Abstract: Provided is a compound having a formyl peptide receptor like 1 (FPRL1) agonist effect. The present invention relates to a compound represented by the general formula (I) or a pharmacologically acceptable salt thereof. The present invention also relates to a pharmaceutical composition containing the compound represented by the general formula (I) or a pharmacologically acceptable salt thereof.

Abstract: A method of manufacturing an electronic component includes bonding a dome-shaped cap having a recess to a substrate on which are disposed a vibrator and a bonding material projecting in a rounded shape and surrounding the vibrator while the cap is disposed so that an open side of the recess faces the substrate and is relatively pressed to the substrate side. The bonding material is disposed so that, relative to the vibrator, an outer side end portion of the cap is located on the inner side of the bonding material or an inner side end portion of the cap is located on the outer side of the bonding material.

Abstract: A method capable of manufacturing a quartz vibrator by disposing a metallic bonding material on one main surface of a ceramic plate having a quartz vibrating element mounted thereon. Thereafter, the bonding of a cap having a recess to the ceramic plate by disposing the cap on the one main surface of the ceramic plate so that an open side of the recess faces the ceramic plate, melting the bonding material, and then allowing the bonding material to set, is carried out.

Abstract: A crystal resonation device that includes a base plate, a cap, a joining material, and a crystal resonator. The cap is provided on the base plate. The cap forms a sealed space with the base plate. The joining material joins the base plate and the cap. The joining material contains a cured material of thermosetting resin. The crystal resonator is provided on the base plate in the sealed space. The joining material is located in an outer side portion of a wall of the cap joined to the joining material.

Abstract: In the manufacture of a multilayer ceramic substrate including a ceramic laminate by a so-called non-shrink process in which the ceramic laminate disposed between shrinkage control layers is fired, first and second surface conductive films formed on first and second main surfaces of the ceramic laminate may cause warping of the multilayer ceramic substrate after the shrinkage control layers are removed. After the firing step, in removing the shrinkage control layers from a composite laminate, the thickness of at least one of first and second reaction layers formed at interfaces between ceramic green layers and the shrinkage control layers in the firing step is reduced such that the thickness of the first reaction layer is different from the thickness of the second reaction layer, thereby controlling the compressive stress generated by the reaction layers to reduce the warping of the multilayer ceramic substrate.

Abstract: A multilayer electronic component including a resin layer disposed on a mounting board side is mounted on a mounting board, and has a structure such that, even when deformation, such as deflection and strain, occurs, a stress on the multilayer electronic component is relieved. In the multilayer electronic component, ends of columnar conductors protrude from a main surface of a resin layer facing the outside. The multilayer electronic component is mounted on a mounting board, and the ends of the columnar conductors are electrically connected to conductive lands. In this case, a predetermined gap is formed between the multilayer electronic component and the mounting board.

Abstract: In the manufacture of a multilayer ceramic substrate including a ceramic laminate by a so-called non-shrink process in which the ceramic laminate disposed between shrinkage control layers is fired, first and second surface conductive films formed on first and second main surfaces of the ceramic laminate may cause warping of the multilayer ceramic substrate after the shrinkage control layers are removed. After the firing step, in removing the shrinkage control layers from a composite laminate, the thickness of at least one of first and second reaction layers formed at interfaces between ceramic green layers and the shrinkage control layers in the firing step is reduced such that the thickness of the first reaction layer is different from the thickness of the second reaction layer, thereby controlling the compressive stress generated by the reaction layers to reduce the warping of the multilayer ceramic substrate.

Abstract: A ceramic multilayer substrate having excellent migration resistance and high bonding strength between a resin sealing material and a ceramic multilayer substrate body, includes a laminated substrate body having lands, and external electrodes, and covered with a siloxane film formed by a PVD process. The thickness of the siloxane film is lower than about 100 nm. After that, external electrodes of a mounting component are electrically connected and firmly hold to the lands of the laminated substrate body via solder. Next, a resin sealing material for sealing the mounting component is formed on the laminated substrate body.

Abstract: A ceramic substrate includes a glass layer partially overlaying a conductor, and the glass layer has satisfactory adhesion to the main body of the ceramic substrate and having satisfactory plating resistance. The glass layer is arranged to extend from a portion of the conductor formed on a first main surface of the main body of the ceramic substrate to the first main surface of the main body of the ceramic substrate and which has a double-layered structure including a first glass sublayer composed of a first glass material, and a second glass sublayer formed on the first glass sublayer and composed of a second glass material that is different from the second glass material defining the first glass sublayer, the first glass material having more satisfactory adhesion to the main body of the ceramic substrate than the second glass material, and the first glass material having more satisfactory plating resistance than the first glass material.

Abstract: A multilayer electronic component having a ceramic substrate and a resin layer mounted on a mounting substrate. Recess portions are formed at an outside-facing major surface side of the resin layer. In the resin layer, columnar conductors are disposed so that axis line directions thereof are aligned in a thickness direction of the resin layer. End portions of the columnar conductors are located inside the recess portions further from opening faces thereof and have end surfaces exposed in the recess portions. When a multilayer electronic component is mounted on a mounting substrate, solder is provided on the end surfaces of the columnar conductors in the recess portions. The thickness of solder used in the above mounting does not interfere with a reduction in size and height of an electronic device that includes the above multilayer electronic component.

Abstract: A digital indicator 1 includes a body case (10), a spindle (30) provided to the body case (10), the spindle (30) being movable in an axial direction, a displacement detector (40) that detects a moving amount of the spindle (30), and a digital display (50) that digitally displays the moving amount detected by the displacement detector (40). The display surface of the digital display (50) is arranged on the body case (10) in an attitude substantially orthogonal to the moving direction of the spindle (30) and deviated from the moving axis of the spindle (30).

Abstract: A multilayer electronic component including a resin layer disposed on a mounting board side is mounted on a mounting board, and has a structure such that, even when deformation, such as deflection and strain, occurs, a stress on the multilayer electronic component is relieved. In the multilayer electronic component, ends of columnar conductors protrude from a main surface of a resin layer facing the outside. The multilayer electronic component is mounted on a mounting board, and the ends of the columnar conductors are electrically connected to conductive lands. In this case, a predetermined gap is formed between the multilayer electronic component and the mounting board.

Abstract: A multilayer electronic component having a ceramic substrate and a resin layer mounted on a mounting substrate. Recess portions are formed at an outside-facing major surface side of the resin layer. In the resin layer, columnar conductors are disposed so that axis line directions thereof are aligned in a thickness direction of the resin layer. End portions of the columnar conductors are located inside the recess portions further from opening faces thereof and have end surfaces exposed in the recess portions. When a multilayer electronic component is mounted on a mounting substrate, solder is provided on the end surfaces of the columnar conductors in the recess portions. The thickness of solder used in the above mounting does not interfere with a reduction in size and height of an electronic device that includes the above multilayer electronic component.

Abstract: A ceramic multilayer substrate having excellent migration resistance and high bonding strength between a resin sealing material and a ceramic multilayer substrate body, includes a laminated substrate body having lands, and external electrodes, and covered with a siloxane film formed by a PVD process. The thickness of the siloxane film is lower than about 100 nm. After that, external electrodes of a mounting component are electrically connected and firmly hold to the lands of the laminated substrate body via solder. Next, a resin sealing material for sealing the mounting component is formed on the laminated substrate body.

Abstract: A ceramic substrate includes a glass layer partially overlaying a conductor, and the glass layer has satisfactory adhesion to the main body of the ceramic substrate and having satisfactory plating resistance. The glass layer is arranged to extend from a portion of the conductor formed on a first main surface of the main body of the ceramic substrate to the first main surface of the main body of the ceramic substrate and which has a double-layered structure including a first glass sublayer composed of a first glass material, and a second glass sublayer formed on the first glass sublayer and composed of a second glass material that is different from the second glass material defining the first glass sublayer, the first glass material having more satisfactory adhesion to the main body of the ceramic substrate than the second glass material, and the first glass material having more satisfactory plating resistance than the first glass material.

Abstract: A digital indicator 1 includes a body case (10), a spindle (30) provided to the body case (10), the spindle (30) being movable in an axial direction, a displacement detector (40) that detects a moving amount of the spindle (30), and a digital display (50) that digitally displays the moving amount detected by the displacement detector (40). The display surface of the digital display (50) is arranged on the body case (10) in an attitude substantially orthogonal to the moving direction of the spindle (30) and deviated from the moving axis of the spindle (30).

Abstract: A composite laminate, including shrink-prevention ceramic green sheets arranged on the main surfaces of an unfired ceramic laminate and having a sintering temperature greater than the firing temperature of the unfired ceramic laminate, is fired at a temperature which is greater than the sintering temperature of the unfired ceramic laminate, and which is less than the sintering temperature of the shrink-prevention ceramic green sheet. Thereafter, the shrink-prevention ceramic green sheets are removed in a first removing step of spraying water and compressed gas against the shrink-prevention ceramic green sheets so as to remove a portion thereof that has not reacted with a glass component of the unfired ceramic laminate, and in a second removing step of ceramic powder, spraying water, and compressed air, such that a residual material not removed in the first removing step is removed, and in a third removing step of supersonic-cleaning the ceramic multi-layer substrate after the first and second steps.

Abstract: A composite laminate, including shrink-prevention ceramic green sheets on the main surfaces of an unfired ceramic laminate and having a sintering temperature greater than the firing temperature of the unfired ceramic laminate, is fired at a temperature which is greater than the sintering temperature of the unfired ceramic laminate and which is less than the sintering temperature of the shrink-prevention ceramic green sheet. Thereafter, the shrink-prevention ceramic green sheets removed in a first removing step of spraying water and compressed gas against the shrink-prevention ceramic green sheets so as to remove a portion thereof that has not reacted with a glass component of the unfired ceramic laminate, and in a second removing step of ceramic powder, spraying water, and compressed air, such that a residual material not removed in the first removing step is removed, and in a third removing step of supersonic-cleaning the ceramic multi-layer substrate after the first and second steps.

Abstract: To produce a green composite laminate 11, a green multilayer collective substrate 13 containing low-temperature sinterable glass ceramic powder as a main ingredient is disposed between first and second shrinkage-restraining layers 14a and 14b containing alumina powder as a main ingredient. Grooves 16 are formed on one main surface 11a of the green composite laminate 11 such as to pass through the first shrinkage-restraining layer 14a and the green multilayer collective substrate 13 and reach the second shrinkage-restraining layer 14b, but not to reach the other main surface 11b of the green composite laminate 11. The green composite laminate 11 provided with the grooves 16 is sintered under conditions where the low-temperature sinterable glass ceramic powder is sintered and the green first and second shrinkage-restraining layers 14a and 14b are removed to prepare a plurality of ceramic multilayer substrates.