Patents by Inventor Yoshihiko Misawa
Yoshihiko Misawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8086338Abstract: A service providing method for monitoring a mounting tact of a component mounting apparatus includes collecting, from the service receiver, mounting tact information including a mounting tact result value of the component mounting apparatus from the service receiver by use of a service provider via a communication system. The method additionally includes judging whether a mounting operation of the component mounting apparatus has a tact loss corresponding to an amount by which a mounting tact is greater than a standard mounting tact as a result of analysis of the collected mounting tact information and determining and feeding back, to the service receiver via the communication system, NC data for allowing the component mounting apparatus to be operated.Type: GrantFiled: August 13, 2008Date of Patent: December 27, 2011Assignee: Panasonic CorporationInventors: Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa
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Patent number: 7885718Abstract: A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.Type: GrantFiled: April 9, 2009Date of Patent: February 8, 2011Assignee: Panasonic CorporationInventors: Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
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Publication number: 20090259333Abstract: A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.Type: ApplicationFiled: April 9, 2009Publication date: October 15, 2009Applicant: PANASONIC CORPORATIONInventors: Toshio YANO, Hiroshi OKAMURA, Yoshihiko MISAWA, Yoshinori ISOBATA, Ken TAKAHASHI, Masuo MASUI, Eigo SARASHINA, Akira IIZUKA
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Patent number: 7536236Abstract: A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.Type: GrantFiled: January 30, 2006Date of Patent: May 19, 2009Assignee: Panasonic CorporationInventors: Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
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Publication number: 20090043413Abstract: A service providing method for monitoring a mounting tact of a component mounting apparatus includes collecting, from the service receiver, mounting tact information including a mounting tact result value of the component mounting apparatus from the service receiver by use of a service provider via a communication system. The method additionally includes judging whether a mounting operation of the component mounting apparatus has a tact loss corresponding to an amount by which a mounting tact is greater than a standard mounting tact as a result of analysis of the collected mounting tact information and determining and feeding back, to the service receiver via the communication system, NC data for allowing the component mounting apparatus to be operated.Type: ApplicationFiled: August 13, 2008Publication date: February 12, 2009Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Toshio YANO, Hiroshi OKAMURA, Yoshihiko MISAWA
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Patent number: 7440812Abstract: A method for monitoring a mounting tact of a component mounting apparatus including a component supplier for supplying a component and a component holder for holding the component from the component supplying device and mounting the component onto a circuit board. The method includes collecting and monitoring a mounting tact result value of the component mounting apparatus during a mounting operation via a communication system. The method further includes calculating a tact loss corresponding to an amount by which the mounting tact result value is greater than a standard mounting tact and monitoring the calculated tact loss.Type: GrantFiled: January 30, 2006Date of Patent: October 21, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa
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Patent number: 7200922Abstract: A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.Type: GrantFiled: September 9, 2005Date of Patent: April 10, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Akira Kabeshita, Naoto Mimura, Noriaki Yoshida, Yoshihiko Misawa, Takeyuki Kawase, Tetsutarou Hachimura, Toshiro Nishiwaki, Taira Ishii, Mitsuo Kawate, Hideaki Watanabe
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Patent number: 7165318Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.Type: GrantFiled: March 8, 2005Date of Patent: January 23, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Youichi Nakamura, Kunio Sakurai, Kazumasa Okumura, Ken Takano, Minoru Yamamoto, Hirokazu Honkawa, Kentaro Nishiwaki, Yoshihiko Misawa
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Patent number: 7142939Abstract: A service receiving device is provided for in a production facility such as a component mounting apparatus. A service providing device is provided for on a manufacturer's side of the production facility. The service receiving device and service providing device are configured to communicate with each other through various communication systems including, for example, the Internet. The communication system can be operated by software to create and/or transmit service responses to problems or production matters, including productivity or quality of maintenance.Type: GrantFiled: January 10, 2002Date of Patent: November 28, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Nonaka, Hitoshi Nakamura, Yoshiyuki Hattori, Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
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Publication number: 20060136787Abstract: A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.Type: ApplicationFiled: January 30, 2006Publication date: June 22, 2006Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
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Publication number: 20060136786Abstract: A method for monitoring a mounting tact of a component mounting apparatus including a component supplier for supplying a component and a component holder for holding the component from the component supplying device and mounting the component onto a circuit board. The method includes collecting and monitoring a mounting tact result value of the component mounting apparatus during a mounting operation via a communication system. The method further includes calculating a tact loss corresponding to an amount by which the mounting tact result value is greater than a standard mounting tact and monitoring the calculated tact loss.Type: ApplicationFiled: January 30, 2006Publication date: June 22, 2006Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Nonaka, Hitoshi Nakamura, Yoshiyuki Hattori, Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
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Patent number: 7048172Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.Type: GrantFiled: August 25, 2004Date of Patent: May 23, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideki Uchida, Kazuo Kido, Tomoyuki Nakano, Takeshi Kuribayashi, Yoshihiko Misawa
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Patent number: 7036213Abstract: A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.Type: GrantFiled: August 21, 2001Date of Patent: May 2, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Akira Kabeshita, Naoto Mimura, Noriaki Yoshida, Yoshihiko Misawa, Takeyuki Kawase, Tetsutarou Hachimura, Toshiro Nishiwaki, Taira Ishii, Mitsuo Kawate, Hideaki Watanabe
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Publication number: 20060000085Abstract: A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.Type: ApplicationFiled: September 9, 2005Publication date: January 5, 2006Inventors: Akira Kabeshita, Naoto Mimura, Noriaki Yoshida, Yoshihiko Misawa, Takeyuki Kawase, Tetsutarou Hachimura, Toshiro Nishiwaki, Taira Ishii, Mitsuo Kawate, Hideaki Watanabe
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Patent number: 6976304Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.Type: GrantFiled: July 24, 2002Date of Patent: December 20, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Youichi Nakamura, Kunio Sakurai, Kazumasa Okumura, Ken Takano, Minoru Yamamoto, Hirokazu Honkawa, Kentaro Nishiwaki, Yoshihiko Misawa
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Patent number: 6957759Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.Type: GrantFiled: August 25, 2004Date of Patent: October 25, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideki Uchida, Kazuo Kido, Tomoyuki Nakano, Takeshi Kuribayashi, Yoshihiko Misawa
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Publication number: 20050144779Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.Type: ApplicationFiled: March 8, 2005Publication date: July 7, 2005Inventors: Youichi Nakamura, Kunio Sakurai, Kazumasa Okumura, Ken Takano, Minoru Yamamoto, Hirokazu Honkawa, Kentaro Nishiwaki, Yoshihiko Misawa
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Publication number: 20050023681Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.Type: ApplicationFiled: August 25, 2004Publication date: February 3, 2005Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Hideki Uchida, Kazuo Kido, Tomoyuki Nakano, Takeshi Kuribayashi, Yoshihiko Misawa
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Publication number: 20050023326Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.Type: ApplicationFiled: August 25, 2004Publication date: February 3, 2005Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Hideki Uchida, Kazuo Kido, Tomoyuki Nakano, Takeshi Kuribayashi, Yoshihiko Misawa
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Publication number: 20050017052Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.Type: ApplicationFiled: August 25, 2004Publication date: January 27, 2005Applicant: Matsushita Electric Industrial Co,. Ltd.Inventors: Hideki Uchida, Kazuo Kido, Tomoyuki Nakano, Takeshi Kuribayashi, Yoshihiko Misawa