Patents by Inventor Yoshifumi Takada

Yoshifumi Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7989708
    Abstract: In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two through holes are connected therebetween in both end portions of the respective through holes or one end portion thereof by the wiring board.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: August 2, 2011
    Assignee: Hitachi, Ltd.
    Inventor: Yoshifumi Takada
  • Publication number: 20080047744
    Abstract: In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two through holes are connected therebetween in both end portions of the respective through holes or one end portion thereof by the wiring board.
    Type: Application
    Filed: October 12, 2007
    Publication date: February 28, 2008
    Applicant: Hitachi, Ltd.
    Inventor: Yoshifumi Takada
  • Patent number: 7326856
    Abstract: In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two through holes are connected therebetween in both end portions of the respective through holes or one end portion thereof by the wiring board.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: February 5, 2008
    Assignee: Hitachi, Ltd.
    Inventor: Yoshifumi Takada
  • Publication number: 20050161255
    Abstract: In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two through holes are connected therebetween in both end portions of the respective through holes or one end portion thereof by the wiring board.
    Type: Application
    Filed: December 17, 2004
    Publication date: July 28, 2005
    Applicant: Hitachi, Ltd.
    Inventor: Yoshifumi Takada
  • Patent number: 5661416
    Abstract: An interface circuit includes at least one signal processing circuit connected to a transmission line which is equipped with a terminal circuit having a resistor with a terminal voltage applied to at least one terminal, and includes an input circuit for inputting from the transmission line a signal to be processed in the signal processing circuit, or an output circuit for outputting a processed signal to the transmission line or an input and output circuit for inputting and outputting a signal. The input circuit or the output circuit or the input and output circuit are incorporated in the signal processing circuit. The input circuit or the output circuit or the input and output circuit are directly connected to the transmission line, wherein the output circuit has a push-pull circuit which is directly connected to the transmission line to receive an output signal from the signal processing circuit and to have a constant output impedance which is independent of an output from the output signal.
    Type: Grant
    Filed: April 26, 1995
    Date of Patent: August 26, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Yoshifumi Takada, Masakazu Yamamoto
  • Patent number: 5457406
    Abstract: In such a bidirectional signal transmission circuit in which the transmitter circuit of the logic circuit elements used in the conventional single end transmission circuit can be utilized by setting an impedance of an end circuit to be a value greater than a characteristic impedance of a transmission path, by shortening a length of the transmission path for connecting the end circuit with the logic circuit elements, and by increasing an amplitude of an input signal with utilization of a reflection wave produced by an impedance mismatching, such a signal transmission circuit where various types of transmission circuits such as a bidirectional signal transmission circuit and a single end transmission circuit are employed in a mixture form, can be made compact, and low power consumption can be achieved.
    Type: Grant
    Filed: March 16, 1993
    Date of Patent: October 10, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Yoshifumi Takada, Masaaki Kamemura, Masakazu Yamamoto