Abstract: The polishing composition of the present invention is a polishing composition for polishing a tungsten-containing metal layer formed on an insulating layer, the polishing composition comprising: abrasive grains; one or more halogen acids selected from the group consisting of iodic acid, iodous acid, and hypoiodous acid; a strong acid; a hydrogen-ion-supplying agent; and water.

Abstract: A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.

Abstract: A local exposure apparatus for performing exposure processing on a specific area of a photosensitive film formed on a substrate includes a substrate conveyor configured to define a substrate conveying path and to horizontally convey the substrate along the substrate conveying path, a chamber configured to define an exposure processing space, a light source including a plurality of light-emitting elements linearly arranged above the substrate conveying path, a light emission drive unit configured to selectively drive one or more of the light-emitting elements of the light source, a substrate detector configured to detect the substrate conveyed by the substrate conveyor, and a control unit configured to control the light emission drive unit such that, when the specific area of the photosensitive film moves below the light source, only the light-emitting elements capable of irradiating the given area are driven to emit the light.

Abstract: A polishing composition of the invention is a polishing composition which is suitable for polishing a metal film, which is so-called final polishing, and contains colloidal silica having an average particle size of 20 nm or more and less than 80 nm which is determined by particle size distribution measurement using a light scattering method as abrasive grains; and at least one selected from iodic acid and its salt as an oxidizing agent, with the balance of water. By containing such components, the polishing composition shows nonselectivity, while being sufficiently suppressed in dishing and erosion.

Abstract: A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.

Abstract: The polishing composition of the present invention is a polishing composition for polishing a tungsten-containing metal layer formed on an insulating layer, the polishing composition comprising: abrasive grains; one or more halogen acids selected from the group consisting of iodic acid, iodous acid, and hypoiodous acid; a strong acid; a hydrogen-ion-supplying agent; and water.

Abstract: A local exposure apparatus for performing exposure processing on a specific area of a photosensitive film formed on a substrate includes a substrate conveyor configured to define a substrate conveying path and to horizontally convey the substrate along the substrate conveying path, a chamber configured to define an exposure processing space, a light source including a plurality of light-emitting elements linearly arranged above the substrate conveying path, a light emission drive unit configured to selectively drive one or more of the light-emitting elements of the light source, a substrate detector configured to detect the substrate conveyed by the substrate conveyor, and a control unit configured to control the light emission drive unit such that, when the specific area of the photosensitive film moves below the light source, only the light-emitting elements capable of irradiating the given area are driven to emit the light.

Abstract: A polishing composition of the invention is a polishing composition which is suitable for polishing a metal film, which is so-called final polishing, and contains colloidal silica having an average particle size of 20 nm or more and less than 80 nm which is determined by particle size distribution measurement using a light scattering method as abrasive grains; and at least one selected from iodic acid and its salt as an oxidizing agent, with the balance of water. By containing such components, the polishing composition shows non-selectivity, while being sufficiently suppressed in dishing and erosion.

Abstract: When a salmon ovary is cut, the salmon ovary is held and transferred and in a whole state, the ovary is locally pushed at predetermined gaps, eggs in a membrane are divided into a plurality of clusters by this pushing operation, and the pushed portions of the membrane are then cut.

Abstract: A processing system for processing a substrate. The processing system includes a plurality of processing machines, a machine movable along a transfer path for transferring the substrate to the machines, a drive unit for driving the machine, and a control unit. The control unit includes a memory for storing a teaching threshold in a teaching mode and a practical operation threshold in a practical operation mode that is higher than the teaching threshold when a moving parameter of the drive unit exceeds a given value. The control unit also includes a controller monitoring a parameter representing a moving state of the drive unit to stop the drive unit when the parameter exceeds the practical operation threshold in the practical operation mode or when the parameter exceeds the teaching threshold in the teaching mode.

Abstract: Disclosed is a method of forming a coating film, in which a coating solution is supplied from a linear nozzle onto a substrate held by a spin chuck arranged inside a cup having an opening so as to form a coating film on the substrate, comprising the steps of (a) allowing a spin chuck to hold rotatably a substrate, and (b) moving the linear nozzle and supplying a coating solution from the linear nozzle onto the substrate while rotating the substrate in a moving direction of the linear nozzle.

Abstract: A scrubbing apparatus comprises a holding member, which holds the outer circumference of the substrate from its back surface and has an opening to expose the back surface of the held substrate toward the bottom side; a supporting member, which supports substantially the center between two opposed sides of the holding member; a scrubbing brush, which comes in contact with the exposed back surface of the substrate from the bottom side; a brush drive mechanism, which transfers the scrubbing brush along the two opposed sides of the holding member; and a rotation drive mechanism, which drives to rotate the holding member together with the supporting member. Thus, a space can be saved, and the back surface of the substrate can be scrubbed.

Abstract: Salmon or trout ovary is processed into food to make a mouthful of salmon or trout roe. The ovary is taken out of a salmon or trout by incising the salmon or trout abdomen, divided into small ovary pieces of a mouthful size, immersed in saturated salt water, drained to be deprived of salt water, and stored for a prescribed period of time in packing cases having perforated sheet separators.

Abstract: An interlock apparatus for a transfer machine includes a drive unit for driving the arms of a transfer machine for transferring a substrate such as an LCD substrate. The apparatus also includes a control unit having a monitor function for monitoring a parameter representing the movement condition of the arms and stopping the drive unit when the parameter exceed a predetermined value. The apparatus also includes a switching function for selectively switching the predetermined value between a teaching mode in which the position of the arm is controlled and a practical operation mode in which the transfer machine is actually operated.

Abstract: Salmon or trout ovary is processed into food to make a mouthful of salmon or trout roe. The ovary is taken out of a salmon or trout by incising the salmon or trout abdomen, divided into small ovary pieces of a mouthful size, immersed in saturated salt water, drained to be deprived of salt water, and stored for a prescribed period of time.