Patents by Inventor Yoshiharu KATAYAMA

Yoshiharu KATAYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 11705442
    Abstract: According to one embodiment, a semiconductor device includes an integrated circuit (IC) chip and a silicon capacitor. The IC chip has a first terminal and a second terminal on a first surface. The silicon capacitor has a first electrode and a second electrode on a second surface facing the first surface. The first electrode is electrically connected to the first terminal through a first conductive member, and the second electrode is electrically connected to the second terminal through a second conductive member.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: July 18, 2023
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Atsushi Hosokawa, Yasuhisa Shintoku, Yasukazu Noine, Yoshiharu Katayama
  • SEMICONDUCTOR DEVICE
    Publication number: 20220084995
    Abstract: According to one embodiment, a semiconductor device includes an integrated circuit (IC) chip and a silicon capacitor. The IC chip has a first terminal and a second terminal on a first surface. The silicon capacitor has a first electrode and a second electrode on a second surface facing the first surface. The first electrode is electrically connected to the first terminal through a first conductive member, and the second electrode is electrically connected to the second terminal through a second conductive member.
    Type: Application
    Filed: March 3, 2021
    Publication date: March 17, 2022
    Inventors: Atsushi HOSOKAWA, Yasuhisa SHINTOKU, Yasukazu NOINE, Yoshiharu KATAYAMA