Abstract: A solid electrolytic capacitor includes a capacitor element and a plated layer. The capacitor element has a predetermined surface and outer peripheral surface other than the predetermined surface. The capacitor element includes an anode body, an anode lead wire and a cathode layer. The predetermined surface is perpendicular to a predetermined direction. The anode lead wire extends from the anode body along the predetermined direction through the predetermined surface. The cathode layer includes a solid electrolyte layer and forms the outer peripheral surface and a part of the predetermined surface. The plated layer completely covers the outer peripheral surface and the part of the predetermined surface.

Abstract: A method of forming a solid electrolytic capacitor includes forming an intermediate. The intermediate includes a capacitor element which includes an anode body, a dielectric layer formed on the anode body, a cathode layer formed on the dielectric layer and an anode lead wire extending from the anode body. The method further includes forming a plated layer on the cathode layer by soaking the intermediate into a plating solution to apply a voltage between the plating solution and the anode lead wire so that an electric potential of the plating solution is higher than another electric potential of the anode lead wire.

Abstract: A solid electrolytic capacitor includes a capacitor element and a plated layer. The capacitor element has a predetermined surface and outer peripheral surface other than the predetermined surface. The capacitor element includes an anode body, an anode lead wire and a cathode layer. The predetermined surface is perpendicular to a predetermined direction. The anode lead wire extends from the anode body along the predetermined direction through the predetermined surface. The cathode layer includes a solid electrolyte layer and forms the outer peripheral surface and a part of the predetermined surface. The plated layer completely covers the outer peripheral surface and the part of the predetermined surface.

Abstract: A solid electrolytic capacitor includes a package for a capacitor element including an anode lead portion and a cathode portion. The package includes an insulating resin member which is arranged to cover the capacitor element and which includes hole portions formed therethrough. An anode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the anode lead portion through the hole portion. A cathode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the cathode conducting portion through the hole portion.

Abstract: A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.

Abstract: A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof is disclosed. The printed circuit board manufacturing method includes the steps of: forming inner layer conductor circuits 32A on a core substrate 30; forming a recess part 31 on the core substrate 30; housing, in a recess part 31, a planar capacitor device 20 that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin 43 and conductor metal foil 44 to heat pressurize the same for forming a multi-layer plate; forming via holes 41A for electrically connecting an outer layer conductor circuit 42A to the electrodes 21,22 of the capacitor device 20; forming a conductor layer on them; and forming the outer layer conductor circuits 42A on the surfaces of the multi-layer plate.

Abstract: A solid electrolytic capacitor includes a package for a capacitor element including an anode lead portion and a cathode portion. The package includes an insulating resin member which is arranged to cover the capacitor element and which includes hole portions formed therethrough. An anode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the anode lead portion through the hole portion. A cathode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the cathode conducting portion through the hole portion.

Abstract: In an electronic circuit having an integrated circuit (110) having a power supply terminal, a noise filter disposed adjacent to the integrated circuit, and a printed board (101) having a pattern for supplying a power supply to the power supply terminals of the integrated circuit through the noise filter, the noise filter consists of a transmission line type noise filter (121–124) for removing noises having a wide frequency band.

Abstract: An external cathode terminal (16) is adhered to one surface of a capacitor element while a prepreg (25) is adhered to another surface of the capacitor element. A reinforcement plate (26) is adhered to the prepreg. Heat and pressure are applied to the external cathode terminal, the prepreg, and the reinforcement plate to elute thermosetting resin from the prepreg in the side of the capacitor element, thereby sealing the side of the capacitor element with eluted material (27A, 27B). Inasmuch as transfer molding is not used as exterior package, the element never deforms by injection pressure of resin. It is possible to thin by a thickness of exterior package resin. Inasmuch as eluted thermosetting resin does not include a mold release agent, it has good adhesion for the external cathode terminal.

Abstract: A solid electrolytic capacitor includes a package for a capacitor element including an anode lead portion and a cathode portion. The package includes an insulating resin member which is arranged to cover the capacitor element and which includes hole portions formed therethrough. An anode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the anode lead portion through the hole portion. A cathode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the cathode conducting portion through the hole portion.

Abstract: A transmission line type noise filter, which is connectable between a direct current power supply and an electrical load component to pass a coming DC current while attenuating a coming AC current, includes a first conductor, a dielectric layer, a second conductor as a cathode, a first anode (12), and a second anode. The first and the second conductors and the dielectric layer serve as a capacitance forming portion. The thickness of the first conductor is selected to substantially restrict temperature elevation of the first conductor, which is caused by DC direct current flowing in the first conductor.

Abstract: The electrolytic capacitor and the electric double-layer capacitor both have difficulties to satisfy recent demands that the capacitor should have lower resistance, larger capacitance and moreover smaller size and thinner film thickness, altogether. The present invention provides a wet electrolytic capacitor which comprises a porous anode substance wherein at least a surface of a porous material made of a powder of a valve metal is an oxide film of the valve metal, a cathode formed of either an active carbon layer or a porous material made of a powder of a valve metal and an acid electrolytic solution contained between the porous anode substance and the cathode electrode.

Abstract: In a laminated solid electrolytic capacitor including a plurality of solid electrolytic capacitor elements, first end regions of anode bodies of the solid electrolytic capacitor elements adjacent to each other are mechanically connected to each other through a spacer. First end surfaces of the anode bodies of the solid electrolytic capacitor elements adjacent to each other are electrically connected to each other through an electrically conductive member.

Abstract: In a stacked solid electrolytic capacitor or a stacked transmission line element, anode portions of adjacent elements are electrically and mechanically connected to each other by the use of connecting members each in the form of a conductive adhesive or solderable metal, via metal plates connected to the anode portions so as to sandwich therebetween the anode portions, respectively, from the upper and lower surfaces thereof. On the other hand, cathode portions of the adjacent elements are electrically and mechanically connected to each other by a conductive adhesive, or are electrically and mechanically connected to each other by the use of adhesive insulating sheets each having a hollowed portion and a conductive adhesive filled in the hollowed portions, or are adhered to each other by adhesive insulating sheets, then electrically connected to each other by a conductive adhesive applied onto side surfaces of the cathode portions.

Abstract: A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.

Abstract: In a solid electrolytic capacitor, a package comprises an insulating resin member which is arranged to cover the element. The insulating resin member has hole portions formed therethrough. The anode terminal comprises a metal-plating layer which is placed in the hole portion. The anode terminal is electrically connected to the anode lead portion through the hole portion. The cathode terminal comprises a metal-plating layer which is placed in the hole portion. The cathode terminal is electrically connecting to the cathode conducting portion through the hole portion.

Abstract: A noise filter (1) has a first impedance element (2) having an impedance value Z1, a second impedance element (3) having an impedance value Z2, a third impedance element (4) having an impedance value Z3, a first anode terminal (5), a second anode terminal (6), and a cathode terminal (7). Z1<Z2 and Z1<Z3 are satisfied. Both ends of a central conductor (2a) of the first impedance element (2) are connected to a first node (8) and a second node (9), respectively. Both ends of the second impedance element (3) are connected to the first node (8) and the first anode terminal (5), respectively. Both ends of the third impedance element (4) are connected to the second anode terminal (6) and the second node (9), respectively. The central conductor (2a) and a cathode conductor (2b) of the first impedance element (2) form a transmission line structure having the impedance value Z1. The cathode conductor (2b) is connected to the cathode terminal (7).

Abstract: The invention provides a solid electrolytic capacitor of a configuration having a metal plated layer in a cathode part in order to prevent a decrease in the conductivity by oxidation of a conductive polymer and to realize a high reliability. Also there is provided a configuration in which a cathode part of the solid electrolytic capacitor includes a first metal plated layer and a solderable second metal layer.

Abstract: In a laminated solid electrolytic capacitor comprising a plurality of solid electrolytic capacitor elements, first end regions of anode bodies of the solid electrolytic capacitor elements adjacent to each other are mechanically connected to each other through a spacer. First end surfaces of the anode bodies of the solid electrolytic capacitor elements adjacent to each other are electrically connected to each other through an electrically conductive member.

Abstract: A transmission line type noise filter includes a metal fine wire (1) made of valve-operational metal and serving as a central conductor, a capacitance forming portion (3) formed over a predetermined length on the periphery of the metal fine wire, and a conductor layer (2) formed on the surface of the capacitance forming portion and serving as an external conductor. The capacitance forming portion (3) includes a sintered body (11) formed on the metal fine wire and made of the foregoing valve-operational metal, a dielectric film (31) formed on the surface of the sintered body and serving as a dielectric, and a solid electrolyte layer (23) formed on the surface of the dielectric film.