Abstract: An electronic device that includes: a housing; an electronic component; and a double-sided tape interposed between the housing and the electronic component and attaching the electronic component to the housing, wherein the double-sided tape has at least one cut extending from an outer peripheral edge to an inner portion of the double-sided tape in a plan view of the double-sided tape.

Abstract: A substrate that includes a film-shaped member that has a first main surface and a second main surface; a first electrode that has a third main surface and a fourth main surface, the third main surface facing the second main surface of the film-shaped member, the first electrode having a first patterning region with a first part where the film-shaped member is exposed from the first electrode and a second part where the film-shaped member is not exposed from the first electrode; and an adhesive tape facing the fourth main surface of the first electrode and the second main surface of the film-shaped member such that the adhesive tape is disposed across the first part and the second part in the first patterning region.

Abstract: A grip detection sensor that includes: a piezoelectric film having a first main surface and a second main surface, either one of the first main surface and the second main surface being disposed at least partly on a periphery of a linearly shaped flexible object, a first electrode on the first main surface, a second electrode on the second main surface, and a spacer configured to maintain a space between the object and the piezoelectric film.

Abstract: An electronic device is provided that includes a first display unit including a first display; a second display unit including a second display disposed on a side of the first display and being rotatable with respect to the first display unit about a rotation axis extending in a front-rear direction such that an angle formed by the first and displays change; an angle and angular velocity acquisition unit that acquires the angle formed by the first and second displays and angular velocity of the angle; and a control unit that, when a user rotates the second display unit with respect to the first display unit, determines whether a horizontal direction of a video to be displayed on the first and second displays is made to match a vertical direction or a left-right direction based on the angle and the angular velocity acquired by the acquisition unit.

Abstract: A grip detection sensor that includes: a piezoelectric film having a first main surface and a second main surface, either one of the first main surface and the second main surface being disposed at least partly on a periphery of a linearly shaped flexible object, a first electrode on the first main surface, a second electrode on the second main surface, and a spacer configured to maintain a space between the object and the piezoelectric film.

Abstract: A surface mountable device includes a ceramic substrate including a first principal surface, a second principal surface, and a side surface connecting the first principal surface to the second principal surface, a terminal electrode disposed on the first principal surface, and a first conductor for appearance inspection extending continuously from the terminal electrode to the side surface and having a width smaller than the width of the terminal electrode.

Abstract: Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor.

Abstract: In a multilayer ceramic electronic component, a ferrite ceramic material defining a base layer includes bismuth. Meanwhile, surface layers arranged on main surfaces of the base layer have a composition that is substantially free from bismuth. The surface layers have a zinc content greater than that of the base layer. This results in satisfactory sinterability even when bismuth is included in the surface layers.

Abstract: Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor.

Abstract: In a multilayer ceramic electronic component, a ceramic laminate is defined by a ceramic base layer and ceramic auxiliary layers arranged on both main surfaces of the ceramic base layer, the ceramic base layer and the ceramic auxiliary layers being co-fired. The ceramic base layer and the ceramic auxiliary layers are made of ferrite materials having substantially the same compositional system and have substantially the same crystal structure. The linear expansion coefficient of the ceramic auxiliary layers is less than the linear expansion coefficient of the ceramic base layer.

Abstract: A manufacturing method of a stacked module includes a step of fabricating the first wiring board which includes a wiring pattern provided on at least one of a surface and an inner portion and a bump electrode which is integrated from the simultaneous sintering with the wiring pattern, and which extends in the vertical direction, a step of layering the first wiring board with the second wiring board having the wiring pattern provided on at least one of the surface and the inner portion thereof to be connected to the second wiring board via the bump electrode.

Abstract: Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor.

Abstract: An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin is then hardened. This causes a gap to be disposed between the hardened resin and the element surface of the base, such that a cover supported by some of the elements is formed.

Abstract: A ceramic multilayer substrate has a ceramic laminate including a plurality of ceramic layers laminated, having a first main surface, and including internal circuit elements disposed in the inside, a resin layer having a bonding surface in contact with the first main surface of the ceramic laminate and a mounting surface opposite to the bonding surface, external electrodes, each disposed on the mounting surface of the resin layer and electrically connected to at least one of the internal circuit elements of the ceramic laminate, and a ground electrode, a dummy electrode, or capacitor electrodes disposed at an interface between the first main surface of the ceramic laminate and the bonding surface of the resin layer or in the inside of the resin layer.

Abstract: Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor.

Abstract: A module with a built-in component is produced by disposing a cavity on a mounting surface side of a ceramic multilayer substrate, storing a circuit component therein and, thereafter, performing resin molding. A second resin portion is disposed on the mounting surface side of the ceramic multilayer substrate so as to continuously cover a frame-shaped portion and a first resin portion molded. External terminal electrodes are disposed on an outer surface of the second resin portion.

Abstract: An electronic component includes a wiring board having a wiring pattern, a surface mount device mounted on an upper surface of the wiring board, and a cap arranged to cover the wiring board. The cap includes a top portion made of a flat ceramic member, and a leg portion made of a columnar member having a height similar to a height of the surface mount devices.

Abstract: In a multilayer ceramic electronic component, a ferrite ceramic material defining a base layer includes bismuth. Meanwhile, surface layers arranged on main surfaces of the base layer have a composition that is substantially free from bismuth. The surface layers have a zinc content greater than that of the base layer. This results in satisfactory sinterability even when bismuth is included in the surface layers.

Abstract: In a multilayer ceramic electronic component, a ceramic laminate is defined by a ceramic base layer and ceramic auxiliary layers arranged on both main surfaces of the ceramic base layer, the ceramic base layer and the ceramic auxiliary layers being co-fired. The ceramic base layer and the ceramic auxiliary layers are made of ferrite materials having substantially the same compositional system and have substantially the same crystal structure. The linear expansion coefficient of the ceramic auxiliary layers is less than the linear expansion coefficient of the ceramic base layer.

Abstract: A hybrid multilayer substrate includes a cavity in a laminate structure formed of a resin portion and a ceramic multilayer substrate, the resin portion has a protrusion portion, the ceramic multilayer substrate has a penetrating hole, and the cavity is formed by fitting the protrusion portion of the resin portion to an end portion of the penetrating hole of the ceramic multilayer substrate.