Patents by Inventor Yoshiharu Fukushima

Yoshiharu Fukushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10726878
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: July 28, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Takafumi Betsui, Naoto Taoka, Motoo Suwa, Shigezumi Matsui, Norihiko Sugita, Yoshiharu Fukushima
  • Publication number: 20180301172
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Application
    Filed: June 18, 2018
    Publication date: October 18, 2018
    Inventors: Takafumi BETSUI, Naoto TAOKA, Motoo SUWA, Shigezumi MATSUI, Norihiko SUGITA, Yoshiharu FUKUSHIMA
  • Patent number: 10020028
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: July 10, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Takafumi Betsui, Naoto Taoka, Motoo Suwa, Shigezumi Matsui, Norihiko Sugita, Yoshiharu Fukushima
  • Patent number: 9792959
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: October 17, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Takafumi Betsui, Naoto Taoka, Motoo Suwa, Shigezumi Matsui, Norihiko Sugita, Yoshiharu Fukushima
  • Publication number: 20170062021
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Application
    Filed: November 15, 2016
    Publication date: March 2, 2017
    Inventors: Takafumi BETSUI, Naoto TAOKA, Motoo SUWA, Shigezumi MATSUI, Norihiko SUGITA, Yoshiharu FUKUSHIMA
  • Publication number: 20170062020
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Application
    Filed: November 15, 2016
    Publication date: March 2, 2017
    Inventors: Takafumi BETSUI, Naoto TAOKA, Motoo SUWA, Shigezumi MATSUI, Norihiko SUGITA, Yoshiharu FUKUSHIMA
  • Patent number: 9530457
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: December 27, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Takafumi Betsui, Naoto Taoka, Motoo Suwa, Shigezumi Matsui, Norihiko Sugita, Yoshiharu Fukushima
  • Publication number: 20150036406
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Application
    Filed: October 21, 2014
    Publication date: February 5, 2015
    Inventors: Takafumi BETSUI, Naoto TAOKA, Motoo SUWA, Shigezumi MATSUI, Norihiko SUGITA, Yoshiharu FUKUSHIMA
  • Patent number: 8898613
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: November 25, 2014
    Assignee: Renesas Electronics Corporation
    Inventors: Takafumi Betsui, Naoto Taoka, Motoo Suwa, Shigezumi Matsui, Norihiko Sugita, Yoshiharu Fukushima
  • Publication number: 20140160826
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Application
    Filed: February 18, 2014
    Publication date: June 12, 2014
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Takafumi BETSUI, Naoto TAOKA, Motoo SUWA, Shigezumi MATSUI, Norihiko SUGITA, Yoshiharu FUKUSHIMA
  • Patent number: 8694949
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: April 8, 2014
    Assignee: Renesas Electronics Corporation
    Inventors: Takafumi Betsui, Naoto Taoka, Motoo Suwa, Shigezumi Matsui, Norihiko Sugita, Yoshiharu Fukushima
  • Patent number: 8386992
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: February 26, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Takafumi Betsui, Naoto Taoka, Motoo Suwa, Shigezumi Matsui, Norihiko Sugita, Yoshiharu Fukushima
  • Publication number: 20120079238
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Application
    Filed: December 2, 2011
    Publication date: March 29, 2012
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Takafumi BETSUI, Naoto TAOKA, Motoo SUWA, Shigezumi MATSUI, Norihiko SUGITA, Yoshiharu FUKUSHIMA
  • Patent number: 8099860
    Abstract: The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than ?, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than ?, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: January 24, 2012
    Assignee: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Akio Watanabe, Takuya Imoto, Yoshiharu Fukushima
  • Patent number: 8091061
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: January 3, 2012
    Assignee: Renesas Electronics Corporation
    Inventors: Takafumi Betsui, Naoto Taoka, Motoo Suwa, Shigezumi Matsui, Norihiko Sugita, Yoshiharu Fukushima
  • Patent number: 7721424
    Abstract: The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: May 25, 2010
    Assignee: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Akira Aoki, Makio Kameda, Yoshiharu Fukushima, Katsuyuki Seto, Hideaki Fukushima
  • Patent number: 7581310
    Abstract: The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.
    Type: Grant
    Filed: February 10, 2005
    Date of Patent: September 1, 2009
    Assignee: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Yoshiharu Fukushima, Takahiro Nagata, Katsuyuki Seto
  • Publication number: 20090211086
    Abstract: The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
    Type: Application
    Filed: May 1, 2009
    Publication date: August 27, 2009
    Applicant: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
    Inventors: Akira AOKI, Makio Kameda, Yoshiharu Fukushima, Katsuyuki Seto, Hideaki Fukushima
  • Publication number: 20080201940
    Abstract: The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than ?, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than ?, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position.
    Type: Application
    Filed: February 25, 2008
    Publication date: August 28, 2008
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Akio WATANABE, Takuya Imoto, Yoshiharu Fukushima
  • Publication number: 20070192559
    Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
    Type: Application
    Filed: December 28, 2006
    Publication date: August 16, 2007
    Inventors: Takafumi BETSUI, Naoto Taoka, Motoo Suwa, Shigezumi Matsui, Norihiko Sugita, Yoshiharu Fukushima