Abstract: The present invention provides a photocurable composition containing an ultraviolet absorber, which has high photocurability and yields a cured material having a high cutting capacity against ultraviolet rays from the outside, a low yellow index, and colorlessness and transparency. The present invention relates to a sheet-shaped photocurable composition which includes the following components (A) to (D), and when a cured material obtained after photocuring the photocurable composition has a thickness of 150 ?m, a yellow index of the cured material is 4.0 or less and a light transmittance of the cured material at a wavelength of 385 nm is 5.0% or less: a component (A): a (meth)acrylate compound, a component (B): a film forming resin, a component (C): a photoinitiator, and a component (D): an ultraviolet absorber.

Abstract: One embodiment of the present invention aims to provide a photocurable sheet-shaped sealing agent having adherence to an electrolyte membrane and a hydrogen gas barrier. A photocurable sheet-shaped sealing agent for fuel cell, comprising a component (A): urethane (meth)acrylate, a component (B): a phenoxy resin, and a component (C): a photopolymerization initiator.

Abstract: Conventionally, a photocurable composition to which an ultraviolet absorber is added is difficult to form a colorless and transparent cured resin because the ultraviolet absorber itself is colored, and thus the photocurable composition is hardly to be used in a display apparatus required for colorlessness and transparency. Provided is a photocurable composition including a specific compound, wherein a light transmittance of 385 nm is 50% or less and a yellowness index is 3.0 or less in a state in which a cured resin having a thickness of 200 ?m or less is interposed between alkali free glass plates each having a thickness of 0.7 mm.

Abstract: The present invention makes it possible to maintain a high 180-degree peel strength of a photocurable composition having a film shape at 25° C. in the state of not being cured against untreated PET as an adherend when bonding is performed by lamination at normal temperature. A photocurable composition having a film shape at 25° C. in a state of not being cured, which contains the following components (A) to (C) and in which the photocurable composition contains 1 to 45 parts by mass of the component (B) with respect to 100 parts by mass of the component (A), a temperature of tan ?=1 is 30° C. to 60° C. before curing, a storage elastic modulus at 25° C. is 10.0×105 Pa or less after curing.

Abstract: The present invention makes it possible to maintain a high 180-degree peel strength of a photocurable composition having a film shape at 25° C. in the state of not being cured against untreated PET as an adherend when bonding is performed by lamination at normal temperature. A photocurable composition having a film shape at 25° C. in a state of not being cured, which contains the following components (A) to (C) and in which the photocurable composition contains 1 to 45 parts by mass of the component (B) with respect to 100 parts by mass of the component (A), a temperature of tan ?=1 is 30° C. to 60° C. before curing, a storage elastic modulus at 25° C. is 10.0×105 Pa or less after curing.

Abstract: The present invention provides a photocurable composition containing an ultraviolet absorber, which has high photocurability and yields a cured material having a high cutting capacity against ultraviolet rays from the outside, a low yellow index, and colorlessness and transparency. The present invention relates to a sheet-shaped photocurable composition which includes the following components (A) to (D), and when a cured material obtained after photocuring the photocurable composition has a thickness of 150 ?m, a yellow index of the cured material is 4.0 or less and a light transmittance of the cured material at a wavelength of 385 nm is 5.0% or less: a component (A): a (meth)acrylate compound, a component (B): a film forming resin, a component (C): a photoinitiator, and a component (D): an ultraviolet absorber.

Abstract: The present invention provides a photocurable composition containing an ultraviolet absorber, which yields a cured material thereof having a high cutting capability against ultraviolet rays from the outside, a low yellow index, and colorlessness and transparency, both immediately after preparing the same and after a lapse of time of being left in a severe environment such as a high-temperature and high-humidity environment, an environment exposed to water or light, and the like. The present invention relates to a sheet-shaped photocurable composition including the following components (A) to (E): a component (A): a (meth)acrylate compound; a component (B): a film forming resin; a component (C): a photoinitiator; a component (D): a compound having a specific skeleton structure; a component (E): a compound having a specific group in the molecule.

Abstract: Conventionally, a photocurable composition to which an ultraviolet absorber is added is difficult to form a colorless and transparent cured resin because the ultraviolet absorber itself is colored, and thus the photocurable composition is hardly to be used in a display apparatus required for colorlessness and transparency. Provided is a photocurable composition including a specific compound, wherein a light transmittance of 385 nm is 50% or less and a yellowness index is 3.0 or less in a state in which a cured resin having a thickness of 200 ?m or less is interposed between alkali free glass plates each having a thickness of 0.7 mm.

Abstract: It has conventionally been difficult to achieve a sheet adhesive which adheres in a low temperature (from 20 to 90° C.), and has both of softness and high adhering strength. The present invention realizes a sheet adhesive capable of adhering in a low temperature (from 20 to 90° C.) which exhibits a high adhesiveness in spite of being a soft sheet of thin film, by forming a simulated multiple layer by using an elastomer as a substrate layer, and by forming a reactive layer by means of spraying or application. A sheet adhesive including a substrate layer and a reactive layer, wherein the substrate layer includes a component (A) and a component (B) below, and the reactive layer is formed with a liquid agent including a component (C) below in an amount of from 0.01% by mass to 45% by mass, component (A): a urethane elastomer, component (B): an epoxy resin, component (C): an amine compound and/or phenol compound.

Abstract: It has conventionally been difficult to achieve a sheet adhesive which adheres in a low temperature (from 20 to 90° C.), and has both of softness and high adhering strength. The present invention realizes a sheet adhesive capable of adhering in a low temperature (from 20 to 90° C.) which exhibits a high adhesiveness in spite of being a soft sheet of thin film, by forming a simulated multiple layer by using an elastomer as a substrate layer, and by forming a reactive layer by means of spraying or application. A sheet adhesive including a substrate layer and a reactive layer, wherein the substrate layer includes a component (A) and a component (B) below, and the reactive layer is formed with a liquid agent including a component (C) below in an amount of from 0.014 by mass to 45% by mass, component (A): a urethane elastomer, component (B): an epoxy resin, component (C): an amine compound and/or phenol compound.

Abstract: Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.

Abstract: An object of the present invention is to provide a photocurable sheet-type adhesive composition for optical use, which is used for bonding cover glass and a touch panel, a touch panel and a display module, or the like, and has high appearance reliability and storage stability even under high temperature and high humidity. The present invention is a photocurable sheet-shape adhesive for optical use, which contains the following components (A) to (D): (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight average molecular weight of 20,000 to 100,000; (B) 3 to 70 parts by mass of a phenoxy resin having a glass transition temperature of 50 to 120° C.; (C) 0.1 to 10 parts by mass of a photopolymerization initiator; and (D) 1 to 50 parts by mass of a (meth)acrylate monomer which has 8 to 30 repeated blocks having an ether linkage in the molecule and containing at least one (meth)acryloyl group in the molecule.

Abstract: A heat curable sheet-like adhesive for an organic EL panel, comprising components (A) to (C), which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.: the component (A): a film forming component having an epoxy equivalent of 7000 to 20000 g/eq and having compatibility with the component (B); the component (B): an epoxy resin having an epoxy equivalent of 150 to 5000 g/eq and comprising 0 to 20% by weight of a solid epoxy resin at 25° C. with respect to the whole of the component (B); and the component (C): an encapsulated epoxy adduct-type latent curing agent.

Abstract: Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.

Abstract: [Problem] A conventional sheet-like adhesive has low adhesion to an adherend and, at the same time, is required to be heated at a high temperature of 100° C. or higher when adhered to an adherend, and hence, when an adherend is an electronic part with deterioration by a high temperature, damage to the adherend is large. In addition, since a sheet-like adhesive in the B-stage hardly exhibited flowability when heating, bubbles may be remained when there is unevenness on an adherend. [Solution] A heat curable sheet-like adhesive for an organic EL panel, comprising components (A) to (C), which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.: the component (A): a film forming component having an epoxy equivalent of 7000 to 20000 g/eq and having compatibility with the component (B); the component (B): an epoxy resin having an epoxy equivalent of 150 to 5000 g/eq and comprising 0 to 20% by weight of a solid epoxy resin at 25° C.

Abstract: An object of the present invention is to provide a photocurable sheet-type adhesive composition for optical use, which is used for bonding cover glass and a touch panel, a touch panel and a display module, or the like, and has high appearance reliability and storage stability even under high temperature and high humidity. The present invention is a photocurable sheet-shape adhesive for optical use, which contains the following components (A) to (D): (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight average molecular weight of 20,000 to 100,000; (B) 3 to 70 parts by mass of a phenoxy resin having a glass transition temperature of 50 to 120° C.; (C) 0.1 to 10 parts by mass of a photopolymerization initiator; and (D) 1 to 50 parts by mass of a (meth)acrylate monomer which has 8 to 30 repeated blocks having an ether linkage in the molecule and containing at least one (meth)acryloyl group in the molecule.

Abstract: A photocurable resin composition for sealing an organic EL device is provided, which can seal the organic EL device without exerting any bad influence on the device, thereby suppress the formation and growth of dark spots positively, and which can ensure a high transmittance of light, thereby maintain a stable light emitting characteristic over a long period of time. The composition comprises (A) an epoxy resin containing at least two glycidyl groups in each molecule thereof and having a molecular weight of 200 to 7000, (B) an epoxy resin containing at least one glycidyl group in each molecule thereof and having a molecular weight of 20000 to 100000, (C) a latent acid photo catalyst adapted to be activated and produce an acid upon being irradiated with energy beam, and (D) a silane coupling agent containing a glycidyl group in each molecule thereof, the composition exhibiting non-fluidity at 25° C., but exhibiting fluidity in a temperature range of 50° to 100° C.

Abstract: The present invention provides a sealing member for organic EL elements that enables organic EL elements, in particular, organic EL elements for illumination devices to maintain stable luminescence over a long period and that can be fabricated at reduced cost. The sealing member for organic EL elements of the present invention includes a barrier film including a plastic film and at least one thin metal layer, and a curable resin composition layer on the barrier film. The curable resin composition layer has a thickness of 5 to 100 ?m and the curable resin composition exhibits nonfluidity at 25° C. in an uncured state and gains fluidity at an elevated temperature in the range of 40 to 80° C.

Abstract: The present invention provides a sealing member for organic EL elements that enables organic EL elements, in particular, organic EL elements for illumination devices to maintain stable luminescence over a long period and that can be fabricated at reduced cost. The sealing member for organic EL elements of the present invention includes a barrier film including a plastic film and at least one thin metal layer, and a curable resin composition layer on the barrier film. The curable resin composition layer has a thickness of 5 to 100 ?m and the curable resin composition exhibits nonfluidity at 25° C. in an uncured state and gains fluidity at an elevated temperature in the range of 40 to 80° C.

Abstract: Provided is a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the present invention comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.