Abstract: A pin terminal includes a bar-like base material and a plating layer covering a predetermined region of the base material. A constituent material of the base material is pure copper or a copper alloy. The plating layer includes a tin-based layer made of metal containing tin. One end side of the base material includes a tip covering portion covering an entire region in a circumferential direction of the base material. The tin-based layer includes the tip covering portion. The tip covering portion includes a thin film portion and a thick film portion at positions different in the circumferential direction of the base material. The thin film portion is provided in contact with the base material. The number of whiskers present on a surface of the thin film portion is 15 or less in a square visual field having one side length of 0.35 mm.

Abstract: A PCB terminal is provided with a rod-like base material and a plating layer covering a predetermined region of the base material. A constituent material of the base material is a copper alloy containing 20% by mass or more of zinc. The plating layer includes a first coating portion and a second coating portion. The first coating portion includes an entire peripheral layer entirely covering a region on side of a first end part, out of both end parts of the base material, in a circumferential direction of the base material. The second coating portion partially covers a region on side of a second end part, out of the both end parts of the base material, in the circumferential direction of the base material. The entire peripheral layer includes a tin-based layer and a barrier layer.

Abstract: A pin terminal includes a bar-like base material and a plating layer covering a predetermined region of the base material. A constituent material of the base material is pure copper or a copper alloy. The plating layer includes a tin-based layer made of metal containing tin. One end side of the base material includes a tip covering portion covering an entire region in a circumferential direction of the base material. The tin-based layer includes the tip covering portion. The tip covering portion includes a thin film portion and a thick film portion at positions different in the circumferential direction of the base material. The thin film portion is provided in contact with the base material. The number of whiskers present on a surface of the thin film portion is 15 or less in a square visual field having one side length of 0.35 mm.

Abstract: A pin terminal includes a bar-like base material and a plating layer covering a predetermined region of the base material. A constituent material of the base material is pure copper or a copper alloy. The plating layer includes a tin-based layer made of metal containing tin. One end side of the base material includes a tip covering portion. The tin-based layer includes the tip covering portion. The tip covering portion covers an entire region in a circumferential direction on the one end side of the base material. A difference (t1?t2) between a maximum value t1 and a minimum value t2 of a thickness of the tip covering portion measured at a measurement location set at a spot of 1 mm from one end of the pin terminal along a longitudinal direction of the pin terminal is 0.20 ?m or more.

Abstract: A pin terminal includes a bar-like base material and a plating layer covering a predetermined region of the base material. A constituent material of the base material is pure copper or a copper alloy. The plating layer includes a tin-based layer made of metal containing tin. One end side of the base material includes a tip covering portion covering an entire region in a circumferential direction of the base material. The tin-based layer includes the tip covering portion. The tip covering portion includes a thin film portion and a thick film portion at positions different in the circumferential direction of the base material. The thin film portion includes an outer layer and an inner layer provided in contact with the base material. A constituent material of the outer layer is pure tin, and that of the inner layer is an alloy containing tin and copper.

Abstract: Provided are a metal material and a connection terminal, the metal material being capable of suppressing an increase in the friction coefficient on the surface of a Sn-containing metal layer even without using Ag. This metal material 1 has a base material 15 and a surface layer 10 with which the surface of base material 15 is covered, wherein the surface layer 10 contains Sn and In, and at least In is present on the outermost surface thereof. In addition, this connection terminal is composed of said metal material 1, and the surface layer 10 is formed on the surface of the base material 15, in at least a contact section making electrical contact with the counterpart conductive member.

Abstract: Provided is a metal material and a connection terminal that have a surface layer including Au, and that can maintain a state of low contact resistance even when heated. A metal material 1 includes a base material 10 and a surface layer 11 formed on the base material 10. The surface layer 11 contains Au and In, and at least In is present at an outermost surface. Also, a connection terminal is constituted by the metal material 1, and the surface layer 11 is formed on a surface of the base material 10 at least at a contact portion that comes into electrical contact with a partner conductive member.

Abstract: A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.

Abstract: A metallic material that includes a foundation material; and a surface layer formed on a surface of the foundation material and exposed on an outermost surface, wherein the surface layer contains a precious metal element made of at least one kind selected from the group consisting of Ag, Au, and a platinum group element, and In, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the foundation material, at least in a contact portion electrically contacting an opposite electrically conductive member.

Abstract: A metallic material that includes a foundation material; and a surface layer formed on a surface of the foundation material and exposed on an outermost surface, wherein the surface layer contains a precious metal element made of at least one kind selected from the group consisting of Ag, Au, and a platinum group element, and In, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the foundation material, at least in a contact portion electrically contacting an opposite electrically conductive member.

Abstract: A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.

Abstract: A terminal fitting that can reduce the terminal insertion force and can suppress surface oxidation of a plating film, even if the terminal fitting is exposed to a hot and humid environment, and a connector that uses the terminal fitting. The terminal fitting includes a metal base material, and the plating film. The plating film includes a Ni foundation layer, an outermost layer exposed at the outermost surface, and a Ni3Sn4 layer formed between the Ni foundation layer and the outermost layer. The outermost layer includes a Sn parent phase, and intermetallic compound that is dispersed in the Sn parent phase, and is made of (Ni0.4Pd0.6)Sn4. The intermetallic compound protrudes from the lower side of the outermost layer to the Ni3Sn4 layer side, and is partially buried in the Ni3Sn4 layer. A connector includes the terminal fitting, and a housing that holds the terminal fitting.

Abstract: A terminal pair including a first terminal provided with a first contact portion and a second terminal provided with a second contact portion. The first contact portion includes a composite covering layer having a Sn—Pd based alloy phase and a Sn phase, and has a surface including the Sn—Pd based alloy phase and the Sn phase. The second contact portion includes a Cu—Sn alloy layer and a Sn layer covering part of the Cu—Sn alloy layer, and has a surface including a Cu—Sn alloy region corresponding to an exposed portion of the Cu—Sn alloy layer and a Sn region corresponding to an exposed portion of the Sn layer. A coefficient of friction for sliding movement between the first contact portion and the second contact portion is lower than a coefficient of friction for sliding movement between the two first contact portions and between the two second contact portions.

Abstract: A board terminal 1 includes a base material 11 made of a metal material and a plating film 12 covering a surface of the base material 11. The plating film 12 includes an outermost layer 120 having a Sn mother phase 120a and Sn—Pd-based alloy phases 120b dispersed in the Sn mother phase 120a, the Sn mother phase 120a and the Sn—Pd-based alloy phases 120b being present on an outer surface. A Pd content in the outermost layer 120 is not more than 7 atomic %. A board connector 2 includes the board terminal 1 and a housing 20 for holding the board terminal 1.

Abstract: A terminal fitting that can reduce the terminal insertion force and can suppress surface oxidation of a plating film, even if the terminal fitting is exposed to a hot and humid environment, and a connector that uses the terminal fitting. The terminal fitting includes a metal base material, and the plating film. The plating film includes a Ni foundation layer, an outermost layer exposed at the outermost surface, and a Ni3Sn4 layer formed between the Ni foundation layer and the outermost layer. The outermost layer includes a Sn parent phase, and intermetallic compound that is dispersed in the Sn parent phase, and is made of (Ni0.4Pd0.6)Sn4. The intermetallic compound protrudes from the lower side of the outermost layer to the Ni3Sn4 layer side, and is partially buried in the Ni3Sn4 layer. A connector includes the terminal fitting, and a housing that holds the terminal fitting.

Abstract: An electric contact pair includes a first electric contact, and a second electric contact to be brought into electrical contact with the first electric contact. The first electric contact includes a first plating film made of Ag or a Ag alloy on its outermost surface, and the second electric contact includes a second plating film made of Rh or a Rh alloy on its outermost surface. The first plating film maybe layered on a first conductive base material, the second plating film maybe layered on a second conductive base material, and the first conductive base material and the second conductive base material are made of copper or a copper alloy, or aluminum or an aluminum alloy. A connector terminal pair includes a first terminal including the first electric contact, and a second terminal including the second electric contact.

Abstract: A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present. Further, the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 ?m2.

Abstract: An electric contact pair includes a first electric contact, and a second electric contact to be brought into electrical contact with the first electric contact. The first electric contact includes a first plating film made of Ag or a Ag alloy on its outermost surface, and the second electric contact includes a second plating film made of Rh or a Rh alloy on its outermost surface. The first plating film maybe layered on a first conductive base material, the second plating film maybe layered on a second conductive base material, and the first conductive base material and the second conductive base material are made of copper or a copper alloy, or aluminum or an aluminum alloy. A connector terminal pair includes a first terminal including the first electric contact, and a second terminal including the second electric contact.

Abstract: A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present. Further, the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 ?m2.

Abstract: It is aimed to provide a plated member and a plated terminal for connector, to which a large current can be applied and which have both a low friction coefficient and high heat resistance, at low cost and provide a method for producing such a plated member and a method for producing such a plated terminal for connector. A silver-tin alloy layer for coating a surface of a base material made of copper or copper alloy and a silver coating layer for coating the silver-tin alloy layer and to be exposed on an outermost surface are simultaneously formed by heating to obtain a plated member after tin and silver plating layers are alternately laminated on the surface of the base material with the outermost surface formed by the silver plating layer.