Patents by Inventor Yoshihiko Seino

Yoshihiko Seino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7389805
    Abstract: A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 that rotate about the rotational center 13 of the bonding arm 1 are attached to the bonding arm 1, and the rotating shaft parts 21 of circular arc form air bearings 20 that rotate about this rotational center 13 are provided so that the rotating shaft parts of the circular arc form air bearings 20 are rotatable as a unit with the rotating shaft parts 11 of the rotary motors 10.
    Type: Grant
    Filed: February 17, 2005
    Date of Patent: June 24, 2008
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Osamu Kakutani, Yutaka Kondo, Yoshihiko Seino
  • Patent number: 7306132
    Abstract: A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion is rotatably connected to the bonding head; and a hypothetical rotational center of capillary of the bonding arm is on a bonding surface and set to be the intersection of a line that connects upper and lower rotational centers of the front link and a line that connects upper and lower rotational centers of the rear link, wherein the immovable element of motor is fastened to the bonding head, and the rotational element of the motor is attached to the upper end of the rear link so that the rotational element rotates about the upper rotational center of the rear link.
    Type: Grant
    Filed: March 24, 2005
    Date of Patent: December 11, 2007
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Osamu Kakutani, Yutaka Kondo, Yoshihiko Seino
  • Publication number: 20050211746
    Abstract: A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion is rotatably connected to the bonding head; and a hypothetical rotational center of capillary of the bonding arm is on a bonding surface and set to be the intersection of a line that connects upper and lower rotational centers of the front link and a line that connects upper and lower rotational centers of the rear link, wherein the immovable element of motor is fastened to the bonding head, and the rotational element of the motor is attached to the upper end of the rear link so that the rotational element rotates about the upper rotational center of the rear link.
    Type: Application
    Filed: March 24, 2005
    Publication date: September 29, 2005
    Inventors: Osamu Kakutani, Yutaka Kondo, Yoshihiko Seino
  • Publication number: 20050184127
    Abstract: A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 that rotate about the rotational center 13 of the bonding arm 1 are attached to the bonding arm 1, and the rotating shaft parts 21 of circular arc form air bearings 20 that rotate about this rotational center 13 are provided so that the rotating shaft parts of the circular arc form air bearings 20 are rotatable as a unit with the rotating shaft parts 11 of the rotary motors 10.
    Type: Application
    Filed: February 17, 2005
    Publication date: August 25, 2005
    Inventors: Osamu Kakutani, Yutaka Kondo, Yoshihiko Seino
  • Patent number: 6766936
    Abstract: A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions and connecting portions. The holding portions are provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and the connecting portions each connects the tip ends of two protruding holding portions to each other. The external force applied to one of the holding portions is thus dispersed in each of the respective holding portions connected by the connecting portions, deformation of the holding portions is prevented, and the respective holding portions can be formed extremely thin in the axial direction of the transducer main body.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: July 27, 2004
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Ryuichi Kyomasu, Osamu Kakutani, Yoshihiko Seino
  • Patent number: 6719183
    Abstract: A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and connecting portions each connecting the tip ends of two protruding holding portions to each other. The transducer main body, holding portions and connecting portions are integrally formed from a single material member.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: April 13, 2004
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Ryuichi Kyomasu, Yoshihiko Seino
  • Publication number: 20030047583
    Abstract: A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions and connecting portions. The holding portions are provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and the connecting portions each connects the tip ends of two protruding holding portions to each other. The external force applied to one of the holding portions is thus dispersed in each of the respective holding portions connected by the connecting portions, deformation of the holding portions is prevented, and the respective holding portions can be formed extremely thin in the axial direction of the transducer main body.
    Type: Application
    Filed: September 4, 2002
    Publication date: March 13, 2003
    Applicant: Kabushiki Kaisha Shinkawa
    Inventors: Ryuichi Kyomasu, Osamu Kakutani, Yoshihiko Seino
  • Publication number: 20030000994
    Abstract: A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and connecting portions each connecting the tip ends of two protruding holding portions to each other. The transducer main body, holding portions and connecting portions are integrally formed from a single material member.
    Type: Application
    Filed: June 28, 2002
    Publication date: January 2, 2003
    Applicant: Kabushiki Kaisha Shinkawa
    Inventors: Ryuichi Kyomasu, Yoshihiko Seino