Patents by Inventor Yoshifumi UCHITA

Yoshifumi UCHITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11245237
    Abstract: According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: February 8, 2022
    Assignees: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES. LTD.
    Inventors: Yoshiro Adachi, Yoshifumi Uchita, Manabu Sudou, Yoshio Oka
  • Publication number: 20220021083
    Abstract: A connection module includes a FPC and bus bars connected to the FPC and connecting the electrode terminals of power storage elements that are adjacent to each other. The FPC includes a first wiring portion, a second bus bar mount portion, and a third bus bar mount portion to which the bus bars are connected. The FPC further includes a second expandable/contractable portion and a third expandable/contractable portion. The second expandable/contractable portion is continuous from the second bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the first wiring portion and the third bus bar mount portion. The third expandable/contractable portion is continuous from the third bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the second bus bar mount portion.
    Type: Application
    Filed: November 1, 2019
    Publication date: January 20, 2022
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Kouichi NAGAMINE, Masayuki UEDA, Yoshifumi UCHITA, Takayuki TSUMAGARI
  • Publication number: 20220013868
    Abstract: A connection module includes a FPC, bus bars connected to the FPC and connecting the electrode terminals of power storage elements that are adjacent to each other, and a resin protector holding the bus bars and the FPC. The FPC includes a FPC body member and a first deformable portion that connects the FPC body member and the bus bars. The resin protector includes a FPC holding portion to which the FPC body member is fixed, movable bus bar holding portions to which the bus bars are fixed, respectively, and second deformable portions that connect the FPC holding portion and the movable bus bar holding portions. The first deformable portion and the second deformable portion connect the bus bars and the movable bus bar holding portions to the FPC body member and the FPC holding portion, respectively, such that the bus bars and the movable bus bar holding portions are movable with respect to the FPC body member and the FPC holding portion.
    Type: Application
    Filed: November 1, 2019
    Publication date: January 13, 2022
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Kouichi NAGAMINE, Masayuki UEDA, Yoshifumi UCHITA, Takayuki TSUMAGARI
  • Publication number: 20220013867
    Abstract: A connection module is a module mounted on a power storage element group including power storage elements having electrode terminals and connecting the power storage elements. The connection module includes a FPC including wiring portions and bus bars connected to the wiring portions and connecting the electrode terminals of the power storage elements that are adjacent to each other. The FPC includes a first multi-layered portion including the wiring portions that are overlapped with each other by folding the FPC and includes a second multi-layered portion including the wiring portions that are overlapped with each other by folding the FPC.
    Type: Application
    Filed: November 1, 2019
    Publication date: January 13, 2022
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Kouichi NAGAMINE, Masayuki UEDA, Yoshifumi UCHITA, Takayuki TSUMAGARI
  • Patent number: 11051399
    Abstract: A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated opposite at least the terminal connecting area, wherein a thickness of the reinforcement member increases toward the one end edge in a stepwise or gradual manner.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: June 29, 2021
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Yoshio Oka, Yoshifumi Uchita, Yoshiro Adachi
  • Publication number: 20210148766
    Abstract: A sensor unit disclosed herein is a sensor unit that is to be mounted in a housing section included in a device, and the sensor unit includes a FPC including a detection line and having flexibility, a temperature sensor connected to a connection portion of the detection line on a surface of the FPC, and an elastic member disposed on the surface of the FPC so as to be elastically deformable. The elastic member is to be elastically compressed within the housing section to press a first plate member mounted on a back surface of the FPC toward the device by a resilient force.
    Type: Application
    Filed: October 5, 2018
    Publication date: May 20, 2021
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Shinichi TAKASE, Yoshifumi UCHITA, Takayuki TSUMAGARI
  • Publication number: 20210098848
    Abstract: A wiring module includes a flat line that is mounted on a power storage element group including power storage elements and a line-side connector that is to be fitted to a device-side connector included in a control unit of the power storage element group. The flat line includes an extra section extending from the power storage element group and a bending restricting plate is disposed on a portion of the extra section.
    Type: Application
    Filed: April 4, 2019
    Publication date: April 1, 2021
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS,INC.
    Inventors: Shinichi TAKASE, Hideo TAKAHASHI, Isamu HAMAMOTO, Yoshifumi UCHITA, Takayuki TSUMAGARI
  • Patent number: 10965046
    Abstract: A terminal 20 includes a terminal connection portion 21 connected to a counterpart terminal and a board connection portion 24 connected to a conductive path 13 of a board 11. The board connection portion 24 has a plate shape portion 25 that is a plate shape. The plate shape portion is disposed behind the terminal connection portion 21 and is soldered to the conductive path 13 of the board 11. The board connection portion has a plate-shape first projection walls 28A to 28D that are bent from edge portions of a lateral direction side of the plate shape portion 25 and that project to an opposite side to the board 11 side. The plate shape portion 25 and the first projection walls 28A to 28D have a plating layer 37 that is formed on a plate surface of the plate shape portion and the first projection walls.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: March 30, 2021
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.
    Inventors: Takanobu Shimada, Hiroki Hirai, Jyunichi Ono, Yoshio Oka, Yoshifumi Uchita, Yoshiro Adachi
  • Publication number: 20210044067
    Abstract: According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.
    Type: Application
    Filed: July 26, 2018
    Publication date: February 11, 2021
    Inventors: Yoshiro ADACHI, Yoshifumi UCHITA, Manabu SUDOU, Yoshio OKA
  • Publication number: 20210037642
    Abstract: A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated opposite at least the terminal connecting area, wherein a thickness of the reinforcement member increases toward the one end edge in a stepwise or gradual manner.
    Type: Application
    Filed: June 25, 2018
    Publication date: February 4, 2021
    Inventors: Yoshio OKA, Yoshifumi UCHITA, Yoshiro ADACHI
  • Publication number: 20200366009
    Abstract: A terminal 20 includes a terminal connection portion 21 connected to a counterpart terminal and a board connection portion 24 connected to a conductive path 13 of a board 11. The board connection portion 24 has a plate shape portion 25 that is a plate shape. The plate shape portion is disposed behind the terminal connection portion 21 and is soldered to the conductive path 13 of the board 11. The board connection portion has a plate-shape first projection walls 28A to 28D that are bent from edge portions of a lateral direction side of the plate shape portion 25 and that project to an opposite side to the board 11 side. The plate shape portion 25 and the first projection walls 28A to 28D have a plating layer 37 that is formed on a plate surface of the plate shape portion and the first projection walls.
    Type: Application
    Filed: June 28, 2018
    Publication date: November 19, 2020
    Applicants: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.
    Inventors: Takanobu SHIMADA, Hiroki HIRAI, Jyunichi ONO, Yoshio OKA, Yoshifumi UCHITA, Yoshiro ADACHI
  • Publication number: 20200333192
    Abstract: A sensor unit disclosed herein is a temperature sensor unit to be attached to an energy storage device. The temperature sensor unit includes an FPC to be positioned on an energy storage device body, a temperature sensor connected to a detection line of the FPC, a housing disposed on the FPC and covering the temperature sensor, and a biasing member elastically and deformably held in the housing and configured to bias the lower housing of the housing toward the energy storage device body by elastic restoring force to bring the temperature sensor into contact with the energy storage device body with the FPC therebetween.
    Type: Application
    Filed: October 2, 2018
    Publication date: October 22, 2020
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Shinichi TAKASE, Yasuhiko KOTERA, Isamu HAMAMOTO, Yoshifumi UCHITA, Takayuki TSUMAGARI, Yusuke SUZUKI, Atsushi YAMANAKA
  • Patent number: 10709016
    Abstract: A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated at least at a position opposite the terminal connecting area, wherein a shape of an end edge of the reinforcement member on the same side as an opposite end edge of the conductive pattern includes a periodic form constituted by curved lines.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: July 7, 2020
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Yoshio Oka, Yoshifumi Uchita, Yoshiro Adachi
  • Publication number: 20200214129
    Abstract: A flexible printed circuit board includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on an opposite surface of the base film and situated at least at a position opposite the terminal connecting area, wherein the reinforcement member has one or more lines of hollow holes aligning with a width direction thereof.
    Type: Application
    Filed: August 3, 2018
    Publication date: July 2, 2020
    Inventors: Yoshiro ADACHI, Yoshifumi UCHITA, Yoshio OKA
  • Patent number: 10653007
    Abstract: A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The flexible printed circuit board includes at least one opening passing through front and rear surfaces on at least one of the right and left sides of the fuse portion in a two-dimensional view.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: May 12, 2020
    Assignees: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., AutoNetworks Technologies, Ltd., Sumitomo Electric Industries, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Takayuki Tsumagari, Yoshifumi Uchita, Shinichi Takase, Hirohisa Saito
  • Publication number: 20200113046
    Abstract: A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated at least at a position opposite the terminal connecting area, wherein a shape of an end edge of the reinforcement member on the same side as an opposite end edge of the conductive pattern includes a periodic form constituted by curved lines.
    Type: Application
    Filed: April 26, 2018
    Publication date: April 9, 2020
    Inventors: Yoshio OKA, Yoshifumi UCHITA, Yoshiro ADACHI
  • Patent number: 10297808
    Abstract: A battery wiring module includes bus bars and a flexible wiring board having wires connected to the respective bus bars. The flexible wiring board has a body portion and extensions extending from the body portion toward the respective bus bars. Each of the extensions supports one of the wires and has an end section where a pad is arranged, that is part of each of the wires. Each of the bus bars has at least one cutout portion, and the pad is arranged on each of the bus bars such that the pad overlaps at least part of at least one cutout portion. The pad and the at least part of the at least one cutout portion are connected to each other with solder.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: May 21, 2019
    Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Hirohisa Saito, Yoshifumi Uchita, Shinichi Takase
  • Patent number: 10244626
    Abstract: An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: March 26, 2019
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Takayuki Yonezawa, Shingo Kaimori, Jun Sugawara, Shogo Asai, Yoshifumi Uchita, Masaya Kakimoto
  • Publication number: 20190006141
    Abstract: A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The conductive pattern has a pair of measurement pad portions configured to enable measurement of a potential difference between two points in the vicinity of both ends of the fuse portion.
    Type: Application
    Filed: June 22, 2016
    Publication date: January 3, 2019
    Applicants: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., AutoNetworks Technologies, Ltd., Sumitomo Electric Industries, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Takayuki TSUMAGARI, Yoshifumi UCHITA, Shinichi TAKASE, Hirohisa SAITO
  • Publication number: 20180242450
    Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.
    Type: Application
    Filed: August 6, 2016
    Publication date: August 23, 2018
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC FINE POLYMER, INC.
    Inventors: Yuichiro YAMANAKA, Yoshio OKA, Satoshi KIYA, Yoshifumi UCHITA, Makoto NAKABAYASHI