Abstract: A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.

Abstract: An operational amplifier connects to a midpoint between a plurality of serially connected battery cells constituting a secondary battery to provide a charging circuit for inhibiting a charge/discharge current from flowin to the midpoint and an input/output current from flowing from the midpoint to each battery cell. The charging circuit includes excess voltage detectors for detecting whether the voltage is an excess voltage, and a charging controller for determining an overcharge state of each battery cell on the basis of the voltages detected and controlling an ON/OFF of a charging switch. Voltage followers include an operational amplifier, NPN transistor, and the like, connected to a midpoint between a first battery cell and a second battery cell and a midpoint between the second battery cell and the third battery, respectively. The outputs of the voltage followers are configured as the grounds of the excess voltage detectors, respectively.

Abstract: The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding.

Abstract: The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding.

Abstract: The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding.

Abstract: A charging apparatus includes: a charging voltage output unit; a duty ratio setting unit; a PWM signal output unit; a reference voltage generation unit; a reference voltage limit unit; a detected voltage generation unit; and a charging voltage control unit. The reference voltage generation unit generates a reference voltage for determining whether or not a charging voltage has reached a target charging voltage, by smoothing a PWM signal outputted from the PWM signal output unit. The reference voltage limit unit limits at least one of a maximum value and a minimum value of the reference voltage generated by the reference voltage generation unit.

Abstract: The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding.

Abstract: The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding.

Abstract: The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding.

Abstract: The present invention, by connecting an operational amplifier to a midpoint between a plurality of serially connected battery cells constituting the secondary battery, provides a charging circuit for a secondary battery, which is capable of inhibiting a charge/discharge current from flowing to the midpoint and an input/output current from flowing from the midpoint to each battery cell. The charging circuit has disposed therein excess voltage detectors 4 to 6 for detecting whether the voltage of each of the three lithium ion battery cells 1 to 3, by which a battery is constituted, is an excess voltage, and a charging controller 7 for determining an overcharge state of each battery cell on the basis of the voltages detected by the excess voltage detectors 4 to 6 and then controlling ON/OFF of a charging switch part 8.

Abstract: The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding.

Abstract: The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding.

Abstract: The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding.

Abstract: A display position of an entire image in one frame of an input image signal is moved as time elapses. When there is a region displayed with a constant image signal level for a predetermined period in the moving image, level adjustment is performed on the image signal for only this region to reduce the signal level of that region.

Abstract: The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding.

Abstract: The telecine display method calculates a first timing signal based on the refresh rate of a video signal having a telecine conversion applied from an original picture image of a film source, and a second timing signal based on the refresh rate of the original picture image of the film source. And, the method applies the 2-3 pull-down processing to the video signal in synchronization with the first timing signal, stores the video signal in a first memory, reads out the video signal from the first memory on the basis of the second timing signal, and outputs it to a plasma display module. Thereby, the video signal presented on the plasma display module is to hold the refresh rate of the original picture image of the film source, thus displaying a smooth picture image without unnaturalness.

Abstract: An image display device comprises a telecine discriminator which determines whether an image signal input from an external unit is a telecine signal and computes a refresh rate of an original picture signal before conversion into the image signal; an IP converter which converts the telecine signal by a 2-3 pull-down system; and the synchronous processor for read. The synchronous processor for read reads an IP signal from a memory at the timing of the refresh rate to smoothly output and display a picture without jerkiness when dynamic playback is carried out.

Abstract: A protection arrangement for a battery charger of the type used to charge battery packs used for electromotive tools. A self-holding protector is arranged in the neighborhood of an inserting hole of the battery charger for receiving a storage battery pack 50 to be charged. This self-holding protector element includes two elements electrically connected in parallel. One of these two elements is a bimetal which opens when it heats or flows too much current. The other of the two elements is a positive characteristic thermistor (PCT) which generates heat when a current flows through it. When a battery pack being charged becomes over-charged and heats, the bimetal element of the protector opens, and charging current stops flowing. When the bimetal element opens, electric current flows through the PCT. This current causes the PCT to heat and maintain the bimetal element in its open condition.