Patents by Inventor Yoshiharu Saegusa

Yoshiharu Saegusa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for cutting substrate and method for manufacturing electronic element
    Patent number: 8470691
    Abstract: An image pickup section picks up images of a pair of targets formed on a substrate with a cutting line interposed therebetween (S101). An extracting section extracts the targets from the images (S102). Then, a measuring section measures the distance d1 between the targets (S103). When a driving section presses a blade against the substrate (S104), the substrate is pressed by the blade to become warped and starts to break. Thus, the image pickup section picks up images of the targets again (S105), and the extracting section extracts the targets from the images (S106). The measuring section measures the distance d2 between the targets (S107). A determining section determines the cutting state of the substrate from the amount of change (d2?d1) of the distances between the targets (S108).
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: June 25, 2013
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Yoshiharu Saegusa, Susumu Sugano
  • METHOD FOR CUTTING SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT
    Publication number: 20110287608
    Abstract: An image pickup section picks up images of a pair of targets formed on a substrate with a cutting line interposed therebetween (S101). An extracting section extracts the targets from the images (S102). Then, a measuring section measures the distance d1 between the targets (S103). When a driving section presses a blade against the substrate (S104), the substrate is pressed by the blade to become warped and starts to break. Thus, the image pickup section picks up images of the targets again (S105), and the extracting section extracts the targets from the images (S106). The measuring section measures the distance d2 between the targets (S107). A determining section determines the cutting state of the substrate from the amount of change (d2?d1) of the distances between the targets (S108).
    Type: Application
    Filed: January 19, 2010
    Publication date: November 24, 2011
    Applicant: SHOWA DENKO K.K.
    Inventors: Yoshiharu Saegusa, Susumu Sugano