Abstract: A work direction determining device includes a passive tag type IC tag secured at a predetermined position on the front surface thereof. The IC tag includes a substrate, an IC module and an antenna coil disposed on the substrate in an offset manner. The device includes an antenna communicating with the IC tag, and a determination circuit. Where the work and the direction determining device are located at respective predetermined communication positions, communication is done between the antenna of the direction determining device and the antenna coil of the IC tag, and the magnitude of communication intensity during the communication is determined by the determination circuit to thereby determine a direction of the work.

Abstract: A work direction determining device includes a passive tag type IC tag secured at a predetermined position on the front surface thereof. The IC tag includes a substrate, an IC module and an antenna coil disposed on the substrate in an offset manner. The device includes an antenna communicating with the IC tag, and a determination circuit. Where the work and the direction determining device are located at respective predetermined communication positions, communication is done between the antenna of the direction determining device and the antenna coil of the IC tag, and the magnitude of communication intensity during the communication is determined by the determination circuit to thereby determine a direction of the work.

Abstract: An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.

Abstract: An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.

Abstract: An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.

Abstract: A semiconductor chip of rewiring layer-integral type capable of preventing a maloperation by noise and a deterioration of communication characteristics and a semiconductor device with excellent communication characteristics; the semiconductor chip, wherein a rewiring layer (3) is formed on a circuit formed surface (1a) through an insulating layer (2) so as to form an antenna coil (4) with the rewiring layer (3), the antenna coil (4) is formed around the periphery of an analog circuit (21) on the circuit formed surface (1a) by avoiding forming on the analog circuit (21), the analog circuit (21) may be formed by collecting analog circuits to be formed in the semiconductor chip (1A) therein, may be one of the particularly noise-susceptible analog circuits such as a power circuit, a calculation amplifier, a comparison amplifier, an RF receiving part, an RF transmitting part, an RF synthesizer part, and a voltage build-up circuit and an amplifying circuit forming a part of a memory part, or may be a coil provided

Abstract: A semiconductor chip of rewiring layer-integral type capable of preventing a maloperation by noise and a deterioration of communication characteristics and a semiconductor device with excellent communication characteristics; the semiconductor chip, wherein a rewiring layer (3) is formed on a circuit formed surface (1a) through an insulating layer (2) so as to form an antenna coil (4) with the rewiring layer (3), the antenna coil (4) is formed around the periphery of an analog circuit (21) on the circuit formed surface (1a) by avoiding forming on the analog circuit (21), the analog circuit (21) may be formed by collecting analog circuits to be formed in the semiconductor chip (1A) therein, may be one of the particularly noise-susceptible analog circuits such as a power circuit, a calculation amplifier, a comparison amplifier, an RF receiving part, an RF transmitting part, an RF synthesizer part, and a voltage build-up circuit and an amplifying circuit forming a part of a memory part, or may be a coil provided

Abstract: An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.

Abstract: An electromagnetic coupling connector for transferring data by an electromagnetic coupling system, including a plurality of data transfer coils for transferring data, disposed at an end portion of a side surface of the connector, a waveform shaper for shaping a waveform of a data signal received by the data transfer coils, and a connector for transferring the signal obtained by the waveform shaper to an equipment to which the electromagnetic coupling connector is fitted. The electromagnetic coupling connector may include a signal transmission/reception portion and a power transmission or reception portion, the signal transmission/reception portion includes a signal amplification circuit, a waveform shaping circuit, a serial/parallel signal conversion circuit and a parallel/serial signal conversion circuit, the power transmission portion includes an oscillation circuit, and the power reception portion includes a rectification/smoothing circuit and a constant voltage.