a light source in a manner such that portions of the chip substrates on which electrodes are to be formed will become light irradiation portions; irradiating the chip substrates with a light so as to activate irradiated portions of the photo-sensitive film; dipping the chip substrates in an electroless plating bath and precipitating a plating metal on said activated portions.

Abstract: A hydrophilic activating catalytic solution for electroless plating is a mixture of lactate, palladium and alkaline medium. The solution enables depositing palladium catalyst in a short time radiation exposure and removing unwanted photo-sensitive film more effectively by water or the like. The lactate preferably comprises copper lactate and/or zinc lactate and the palladium salt is preferably palladium chloride.

Abstract: Disclosed herein is a method of preparing an InSb thin film, which comprises a step of physically sticking InSb powder onto a major surface of a substrate, and a step of depositing an InSb thin film on the major surface of the substrate provided with the as-stuck InSb powder by a method such as vacuum evaporation.

Abstract: A magnetoresistance element includes an insulating substrate, a patterned magnetoresistance film of a ferromagnetic material deposited thereon and having a uniaxis magnetic anisotropy, and a patterned hard biasing layer of a ferromagnetic material deposited on the substrate. The biasing layer is divided into two parts on both sides of the magnetoresistance layer and magnetized in the direction parallel to a line which intersects the easy direction of magnetization of the patterned magnetoresistance layer at an acute angle (.theta.).

Abstract: A thin-film resistor comprising a thin film of a nitride of at least one element belonging to groups III-VI of the periodic table. The thin-film resistor has a metal oxide layer comprising at least one metal oxide selected from the group consisting of manganese oxide, iron oxide, cobalt oxide, nickel oxide, zinc oxide, indium oxide, tin oxide and indium tin oxide interposed between the nitride thin film and an electrode for external connection.

Abstract: A monolithic ceramic capacitor comprises a dielectric ceramic element assembly, metal electrodes for external connection and conductive metal oxide layers formed between the ceramic element assembly and the metal electrodes for preventing reduction of metal oxide forming the dielectric ceramic material.