Abstract: Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.

Abstract: Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.

Abstract: Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.

Abstract: A printed wiring board 1 for high frequency transmission according to an embodiment of the present invention includes: an insulating base material 10; a signal line 21 extending in a longitudinal direction of the insulating base material 10; ground wirings 31, 32 extending in the longitudinal direction while being spaced apart from the signal line 21 by a predetermined distance; a ground layer 40 formed on a major surface 10b; a plurality of ground connection vias 51 electrically connecting the ground wiring 31 and the ground layer 40; and a plurality of ground connection vias 52 electrically connecting the ground wiring 32 and the ground layer 40. A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90.

Abstract: Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.

Abstract: A printed wiring board 1 for high frequency transmission according to an embodiment of the present invention includes: an insulating base material 10; a signal line 21 extending in a longitudinal direction of the insulating base material 10; ground wirings 31, 32 extending in the longitudinal direction while being spaced apart from the signal line 21 by a predetermined distance; a ground layer 40 formed on a major surface 10b; a plurality of ground connection vias 51 electrically connecting the ground wiring 31 and the ground layer 40; and a plurality of ground connection vias 52 electrically connecting the ground wiring 32 and the ground layer 40. A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90.

Abstract: An exposure apparatus may include a first moving mechanism moving by driving a first drive source a first photomask; a second moving mechanism moving by driving a second drive source a second photomask; an imaging means for imaging a first alignment mark formed on the first photomask and a substrate side mark formed on the substrate and imaging a second alignment mark formed on the first photomask and a third alignment mark formed on the second photomask; and a control unit, wherein the control unit controls the first drive source so that alignment between the first alignment mark and the substrate side mark is performed based on results of imaging these marks, and the control unit controls the second drive source so that alignment between the second alignment mark and the third alignment mark is performed based on results of imaging these marks.

Abstract: There is provided a photomask capable of improving alignment accuracy with respective photomasks disposed on the front and rear faces of a substrate. A photomask has a drawing pattern for exposure formed on one face opposing a substrate, a first alignment mark for alignment with a substrate side mark formed on the substrate, the first alignment mark being provided in a region of the one face, the region opposing the substrate when the substrate is retained and the drawing pattern is not formed in the region, and a second alignment mark for alignment with a third alignment mark provided on another photomask, the second alignment mark being provided in a region which does not oppose the substrate when the substrate is retained.

Abstract: There is provided a laser processing method of forming via holes 23 and 24 by removing processed layers including a flexible insulating base member 1, in which conformal masks 7 and 8a are provided on the surface, and an adhesive layer 12 having a higher absorbance in a wavelength area of processing laser and a lower decomposition temperature than the insulating base member 1, the method including radiating one shot of pulse light having a first energy density that can remove the insulating base member 1 by one shot without causing the deformation and penetration of a conducting film 2A, and subsequently radiating pulse light having a second energy density that is lower than the first energy density and can remove the rest of the processed layers by a predetermined number of shots without causing the deformation and penetration of the conducting film 2A.

Abstract: There is provided a photomask capable of improving alignment accuracy with respective photomasks disposed on the front and rear faces of a substrate. A photomask has a drawing pattern for exposure formed on one face opposing a substrate, a first alignment mark for alignment with a substrate side mark formed on the substrate, the first alignment mark being provided in a region of the one face, the region opposing the substrate when the substrate is retained and the drawing pattern is not formed in the region, and a second alignment mark for alignment with a third alignment mark provided on another photomask, the second alignment mark being provided in a region which does not oppose the substrate when the substrate is retained.

Abstract: There is provided a photomask capable of improving alignment accuracy with respective photomasks disposed on the front and rear faces of a substrate. A photomask has a drawing pattern for exposure formed on one face opposing a substrate, a first alignment mark for alignment with a substrate side mark formed on the substrate, the first alignment mark being provided in a region of the one face, the region opposing the substrate when the substrate is retained and the drawing pattern is not formed in the region, and a second alignment mark for alignment with a third alignment mark provided on another photomask, the second alignment mark being provided in a region which does not oppose the substrate when the substrate is retained.

Abstract: There is provided a laser processing method of forming via holes 23 and 24 by removing processed layers including a flexible insulating base member 1, in which conformal masks 7 and 8a are provided on the surface, and an adhesive layer 12 having a higher absorbance in a wavelength area of processing laser and a lower decomposition temperature than the insulating base member 1, the method including radiating one shot of pulse light having a first energy density that can remove the insulating base member 1 by one shot without causing the deformation and penetration of a conducting film 2A, and subsequently radiating pulse light having a second energy density that is lower than the first energy density and can remove the rest of the processed layers by a predetermined number of shots without causing the deformation and penetration of the conducting film 2A.