Abstract: A semiconductor device includes a semiconductor chip attached to a lead frame with recesses on the rear surface of the semiconductor chip opposite the lead frame. These recesses increase the heat radiation area of the semiconductor chip. In a method of producing a semiconductor device, the height of a cavity between upper and lower dies is smaller than the height of the semiconductor chip including bump electrodes. During a molding process, the bump electrodes contact the upper die or a dam surrounding the bump electrodes so that no thin burrs are produced on the surfaces of the bump electrodes in the molding process.

Abstract: A semiconductor device includes a semiconductor chip; leads including first inner leads and second inner leads extending substantially radially from a central point of the semiconductor chip; electrical conductors electrically connecting the semiconductor chip to the lead frame; and an encapsulating resin encapsulating the semiconductor chip, the electrical conductors, and the inner leads, Each of the first inner leads has a first inner end located proximate the central point and each of the second inner leads has a second inner end located farther from the central point than the first inner ends. The first and second inner leads are alternatingly arranged. Thus, at least some of the inner leads extend under the semiconductor chip, providing heat conducting paths. The lead frame includes a frame and leads supported by the frame and including first inner leads and second inner leads extending substantially radially toward a central point of the frame.

Abstract: In an apparatus for reproducing a photographed image on each frame of a developed photographic roll film, wherein each frame includes an image region on which the photographed image is provided and a memory region in which information with regard to the photographed image is stored, an information reader for reading the information stored in the memory region; a processing circuit for processing image signals photoelectrically obtained by an image reader on the bases of the information; and the processed image signals are displayed on the screen.

Abstract: A data recording unit in use with a camera for recording information data, obtained through a GPS receiver, on a photographing film. The data recording unit includes: a selector for selecting a geodetic system from plural geodetic systems; a data converter for converting position information data, obtained through the GPS receiver, to converted position information data in the geodetic system which is selected by the selector; and a printing LED for recording the converted position information data on the photographic film together with images photographed by the camera.

Abstract: A camera in which a photographic data is recorded on a photographic film, includes a plurality of light emitting sections aligned in a direction perpendicular to a film advancing direction. The light emitting sections conducting exposure on a photographic image plane, have a plurality of light emitting elements, the wavelengths of light emitted by the light emitting elements are different. The camera further includes a memory for storing photographic information to be recorded on the film surface and a controller for selectively turning on and off the light emitting sections in the process of advancing the film in accordance with the information stored in the memory.

Abstract: A continuous denitration apparatus capable of ensuring mass processing of a nitrate solution of a nuclear fuel and a continuous stable operation. By a rotation of screws, uranium nitrate solution supplied from a liquid feed inlet is continuously conveyed. A trough is divided into a concentration zone, a denitration zone and a drying zone. Microwaves emitted from a microwave incident inlet pass through a microwave permeable part provided in a critical shield plate for covering the upper part of the trough and are applied to the uranium nitrate solution of high concentration and high viscosity, conveyed by the screws. The uranium nitrate solution is denitrated to prepare a denitrated product (uranium trioxide). This denitrated product is dried in the drying zone to obtain powder to be discharged from an outlet.

Abstract: A semiconductor substrate includes a plurality of parallel resistor films connected between a pair of conductor strips. The resistor films and conductor strips are coated with a protective coat. The resistor films are cut one by one by laser trimming to adjust the total resistance value of the plurality of parallel resistor films. The protective coat on the uncut resistors remains unremoved.

Abstract: An optical character reader is provided, which comprises an input for allowing a plurality of commends to be input; a reading device for reading recorded data; a memory having a first region for storing read date, a second region for storing character data corresponding to the read data, and a third region for storing the character dates an output device for supplying at least one of the character data stored in the second region of the memory and the character data stored in the third region of the memory to the information processing device; and a data processor, when a memory command is input from the input, which stores the read data in the first region of the memory, converts the read data which is stored in the first region of the memory into character data, and stores the character data in the second region of the memory, and when a read command is input from the input, which transfers the character data stored in the second region of the memory to the third region.

Abstract: Cracks in solder connecting terminal leads of an IC to a circuit board are prevented by reducing the stress due to the difference in the coefficients of thermal expansion of a pair of IC packages mounted on opposite surfaces of a circuit board and the circuit board. In this invention, the position of an IC package mounted on the upper surface of a circuit board is spaced from the position of an IC package mounted on the lower surface of the circuit board. Alternatively, the IC packages are mounted on the upper and lower surfaces in directions which are substantially orthogonal. Alternatively, the IC packages are mounted such that the positions of lead portions of one of the upper IC packages are spaced from the positions of the lead portions of the other IC package by a distance which is at least 2.4 times the thickness of the circuit board.

Abstract: In a semiconductor pressure sensor, a dam which prevents a sheathing resin from flowing into a diaphragm portion during the molding of the sheathing resin is disposed on the outer periphery of piezoresistors and the diaphragm portion on the surface of a semiconductor pressure sensor chip. The volume of the base and that of the semiconductor pressure sensor chip are adjusted so that a tensile force exerted upon the semiconductor pressure sensor chip by the base cancels a compressive force exerted upon the semiconductor pressure sensor by the sheathing resin when the temperature of the semiconductor pressure sensor returns to an ordinary room temperature from a high temperature. As a result, strain is not caused in the semiconductor pressure sensor chip, and therefore measurements of pressure with a high degree of accuracy can be performed.

Abstract: A vacuum interface valve is used in a vacuum sewerage system in which sewage is transported under the influence of vacuum to a wastewater treatment station or a public main sewer. The vacuum interface valve includes a casing having an inlet, an outlet and a valve seat, a valve member which is linearly movable between a position engageable with the valve seat and a position away from the valve seat, an element for urging the valve member into engagement with the valve seat, and a vacuum device for lifting the valve member under the action of a vacuum to cause the valve member to disengage from the valve seat. The inner wall of the casing is bulged outwardly from the vicinity of the valve seat in a direction substantially perpendicular to an axis of the valve member, and a space is defined in the vicinity of the valve seat in the casing so that foreign matters are not caught between the inner wall of the casing and the valve member.

Abstract: A semiconductor pressure sensor device that improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10.

Abstract: A semiconductor pressure sensor is manufactured by integrally encapsulating a semiconductor pressure, sensor chip, a pedestal, leads, wires and a die pad in an outer package except for the surface of a diaphragm of the semiconductor pressure sensor chip and the reverse side of the die pad. The ratio of the thickness of the pedestal to the thickness of the semiconductor pressure sensor chip is 7.5 or less, while the ratio of the diameter of an opening formed in the outer package at the surface of the diaphragm and the diameter of the diaphragm is 1 or more. The thermal stress generated in the semiconductor pressure sensor chip can freely be reduced to a desired value, and a semiconductor pressure sensor exhibiting a desired accuracy can therefore be obtained. Furthermore, since the semiconductor pressure sensor can be manufactured by an ordinary IC manufacturing process, a semiconductor pressure sensor with reduced cost and having high quality can be produced.

Abstract: A semiconductor pressure sensor device that can improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10.

Abstract: A lead frame of a package cast from mold resin is composed of a die bond pad section on which a semiconductor chip is placed and connected to a plurality of leads placed around the die bond pad section. The die bond pad section is formed of a length of an elongated material of a reduced width, i.e., having a line-like form disposed as a pattern in the form of a Peano curve. The die bond pad section has one or a plurality of such supporting sections integrally connected to and supported by one or more extension lead or leads. The die bond pad section formed by the elongated material has a low stiffness, and thus serves to prevent cracks from being formed in the package or in the semiconductor ship due to thermal contraction effects.

Abstract: A focus detecting apparatus for a camera, includes first and second light-receiving units, and a correlation detecting unit. The first and second light-receiving units receive first and second images formed by light bundle received from an object to be photographed through first and second portions of a photographing lens divided by a face including an optical axis thereof, and output image signals corresponding to light distribution patterns of the images, respectively. The correlation detecting unit detects portions having the highest correlation degree of the two images in accordance with the image signals. The focus detecting apparatus for a camera performs focus detection of the photographing lens on the basis of a detection result of the correlation detecting unit. The correlation detecting unit detects the portions having the highest correlation degree using at least two different methods.

Abstract: A process for electrolytically treating a radioactive liquid waste includes electrolyzing a radioactive liquid waste containing sodium compounds using mercury as a cathode in an electrolytic cell, separating the liquid waste into an amalgam of metals, inclusive of sodium, and residue, separating the metals including the sodium from the amalgam, purifying and reutilizing the metals, and recycling the mercury in the electrolytic cell.

Abstract: A method of treatment of a radioactive liquid waste containing fission products and a thermally decomposable sodium compound which comprises heating the liquid waste to convert the sodium compound into oxides of sodium, converting the oxides into sodium, hydroxide, reacting the sodium hydroxide with an alcohol to form a sodium alcoholate, separating the sodium alcoholate from an impurity residue essentially comprising fission products, decomposing the separated sodium alcoholate to form sodium hydroxide and recovering the sodium hydroxide.

Abstract: According to the invention, a distance measurement apparatus for a camera is disclosed. In this apparatus, a plurality of light-emitting elements are arranged at different positions in a direction perpendicular to a base line and an optical axis of projected light. A driver causes the light-emitting elements to selectively emit near-distance measurement light and far-distance measurement light having a higher intensity than that of the near-distance measurement light. When an amount of light reflected by an object cannot reach a predetermined value necessary for distance measurement upon emission of a light-emitting element selected by the driver, a microcomputer controls an operation of the driver so as to cause another light-emitting element to emit light. The near- or far-distance measurement light reflected by the object is received so as to measure a distance to the object.

Abstract: A transaction system comprises a plurality of transaction machines capable of accepting deposits and paying out bills and a bill supplying/retrieving device which operates in conjunction with the transaction machines for supplying and retrieving bills to and from the transaction machines wherein the bill supplying/retrieving device is movable by a driving device.