Patents by Inventor Yoshifumi UCHITA
Yoshifumi UCHITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11483928Abstract: A flexible printed circuit board includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on an opposite surface of the base film and situated at least at a position opposite the terminal connecting area, wherein the reinforcement member has one or more lines of hollow holes aligning with a width direction thereof.Type: GrantFiled: August 3, 2018Date of Patent: October 25, 2022Assignees: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Yoshiro Adachi, Yoshifumi Uchita, Yoshio Oka
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Patent number: 11473979Abstract: A sensor unit disclosed herein is a temperature sensor unit to be attached to an energy storage device. The temperature sensor unit includes an FPC to be positioned on an energy storage device body, a temperature sensor connected to a detection line of the FPC, a housing disposed on the FPC and covering the temperature sensor, and a biasing member elastically and deformably held in the housing and configured to bias the lower housing of the housing toward the energy storage device body by elastic restoring force to bring the temperature sensor into contact with the energy storage device body with the FPC therebetween.Type: GrantFiled: October 2, 2018Date of Patent: October 18, 2022Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Shinichi Takase, Yasuhiko Kotera, Isamu Hamamoto, Yoshifumi Uchita, Takayuki Tsumagari, Yusuke Suzuki, Atsushi Yamanaka
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Publication number: 20220295631Abstract: A flexible printed wiring board according to an aspect includes a base film, a conductive pattern disposed on one surface of the base film, and an extra length absorbing portion protruding from the base film and disposed in a direction of a plane, the extra length absorbing portion including a pattern connected portion connected to the conductive pattern, a coupling portion having a first linear wiring portion, a first arcuate wiring portion, and a second linear wiring portion coupled in this order continuously from the pattern connected portion, and a connecting terminal connected to the coupling portion, the pattern connected portion and the connecting terminal being opposite to each other in a direction in which the extra length absorbing portion protrudes.Type: ApplicationFiled: July 9, 2020Publication date: September 15, 2022Applicants: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., AUTONETWORKS TECHNOLOGIES, LTD.Inventors: Shuji HAHAKURA, Shinichi TAKASE, Yoshifumi UCHITA, Hideo TAKAHASHI
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Publication number: 20220272836Abstract: A flexible printed wiring board according to an aspect includes an insulating base film, a conductive pattern disposed on one surface of the base film and including one or more land portions, and a solder resist layer disposed on one surface of the base film in a partial or any region excluding the one or more land portions, the solder resist layer having a CTI value of 200 V or more.Type: ApplicationFiled: July 9, 2020Publication date: August 25, 2022Applicants: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., AUTONETWORKS TECHNOLOGIES, LTD.Inventors: Yoshifumi UCHITA, Shinichi TAKASE
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Publication number: 20220272839Abstract: A flexible printed wiring board according to an aspect includes an insulating base film and a conductive pattern stacked on one surface side of the base film. The flexible printed wiring board further includes one or more square-shaped connecting terminals stacked over the conductive pattern with solder in between on one edge side of the conductive pattern. The connecting terminal is made of metal and includes a bent portion with both ends bent opposite to the base film. The connecting terminal includes a plated layer on an outer surface side of the bent portion.Type: ApplicationFiled: July 9, 2020Publication date: August 25, 2022Applicants: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., AUTONETWORKS TECHNOLOGIES, LTD.Inventors: Yoshifumi UCHITA, Shinichi TAKASE, Hideo TAKAHASHI
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Patent number: 11422039Abstract: A sensor unit disclosed herein is a sensor unit that is to be mounted in a housing section included in a device, and the sensor unit includes a FPC including a detection line and having flexibility, a temperature sensor connected to a connection portion of the detection line on a surface of the FPC, and an elastic member disposed on the surface of the FPC so as to be elastically deformable. The elastic member is to be elastically compressed within the housing section to press a first plate member mounted on a back surface of the FPC toward the device by a resilient force.Type: GrantFiled: October 5, 2018Date of Patent: August 23, 2022Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Shinichi Takase, Yoshifumi Uchita, Takayuki Tsumagari
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Patent number: 11375615Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.Type: GrantFiled: August 6, 2016Date of Patent: June 28, 2022Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc., Sumitomo Electric Fine Polymer, Inc.Inventors: Yuichiro Yamanaka, Yoshio Oka, Satoshi Kiya, Yoshifumi Uchita, Makoto Nakabayashi
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Patent number: 11245237Abstract: According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.Type: GrantFiled: July 26, 2018Date of Patent: February 8, 2022Assignees: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES. LTD.Inventors: Yoshiro Adachi, Yoshifumi Uchita, Manabu Sudou, Yoshio Oka
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Publication number: 20220021083Abstract: A connection module includes a FPC and bus bars connected to the FPC and connecting the electrode terminals of power storage elements that are adjacent to each other. The FPC includes a first wiring portion, a second bus bar mount portion, and a third bus bar mount portion to which the bus bars are connected. The FPC further includes a second expandable/contractable portion and a third expandable/contractable portion. The second expandable/contractable portion is continuous from the second bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the first wiring portion and the third bus bar mount portion. The third expandable/contractable portion is continuous from the third bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the second bus bar mount portion.Type: ApplicationFiled: November 1, 2019Publication date: January 20, 2022Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Kouichi NAGAMINE, Masayuki UEDA, Yoshifumi UCHITA, Takayuki TSUMAGARI
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Publication number: 20220013867Abstract: A connection module is a module mounted on a power storage element group including power storage elements having electrode terminals and connecting the power storage elements. The connection module includes a FPC including wiring portions and bus bars connected to the wiring portions and connecting the electrode terminals of the power storage elements that are adjacent to each other. The FPC includes a first multi-layered portion including the wiring portions that are overlapped with each other by folding the FPC and includes a second multi-layered portion including the wiring portions that are overlapped with each other by folding the FPC.Type: ApplicationFiled: November 1, 2019Publication date: January 13, 2022Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Kouichi NAGAMINE, Masayuki UEDA, Yoshifumi UCHITA, Takayuki TSUMAGARI
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Publication number: 20220013868Abstract: A connection module includes a FPC, bus bars connected to the FPC and connecting the electrode terminals of power storage elements that are adjacent to each other, and a resin protector holding the bus bars and the FPC. The FPC includes a FPC body member and a first deformable portion that connects the FPC body member and the bus bars. The resin protector includes a FPC holding portion to which the FPC body member is fixed, movable bus bar holding portions to which the bus bars are fixed, respectively, and second deformable portions that connect the FPC holding portion and the movable bus bar holding portions. The first deformable portion and the second deformable portion connect the bus bars and the movable bus bar holding portions to the FPC body member and the FPC holding portion, respectively, such that the bus bars and the movable bus bar holding portions are movable with respect to the FPC body member and the FPC holding portion.Type: ApplicationFiled: November 1, 2019Publication date: January 13, 2022Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Kouichi NAGAMINE, Masayuki UEDA, Yoshifumi UCHITA, Takayuki TSUMAGARI
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Patent number: 11051399Abstract: A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated opposite at least the terminal connecting area, wherein a thickness of the reinforcement member increases toward the one end edge in a stepwise or gradual manner.Type: GrantFiled: June 25, 2018Date of Patent: June 29, 2021Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Yoshio Oka, Yoshifumi Uchita, Yoshiro Adachi
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Publication number: 20210148766Abstract: A sensor unit disclosed herein is a sensor unit that is to be mounted in a housing section included in a device, and the sensor unit includes a FPC including a detection line and having flexibility, a temperature sensor connected to a connection portion of the detection line on a surface of the FPC, and an elastic member disposed on the surface of the FPC so as to be elastically deformable. The elastic member is to be elastically compressed within the housing section to press a first plate member mounted on a back surface of the FPC toward the device by a resilient force.Type: ApplicationFiled: October 5, 2018Publication date: May 20, 2021Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Shinichi TAKASE, Yoshifumi UCHITA, Takayuki TSUMAGARI
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Publication number: 20210098848Abstract: A wiring module includes a flat line that is mounted on a power storage element group including power storage elements and a line-side connector that is to be fitted to a device-side connector included in a control unit of the power storage element group. The flat line includes an extra section extending from the power storage element group and a bending restricting plate is disposed on a portion of the extra section.Type: ApplicationFiled: April 4, 2019Publication date: April 1, 2021Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS,INC.Inventors: Shinichi TAKASE, Hideo TAKAHASHI, Isamu HAMAMOTO, Yoshifumi UCHITA, Takayuki TSUMAGARI
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Patent number: 10965046Abstract: A terminal 20 includes a terminal connection portion 21 connected to a counterpart terminal and a board connection portion 24 connected to a conductive path 13 of a board 11. The board connection portion 24 has a plate shape portion 25 that is a plate shape. The plate shape portion is disposed behind the terminal connection portion 21 and is soldered to the conductive path 13 of the board 11. The board connection portion has a plate-shape first projection walls 28A to 28D that are bent from edge portions of a lateral direction side of the plate shape portion 25 and that project to an opposite side to the board 11 side. The plate shape portion 25 and the first projection walls 28A to 28D have a plating layer 37 that is formed on a plate surface of the plate shape portion and the first projection walls.Type: GrantFiled: June 28, 2018Date of Patent: March 30, 2021Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.Inventors: Takanobu Shimada, Hiroki Hirai, Jyunichi Ono, Yoshio Oka, Yoshifumi Uchita, Yoshiro Adachi
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Publication number: 20210044067Abstract: According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.Type: ApplicationFiled: July 26, 2018Publication date: February 11, 2021Inventors: Yoshiro ADACHI, Yoshifumi UCHITA, Manabu SUDOU, Yoshio OKA
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Publication number: 20210037642Abstract: A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated opposite at least the terminal connecting area, wherein a thickness of the reinforcement member increases toward the one end edge in a stepwise or gradual manner.Type: ApplicationFiled: June 25, 2018Publication date: February 4, 2021Inventors: Yoshio OKA, Yoshifumi UCHITA, Yoshiro ADACHI
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Publication number: 20200366009Abstract: A terminal 20 includes a terminal connection portion 21 connected to a counterpart terminal and a board connection portion 24 connected to a conductive path 13 of a board 11. The board connection portion 24 has a plate shape portion 25 that is a plate shape. The plate shape portion is disposed behind the terminal connection portion 21 and is soldered to the conductive path 13 of the board 11. The board connection portion has a plate-shape first projection walls 28A to 28D that are bent from edge portions of a lateral direction side of the plate shape portion 25 and that project to an opposite side to the board 11 side. The plate shape portion 25 and the first projection walls 28A to 28D have a plating layer 37 that is formed on a plate surface of the plate shape portion and the first projection walls.Type: ApplicationFiled: June 28, 2018Publication date: November 19, 2020Applicants: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.Inventors: Takanobu SHIMADA, Hiroki HIRAI, Jyunichi ONO, Yoshio OKA, Yoshifumi UCHITA, Yoshiro ADACHI
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Publication number: 20200333192Abstract: A sensor unit disclosed herein is a temperature sensor unit to be attached to an energy storage device. The temperature sensor unit includes an FPC to be positioned on an energy storage device body, a temperature sensor connected to a detection line of the FPC, a housing disposed on the FPC and covering the temperature sensor, and a biasing member elastically and deformably held in the housing and configured to bias the lower housing of the housing toward the energy storage device body by elastic restoring force to bring the temperature sensor into contact with the energy storage device body with the FPC therebetween.Type: ApplicationFiled: October 2, 2018Publication date: October 22, 2020Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Shinichi TAKASE, Yasuhiko KOTERA, Isamu HAMAMOTO, Yoshifumi UCHITA, Takayuki TSUMAGARI, Yusuke SUZUKI, Atsushi YAMANAKA
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Patent number: 10709016Abstract: A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated at least at a position opposite the terminal connecting area, wherein a shape of an end edge of the reinforcement member on the same side as an opposite end edge of the conductive pattern includes a periodic form constituted by curved lines.Type: GrantFiled: April 26, 2018Date of Patent: July 7, 2020Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Yoshio Oka, Yoshifumi Uchita, Yoshiro Adachi