Abstract: A voltage regulator includes an operational amplifier, a first transistor, a second transistor, a capacitor and a current sink circuit. The operational amplifier outputs a control voltage according to an amplified differential voltage between a first input terminal and a second input terminal of the operational amplifier. The first transistor includes a control terminal receiving the control voltage, a first terminal coupled to a supply terminal, a second terminal providing an output voltage, and a bulk terminal. The second transistor includes a second terminal coupled to the bulk terminal of the first transistor, and a bulk terminal coupled to the supply terminal. The capacitor includes a first terminal coupled to the bulk terminal of the first transistor, and a second terminal receiving the output voltage. The current sink circuit generates a feedback voltage according to the output voltage and output the feedback voltage to the operational amplifier.

Abstract: A voltage regulator includes an operational amplifier, a first transistor, a second transistor, a capacitor and a current sink circuit. The operational amplifier outputs a control voltage according to an amplified differential voltage between a first input terminal and a second input terminal of the operational amplifier. The first transistor includes a control terminal receiving the control voltage, a first terminal coupled to a supply terminal, a second terminal providing an output voltage, and a bulk terminal. The second transistor includes a second terminal coupled to the bulk terminal of the first transistor, and a bulk terminal coupled to the supply terminal. The capacitor includes a first terminal coupled to the bulk terminal of the first transistor, and a second terminal receiving the output voltage. The current sink circuit generates a feedback voltage according to the output voltage and output the feedback voltage to the operational amplifier.

Abstract: A crystal oscillator start-up circuit capable of reducing a start-up time of a crystal oscillator is disclosed. The crystal oscillator start-up circuit is provided with a crystal oscillation unit including a crystal oscillator, a converter and an external oscillator. The crystal oscillation unit generates an output signal corresponding to the impedance characteristic of the crystal oscillator. The converter converts the output signal of the crystal oscillation unit to a voltage signal. The external oscillator outputs to the crystal oscillation unit an oscillation signal whose frequency is adjusted by the voltage signal to approach a resonance frequency of the crystal oscillator.

Abstract: A crystal oscillator start-up circuit capable of reducing a start-up time of a crystal oscillator is disclosed. The crystal oscillator start-up circuit is provided with a crystal oscillation unit including a crystal oscillator, a converter and an external oscillator. The crystal oscillation unit generates an output signal corresponding to the impedance characteristic of the crystal oscillator. The converter converts the output signal of the crystal oscillation unit to a voltage signal. The external oscillator outputs to the crystal oscillation unit an oscillation signal whose frequency is adjusted by the voltage signal to approach a resonance frequency of the crystal oscillator.

Abstract: A transmission circuit includes a first path that connects a first terminal for inputting or outputting signals, and one of a pair of second terminals for outputting or inputting the signals; a second path that connects the first terminal and another one of the pair of second terminals; a first circuit including a first capacitor that is serially inserted in the first path, which is configured to perform single-differential conversion on signals transmitted through the first path, to perform impedance matching, and to supply a bias voltage; a second circuit including a first inductor that is serially inserted in the second path, which is configured to perform single-differential conversion on signals transmitted through the second path, to perform impedance matching, and to supply a bias voltage; and a switch that is connected between the two terminals of the pair of second terminals.

Abstract: A transmission circuit includes a first path that connects a first terminal for inputting or outputting signals, and one of a pair of second terminals for outputting or inputting the signals; a second path that connects the first terminal and another one of the pair of second terminals; a first circuit including a first capacitor that is serially inserted in the first path, which is configured to perform single-differential conversion on signals transmitted through the first path, to perform impedance matching, and to supply a bias voltage; a second circuit including a first inductor that is serially inserted in the second path, which is configured to perform single-differential conversion on signals transmitted through the second path, to perform impedance matching, and to supply a bias voltage; and a switch that is connected between the two terminals of the pair of second terminals.

Abstract: A DC-DC converter control circuit includes: a slope signal generation circuit that generates a reference voltage by superimposing a slope voltage onto a standard voltage; a comparator that performs comparison of the reference voltage with an output voltage and generates a signal according to a result of the comparison; an oscillator that generates a pulse signal with a substantially constant cycle; and a control signal generation circuit that generates a control signal that turns on a switch based on a comparator output signal and turns off the switch based on the pulse signal.

Abstract: A power supply includes a first switch and a second switch coupled in series between an input voltage terminal to which an input voltage is applied and a reference voltage terminal to which a reference voltage lower than the input voltage is applied, an inductor disposed between a junction coupling the first and second switches and an output terminal from which an output voltage is output, and a controller controlling the first and second switches to be alternately switched at a given switching cycle depending on an error of the output voltage with respect to a target voltage, wherein the controller changes the switching cycle from a first cycle to a second cycle longer than the first cycle, depending on a voltage at the junction when the second switch is in a turned-on state.

Abstract: A power supply includes a first switch and a second switch coupled in series between an input voltage terminal to which an input voltage is applied and a reference voltage terminal to which a reference voltage lower than the input voltage is applied, an inductor disposed between a junction coupling the first and second switches and an output terminal from which an output voltage is output, and a controller controlling the first and second switches to be alternately switched at a given switching cycle depending on an error of the output voltage with respect to a target voltage, wherein the controller changes the switching cycle from a first cycle to a second cycle longer than the first cycle, depending on a voltage at the junction when the second switch is in a turned-on state.

Abstract: A DC-DC converter control circuit includes: a slope signal generation circuit that generates a reference voltage by superimposing a slope voltage onto a standard voltage; a comparator that performs comparison of the reference voltage with an output voltage and generates a signal according to a result of the comparison; an oscillator that generates a pulse signal with a substantially constant cycle; and a control signal generation circuit that generates a control signal that turns on a switch based on a comparator output signal and turns off the switch based on the pulse signal.

Abstract: An electronic heat pump device has an emitter and a collector, stems supporting these components, a spacing retention member for keeping a spacing between the stems constant, and a sealing member for maintaining a vacuum between the stems. The emitter has a first semiconductor substrate and an emitter electrode, while the collector has a second semiconductor substrate and a collector electrode. The emitter electrode and the collector electrode are disposed so as to be opposed to each other with a space interposed therebetween. At least one of the first and second semiconductor substrates is integrally formed with electrically and thermally insulative spacers that keep the space between the emitter electrode and the collector electrode constant.

Abstract: There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically and thermally insulative spacer section 5 for keeping a space, i.e. vacuum gap G between an emitter electrode 11 and a collector electrode 21 constant is integrally formed in a semiconductor substrate 20 of the collector 2, which makes it possible to maintain the vacuum gap to be a specified space while a back flow of heat is prevented in a simple structure with a reduced number of component parts.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically and thermally insulative spacer section 5 for keeping a space, i.e. vacuum gap G between an emitter electrode 11 and a collector electrode 21 constant is integrally formed in a semiconductor substrate 20 of the collector 2, which makes it possible to maintain the vacuum gap to be a specified space while a back flow of heat is prevented in a simple structure with a reduced number of component parts.

Abstract: An electronic heat pump device has an emitter and a collector, stems supporting these components, a spacing retention member for keeping a spacing between the stems constant, and a sealing member for maintaining a vacuum between the stems. The emitter has a first semiconductor substrate and an emitter electrode, while the collector has a second semiconductor substrate and a collector electrode. The emitter electrode and the collector electrode are disposed so as to be opposed to each other with a space interposed therebetween. At least one of the first and second semiconductor substrates is integrally formed with electrically and thermally insulative spacers that keep the space between the emitter electrode and the collector electrode constant.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: An object of the invention is to raise and stabilize the efficiency of light transmission between a light-emitting device and a light-receiving device. A light-transmissive resin projection has a constant height over the extent from the light-emitting device to the light-receiving device and is shaped triangular in section. Since an outer package is white-colored, the interface between the light-transmissive resin projection and the outer package is also white-colored and, hence, the light reflectivity of the interface is high. Accordingly, light emitted from the light-emitting device is reflected at faces of the light-transmissive resin projection, gathered to the vertex portion, guided to the light-receiving device, and received by the light-receiving device. At this time, light is transmitted from the light-emitting device to the light-receiving device without being dispersed within the light-transmissive resin projection.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: An object of the invention is to raise and stabilize the efficiency of light transmission between a light-emitting device and a light-receiving device. A light-transmissive resin projection has a constant height over the extent from the light-emitting device to the light-receiving device and is shaped triangular in section. Since an outer package is white-colored, the interface between the light-transmissive resin projection and the outer package is also white-colored and, hence, the light reflectivity of the interface is high. Accordingly, light emitted from the light-emitting device is reflected at faces of the light-transmissive resin projection, gathered to the vertex portion, guided to the light-receiving device, and received by the light-receiving device. At this time, light is transmitted from the light-emitting device to the light-receiving device without being dispersed within the light-transmissive resin projection.