Abstract: A leadframe for semiconductor devices is disclosed. The leadframe includes a die pad supported on the leadframe. A semiconductor chip is mounted on the die pad. The chip has a plurality of pads including at least one group of designated pads for communicating an identical signal, such as a power supply signal of the same level, with external circuits. A terminal on the leadframe is coupled to the group of designated pads. The terminal is attached to selected one or more leads on the leadframe for communicating the identical signal with the external circuits. The other pads on the chip, such as signal pads, are coupled to the corresponding leads on the leadframe. Thus, the total number of leads on the leadframe is reduced and more leads are available for the signal pads, resulting in efficient connections between the chip pads and the leads.